Abstract: Dinadic phenyl amine reactive endcap monomers for application in high-temperature polymeric composites are described. The amine group of the endcap is directly reacted with a desired chemical backbone to provide the preferred rigidity and chemical resistance. The ability of the amine group to react with a wide variety of chemical backbones allows the tailoring of formulations for various application temperatures, mechanical properties, processes and resistances while retaining the high degree of crosslinking that yields excellent temperature stability, ease of processing and the necessary toughness. Polyimide oligomers comprising the reaction product of at least one dinadic phenyl amine endcap monomer and a chemical backbone, preferably with a molecular weight not exceeding about 1000-3000, suitable for high temperature composites are described. The dinadic phenyl amine endcaps may be reacted with an acid anhydride capped precursor to form polyimide resins suitable for high-temperature composites.

Abstract: Water-entrained compositions comprising colloidal or suspensoidal solutions comprising polyimide pre-polymers/oligomers are described. These compositions are obtained in water by initial dispersion of the resin constituents in water to from colloids or suspensoids. The water-entrained polyimide compositions can be applied to numerous surfaces or more beneficially used for composite fabrication. The coated surfaces or polyimide-pre-polymer impregnated reinforcing materials are subsequently cured and are ideal for providing thermal protection.

Abstract: Water-entrained compositions comprising colloidal or suspensoidal solutions comprising polyimide pre-polymers/oligomers are described. These compositions are obtained in water by initial dispersion of the resin constituents in water to from colloids or suspensoids. The water-entrained polyimide compositions can be applied to numerous surfaces or more beneficially used for composite fabrication. The coated surfaces or polyimide-pre-polymer impregnated reinforcing materials are subsequently cured and are ideal for providing thermal protection.

Abstract: A process for synthesizing formulations for polyimides suitable for use in high-temperature composites in which all reactions other than chain-extension have already taken place prior to making a composite is described, wherein the resulting oligomers comprise a backbone and at least one difunctional endcap. The resulting resin systems have only the single step of endcap-to-endcap reactions during composite processing. Prior to the initiation temperature of these endcap-to-endcap reactions, the resins are stable affording the composite manufacturer a very large processing window.

Abstract: A process for synthesizing formulations for polyimides suitable for use in high-temperature composites in which all reactions other than chain-extension have already taken place prior to making a composite is described, wherein the resulting oligomers comprise a backbone and at least one difunctional endcap. The resulting resin systems have only the single step of endcap-to-endcap reactions during composite processing. Prior to the initiation temperature of these endcap-to-endcap reactions, the resins are stable affording the composite manufacturer a very large processing window.

Abstract: Dinadic phenyl amine reactive endcap monomers for application in high-temperature polymeric composites are described. The amine group of the endcap is directly reacted with a desired chemical backbone to provide the preferred rigidity and chemical resistance. The ability of the amine group to react with a wide variety of chemical backbones allows the tailoring of formulations for various application temperatures, mechanical properties, processes and resistances while retaining the high degree of crosslinking that yields excellent temperature stability, ease of processing and the necessary toughness. Polyimide oligomers comprising the reaction product of at least one dinadic phenyl amine endcap monomer and a chemical backbone, preferably with a molecular weight not exceeding about 1000-3000, suitable for high-temperature composites are described. The dinadic phenyl amine endcaps may be reacted with an acid anhydride capped precursor to form polyimide resins suitable for high-temperature composites.

Abstract: Water-entrained compositions comprising colloidal or suspensoidal solutions comprising polyimide pre-polymers/oligomers are described. These compositions are obtained in water by initial dispersion of the resin constituents in water to from colloids or suspensoids. The water-entrained polyimide compositions can be applied to numerous surfaces or more beneficially used for composite fabrication. The coated surfaces or polyimide-pre-polymer impregnated reinforcing materials are subsequently cured and are ideal for providing thermal protection.