Abstract: A display device includes a pixel electrode, a pixel defining layer disposed on the pixel electrode and forming an opening which exposes a portion of the pixel electrode, an auxiliary electrode disposed on the pixel defining layer and the pixel electrode, an intermediate layer disposed on the pixel defining layer and the auxiliary electrode and a common electrode disposed on the intermediate layer. The pixel defining layer includes a recessed portion recessed into the pixel defining layer, the auxiliary electrode includes a first undercut forming portion disposed on the recessed portion and contacting the portion of the pixel electrode, and the intermediate layer includes a hole injection layer, a light-emitting layer and an electron injection layer stacked sequentially. The hole injection layer includes a first portion disposed on the first undercut forming portion and a second portion separated from the first portion and disposed on the recessed portion.

Abstract: The present invention provides a metal-plastic composite material having excellent adhesive strength and formability and a method for manufacturing the same, and specifically, the present invention provides a metal-plastic composite material and a method for manufacturing the same comprising: a metal layer; and a plastic layer on at least one surface of the metal layer, wherein a thin film layer formed of a silane coupling agent is provided between the metal layer and the plastic layer, and the metal layer and the plastic layer are bonded by covalent bonding with the silane coupling agent.

Abstract: A display device includes a pixel electrode, a pixel defining layer including an opening extending to a portion of the pixel electrode, a first auxiliary electrode on the portion of the pixel electrode to which the opening extends, a second auxiliary electrode on the first auxiliary electrode, an intermediate layer on the pixel defining layer and the second auxiliary electrode, and a common electrode on the intermediate layer. A side surface of the first auxiliary electrode is positioned inward of a side surface of the second auxiliary electrode within the opening of the pixel defining layer to form an undercut shape. A hole injection layer of the intermediate layer includes a first portion on a side surface of the pixel defining layer defining the opening of the pixel defining layer, and a second portion disconnected from the first portion and on the second auxiliary electrode.

Abstract: A display device includes a thin-film transistor, a source/drain electrode and an auxiliary electrode including a first conductive layer and a second conductive layer disposed on the first conductive layer, a via insulating layer having a first opening exposing the auxiliary electrode, a capping layer covering a portion of the auxiliary electrode and a light emitting material layer and a common electrode layer sequentially stacked on the via insulating layer and the capping layer, wherein the source/drain electrode is electrically connected to the thin-film transistor through a contact hole penetrating the interlayer insulating layer, the auxiliary electrode has an undercut, and the capping layer includes a first capping layer covering side surfaces of the first conductive layer of the auxiliary electrode and a second capping layer separated from the first capping layer and disposed on the second conductive layer of the auxiliary electrode.

Abstract: A semiconductor device and a method of manufacturing a semiconductor device, the device including gate structures on a substrate; source/drain layers on portions of the substrate that are adjacent the gate structures, respectively; first contact plugs contacting upper surfaces of the source/drain layers, respectively; a second contact plug contacting one of the gate structures, a sidewall of the second contact plug being covered by an insulating spacer; and a third contact plug commonly contacting an upper surface of at least one of the gate structures and at least one of the first contact plugs, at least a portion of a sidewall of the third contact plug not being covered by an insulating spacer.

Abstract: A coil component includes a body; first and second coil portions spaced apart from each other in the body; first and second external electrodes disposed on the body to be spaced apart from each other and connected to both ends of the first coil portion; and first and second ground electrodes spaced apart from each other on the body and connected to both ends of the second coil portion.

Abstract: Provided is an arch support insole to be inserted into a shoe. The insole should satisfy tasks for a wearer as follows: (1) improvement of wearing feeling by maximally reducing the thickness of the insole, (2) reduction of fatigue on walking by maximally preventing transmission of shocks, and (3) sufficient support of the arch of the wearer by maintaining an original shape of the arch support part. In addition, these tasks should be solved by a minimum number of manufacturing processes and minimum cost.

Abstract: The present invention relates to a CMP (chemical mechanical polishing) slurry composition and a method for planarizing a semiconductor device. The CMP composition comprises fumed silica, tetramethyl ammonium hydroxide, phosphates, fluorine compounds and deionized water. The method of planarizing comprises the steps of etching, subsequently laminating and polishing a semiconductor device by said CMP slurry composition.

Abstract: The present invention relates to a CMP (chemical mechanical polishing) slurry composition and a method for planarizing a semiconductor device. The CMP composition comprises fumed silica, tetramethyl ammonium hydroxide, phosphates, fluorine compounds and deionized water. The method of planarizing comprises the steps of etching, subsequently laminating and polishing a semiconductor device by said CMP slurry composition.