Patents by Inventor Hyeon-hyang KIM

Hyeon-hyang KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Object forming apparatus and controlling method thereof
    Patent number: 10913201
    Abstract: An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: February 9, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Keon Kuk, Eun-bong Han, Young-dae Ko, Hyeon-hyang Kim, O-hyun Beak, Jun-hee Lee, Yeon-kyoung Jung
  • Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof
    Patent number: 10566293
    Abstract: A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: February 18, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Keon Kuk, Young-dae Ko, O-hyun Beak, Eun-bong Han, Hyeon-hyang Kim, Yeon-kyoung Jung, Il-ju Mun
  • EMI shielding structure having heat dissipation unit and method for manufacturing the same
    Patent number: 10068832
    Abstract: An electromagnetic interference shielding structure is disclosed. The electromagnetic interference shielding structure includes an insulating member covering at least one circuit element mounted on a printed circuit board (PCB), a shielding member covering the insulating member, and a heat dissipator having a surface adhering to the shielding member to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: September 4, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Eun-bong Han, Hyeon-hyang Kim
  • EMI SHIELDING STRUCTURE HAVING HEAT DISSIPATION UNIT AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20180204783
    Abstract: An electromagnetic interference shielding structure is disclosed. The electromagnetic interference shielding structure includes an insulating member covering at least one circuit element mounted on a printed circuit board (PCB), a shielding member covering the insulating member, and a heat dissipator having a surface adhering to the shielding member to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low.
    Type: Application
    Filed: December 13, 2017
    Publication date: July 19, 2018
    Inventors: Eun-bong HAN, Hyeon-hyang KIM
  • OBJECT FORMING APPARATUS AND CONTROLLING METHOD THEREOF
    Publication number: 20170057161
    Abstract: An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.
    Type: Application
    Filed: August 5, 2016
    Publication date: March 2, 2017
    Inventors: Keon KUK, Eun-bong HAN, Young-dae KO, Hyeon-hyang KIM, O-hyun BEAK, Jun-hee LEE, Yeon-kyoung JUNG
  • CIRCUIT ELEMENT PACKAGE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING APPARATUS THEREOF
    Publication number: 20160262292
    Abstract: A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.
    Type: Application
    Filed: March 4, 2016
    Publication date: September 8, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Keon KUK, Young-dae KO, O-hyun BEAK, Eun-bong HAN, Hyeon-hyang KIM, Yeon-kyoung JUNG, Il-ju MUN