Patents by Inventor Hye Hun Park
Hye Hun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240167711Abstract: The simulation system for predicting heating and cooling loads of a building comprises the collection unit collecting measurement data of a target building from a BEMS, the identification unit identifying indoor and outdoor temperature, humidity, and insolation measured in the building in real time based on RTS method, the correlation derivation unit deriving a correlation between energy usage based on the BEMS measurement data collected by the collection unit and the cooling and heating loads according to indoor and outdoor temperature, humidity, and insolation identified by the identification unit, the simulation unit predicting a change in cooling and heating loads according to a change in at least one of pieces of measurement data based on the correlation derived from the correlation derivation unit to perform a simulation, and the information provision unit providing a simulation result from the simulation unit in a visible form to a user terminal.Type: ApplicationFiled: September 19, 2023Publication date: May 23, 2024Inventors: Tae Dong LEE, Won Jang PARK, Min Ho CHOI, Soo Hyun YANG, Moo Kyung SEO, Han Sung CHOI, Hye Mi LIM, Ji Hun PARK, So Jeong PARK, Ki Bum HAN, Hyeong Jae JEON
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METHOD AND APPARATUS FOR PREDICTING RECIPE PROPERTY REFLECTING SIMILARITY BETWEEN CHEMICAL MATERIALS
Publication number: 20240135141Abstract: A method and apparatus for predicting a recipe property reflecting similarity between chemical materials are provided. The method of predicting a recipe property reflecting similarity between chemical materials, the method includes substituting a plurality of input materials with vector data, respectively, through material embedding and generating recipe data including pieces of vector data selected by considering a correlation between materials, and inputting the recipe data to an artificial neural network (ANN) prediction model and deriving a property prediction result on the recipe data from the ANN prediction model.Type: ApplicationFiled: September 26, 2023Publication date: April 25, 2024Inventors: HYE RIM BAE, han byeol Park, MINGYU PARK, DOHEE KIM, KI HUN KIM -
Publication number: 20240136632Abstract: A battery module has improved assemblability and safety. A battery module includes at least one battery cell, and a module frame including a plurality of unit frames that are inserted and coupled to each other, an inner space in which the cell assembly is accommodated, and a venting channel provided in an overlapping portion formed through the insertion.Type: ApplicationFiled: December 22, 2022Publication date: April 25, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Ju-Hun PARK, Jun-Yeob SEONG, Hye-Mi JUNG
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Publication number: 20240100779Abstract: Provided is a method for regenerating a tool path on the basis of output data feedback in order to improve 3D printing output reliability. A tool path regeneration system according to an embodiment of the present invention comprises: a slicing unit for configuring a process parameter for 3D printing and performing slicing for 3D model data on the basis of the configured process parameter to generate a job file; and an output unit for performing 3D printing on the basis of the generated job file and collecting output data that is output while the 3D printing is performed, wherein the slicing unit comprises an output data analysis module for performing monitoring on the basis of the output data received from the output unit and determining whether to correct the process parameter on the basis of the result of the monitoring.Type: ApplicationFiled: November 3, 2021Publication date: March 28, 2024Applicant: Korea Electronics Technology InstituteInventors: Hwa Seon SHIN, Sung Hun PARK, Hye In LEE, Sung Hwan CHUN
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Publication number: 20240029945Abstract: A coil component includes: a body; a coil disposed within the body; and an insulating film covering at least a portion of the coil in the body, wherein the insulating film includes a copolymer including a repeating unit derived from a monomer containing an unsaturated bond and a repeating unit derived from a parylene monomer.Type: ApplicationFiled: January 6, 2023Publication date: January 25, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Jae Hun Kim, Doo Ho Park, Hye Hun Park, In Young Kang, Ki Young Yoo, Boum Seock Kim
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Patent number: 11721485Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer. The conductive resin layer includes a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The metal having the lower melting point than the conductive metal is tin (Sn). The conductive metal of the conductive resin layer includes at least one of copper (Cu), nickel (Ni), silver (Ag), and silver-palladium (Ag—Pd).Type: GrantFiled: March 25, 2022Date of Patent: August 8, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Hun Park, Won Kuen Oh, Tae Gyeom Lee, Ji Hong Jo
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Patent number: 11676766Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.Type: GrantFiled: March 29, 2022Date of Patent: June 13, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Kuen Oh, Hye Hun Park, Tae Gyeom Lee
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Patent number: 11600442Abstract: A multilayer ceramic electronic component including: a ceramic body including a dielectric layer and first and second internal electrodes; a first external electrode including a first base electrode disposed to be in contact with the ceramic body and a first conductive layer disposed on the first base electrode; and a second external electrode including a second base electrode disposed to be in contact with the ceramic body and a second conductive layer disposed on the second base electrode, wherein the first conductive layer and the second conductive layer include silver (Ag) and palladium (Pd) and distribution positions of silver (Ag) and palladium (Pd) in central portions of the first conductive layer and the second conductive layer match at 95% or more according to a result of TEM mapping.Type: GrantFiled: September 14, 2021Date of Patent: March 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Kuen Oh, Hye Hun Park, Gyu Ho Yeon, Sung Hyun Kang
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Patent number: 11393629Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric and an internal electrode, an electrode layer electrically connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a graphene platelet, and a base resin.Type: GrantFiled: January 14, 2021Date of Patent: July 19, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Kuen Oh, Tae Gyeom Lee, Hang Kyu Cho, Hye Hun Park, Han Seong Jung
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Publication number: 20220223348Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.Type: ApplicationFiled: March 29, 2022Publication date: July 14, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Kuen Oh, Hye Hun Park, Tae Gyeom Lee
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Publication number: 20220223347Abstract: A multilayer ceramic electronic component includes a ceramic body having a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The conductive carbon is included in the conductive resin layer in an amount of 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.Type: ApplicationFiled: March 25, 2022Publication date: July 14, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Hun PARK, Won Kuen OH, Tae Gyeom LEE, Ji Hong JO
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Publication number: 20220208460Abstract: A multilayer ceramic electronic component including: a ceramic body including a dielectric layer and first and second internal electrodes; a first external electrode including a first base electrode disposed to be in contact with the ceramic body and a first conductive layer disposed on the first base electrode; and a second external electrode including a second base electrode disposed to be in contact with the ceramic body and a second conductive layer disposed on the second base electrode, wherein the first conductive layer and the second conductive layer include silver (Ag) and palladium (Pd) and distribution positions of silver (Ag) and palladium (Pd) in central portions of the first conductive layer and the second conductive layer match at 95% or more according to a result of TEM mapping.Type: ApplicationFiled: September 14, 2021Publication date: June 30, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Kuen OH, Hye Hun PARK, Gyu Ho YEON, Sung Hyun KANG
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Patent number: 11322305Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.Type: GrantFiled: January 31, 2020Date of Patent: May 3, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Kuen Oh, Hye Hun Park, Tae Gyeom Lee
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Patent number: 11315733Abstract: A multilayer ceramic electronic component includes a ceramic body having a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The conductive carbon is included in the conductive resin layer in an amount of 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.Type: GrantFiled: August 28, 2020Date of Patent: April 26, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Hun Park, Won Kuen Oh, Tae Gyeom Lee, Ji Hong Jo
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Publication number: 20210166879Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric and an internal electrode, an electrode layer electrically connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a graphene platelet, and a base resin.Type: ApplicationFiled: January 14, 2021Publication date: June 3, 2021Inventors: Won Kuen OH, Tae Gyeom LEE, Hang Kyu CHO, Hye Hun PARK, Han Seong JUNG
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Publication number: 20210090804Abstract: A multilayer ceramic electronic component includes a ceramic body having a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The conductive carbon is included in the conductive resin layer in an amount of 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.Type: ApplicationFiled: August 28, 2020Publication date: March 25, 2021Inventors: Hye Hun PARK, Won Kuen OH, Tae Gyeom LEE, Ji Hong JO
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Publication number: 20210065984Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.Type: ApplicationFiled: January 31, 2020Publication date: March 4, 2021Inventors: Won Kuen Oh, Hye Hun Park, Tae Gyeom Lee
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Patent number: 10923283Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric and an internal electrode, an electrode layer eletrically connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a graphene platelet, and a base resin.Type: GrantFiled: October 29, 2018Date of Patent: February 16, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Kuen Oh, Tae Gyeom Lee, Hang Kyu Cho, Hye Hun Park, Han Seong Jung
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Patent number: 10734790Abstract: A composite electronic component includes an element part and an electrostatic discharge (ESD) protection part disposed on the element part. The ESD protection part includes first and second discharge electrodes having a gap formed therebetween, a discharge layer disposed between the first and second discharge electrodes and in the gap, and a multilayer insulating layer covering the discharge layer and including at least two insulating layers having different breakdown voltage (BDV) values.Type: GrantFiled: October 9, 2017Date of Patent: August 4, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Hun Park, Kwang Jik Lee, Ju Hwan Yang, Jung Wook Seo, Sang Moon Lee
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Patent number: 10568194Abstract: A common mode filter includes a body including a filter portion and an electrostatic protection portion, first to fourth external electrodes disposed on an external surface of the body, a ground electrode disposed on the external surface of the body, a first coil included in the filter portion and electrically connected to the first and second external electrodes, and a second coil included in the filter portion and electrically connected to the third and fourth external electrodes. The electrostatic protection portion includes discharge electrodes electrically connected to at least one of the first to fourth external electrodes and the ground electrode, a discharge part including conductive particles, a first organic-inorganic composite insulating layer disposed on the discharge electrodes and the discharge part, a magnetic cover layer disposed on the first organic-inorganic composite insulating layer, and a first inorganic insulating layer.Type: GrantFiled: October 24, 2017Date of Patent: February 18, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Jik Lee, Sang Moon Lee, Hye Hun Park, Ju Hwan Yang, Jung Wook Seo