Patents by Inventor Hye Ah KIM

Hye Ah KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240108762
    Abstract: The present invention relates to a method for culturing a 3-dimensional lung cancer organoid and a method for preparing a patient-derived xenograft animal model using the same. More specifically, the present invention relates to a method for culturing a 3-dimensional lung cancer organoid, a lung cancer organoid prepared by the method, a medium composition for culturing the lung cancer organoid, a method for preparing a xenograft animal model using the lung cancer organoid, a patient-derived lung cancer organoid xenograft animal model prepared by the method, and a method for analyzing therapeutic efficacy of an anticancer agent and a method for screening an anticancer agent, using the animal model.
    Type: Application
    Filed: December 8, 2023
    Publication date: April 4, 2024
    Applicant: ONCOCLEW CO., LTD.
    Inventors: Se Jin JANG, Min Suh KIM, Young Ah SUH, Hye Min MUN, Ju Hee OH
  • Patent number: 9704640
    Abstract: There is provided a chip electronic component including; a magnetic body containing magnetic metal powder; an internal coil part embedded in the magnetic body; and a plating spreading prevention part coated on a surface of the magnetic body. The plating spreading prevention part contains phosphate-based glass. Whereby, plating spread generated in the surface of the chip electronic component at the time of forming the external electrodes may be prevented.
    Type: Grant
    Filed: May 6, 2015
    Date of Patent: July 11, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Youn Kyu Choi, Hye Ah Kim, Yun Young Yang, Mi Jung Kang, Jae Yeol Choi
  • Patent number: 9659704
    Abstract: A chip electronic component includes a magnetic body containing magnetic metal powder, internal coil parts embedded in the magnetic body, and an anti-plating layer disposed on at least one of upper and lower surfaces of the magnetic body. The anti-plating layer contains magnetic metal powder having particle sizes within the range of 0.1 ?m to 10 ?m.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: May 23, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yun Young Yang, Youn Kyu Choi, Hye Ah Kim, Do Won Kang, Mi Jung Kang
  • Publication number: 20160126004
    Abstract: A chip electronic component includes a magnetic body containing magnetic metal powder, internal coil parts embedded in the magnetic body, and an anti-plating layer disposed on at least one of upper and lower surfaces of the magnetic body. The anti-plating layer contains magnetic metal powder having particle sizes within the range of 0.1 ?m to 10 ?m.
    Type: Application
    Filed: October 16, 2015
    Publication date: May 5, 2016
    Inventors: Yun Young YANG, Youn Kyu CHOI, Hye Ah KIM, Do Won KANG, Mi Jung KANG
  • Publication number: 20160086716
    Abstract: There is provided a chip electronic component including; a magnetic body containing magnetic metal powder; an internal coil part embedded in the magnetic body; and a plating spreading prevention part coated on a surface of the magnetic body. The plating spreading prevention part contains phosphate-based glass. Whereby, plating spread generated in the surface of the chip electronic component at the time of forming the external electrodes may be prevented.
    Type: Application
    Filed: May 6, 2015
    Publication date: March 24, 2016
    Inventors: Youn Kyu CHOI, Hye Ah KIM, Yun Young YANG, Mi Jung KANG, Jae Yeol CHOI