Abstract: The present invention relates to a method of manufacturing an LED device which emits light of multi-wavelengths. The invention also relates to a method of manufacturing LED devices which emit light of high quality from throughout the whole surface in a uniform manner. In particular, utilizing the manufacturing method of LED devices which emit light of multi-wavelengths makes it possible to produce LED devices of high quality in a simple and cost-efficient way, not by using adhesives, but by a sputtering or PLD method. In addition, since the characteristics of the desired emitted light can be controlled by controlling the amount and type of the phosphors during the manufacture of sputtering targets, high quality LED devices can be manufactured easily.

Abstract: The present invention relates to a method of manufacturing an LED device which emits light of multi-wavelengths. The invention also relates to a method of manufacturing LED devices which emit light of high quality from throughout the whole surface in a uniform manner. In particular, utilizing the manufacturing method of LED devices which emit light of multi-wavelengths makes it possible to produce LED devices of high quality in a simple and cost-efficient way, not by using adhesives, but by a sputtering or PLD method. In addition, since the characteristics of the desired emitted light can be controlled by controlling the amount and type of the phosphors during the manufacture of sputtering targets, high quality LED devices can be manufactured easily.

Abstract: The present invention relates to a method of manufacturing an LED device which emits light of multi-wavelengths. The invention also relates to a method of manufacturing LED devices which emit light of high quality from throughout the whole surface in a uniform manner. In particular, utilizing the manufacturing method of LED devices which emit light of multi-wavelengths makes it possible to produce LED devices of high quality in a simple and cost-efficient way, not by using adhesives, but by a sputtering or PLD method. In addition, since the characteristics of the desired emitted light can be controlled by controlling the amount and type of the phosphors during the manufacture of sputtering targets, high quality LED devices can be manufactured easily.

Abstract: A semiconductor chip test handler includes a first chamber in which packaged chips contained in a test tray are heated to high temperature or cooled to low temperature, a second chamber in which the packaged chips contained in the test tray are tested, and a third chamber in which the packaged chips contained in the test tray are cooled or heated to room temperature. The test trays are horizontally and/or vertically moved in an upright position between the first, second, and third chambers. The chambers may be arranged in a row or in a column. The test trays include a frame and a plurality of carriers into which the packaged chips are loaded. Connecting member and or projections are detachably mounted on lateral sides of the frame. A moving apparatus for moving the test trays between the first, second, and third chambers uses the connecting members and projections to push or pull the test trays into and out of the chambers.

Abstract: A semiconductor chip test handler includes a first chamber in which packaged chips contained in a test tray are heated to high temperature or cooled to low temperature, a second chamber in which the packaged chips contained in the test tray are tested, and a third chamber in which the packaged chips contained in the test tray are cooled or heated to room temperature. The test trays are horizontally and/or vertically moved in an upright position between the first, second, and third chambers. The chambers may be arranged in a row or in a column. The test trays include a frame and a plurality of carriers into which the packaged chips are loaded. Connecting member and or projections are detachably mounted on lateral sides of the frame. A moving apparatus for moving the test trays between the first, second, and third chambers uses the connecting members and projections to push or pull the test trays into and out of the chambers.

Abstract: Provided is a method for transferring test trays in a handler including a second chamber having two test sites arranged in parallel, a first chamber having a plurality of passages along which a plurality of test trays are horizontally moved, provided over the second chamber, and a third chamber having a plurality of passages along which the plurality of test trays are horizontally moved, provided under the second chamber, the method including steps of (a) enabling two test trays to wait in parallel in a horizontal position at a waiting location provided to a forward section of the handler, (b) loading packaged chips onto the two test trays, (c) rotating the two test trays to be in the upright position, (d) moving upwards the two test trays into the first chamber, (e) heating or cooling the two test trays while moving horizontally the two test trays forward in the first chamber, (f) moving downward the two test trays from the first chamber into the second chamber, (g) moving horizontally the two test trays tow

Abstract: The present invention relates to a method of manufacturing an LED device which emits light of multi-wavelengths. The invention also relates to a method of manufacturing LED devices which emit light of high quality from throughout the whole surface in a uniform manner. In particular, utilizing the manufacturing method of LED devices which emit light of multi-wavelengths makes it possible to produce LED devices of high quality in a simple and cost-efficient way, not by using adhesives, but by a sputtering or PLD method. In addition, since the characteristics of the desired emitted light can be controlled by controlling the amount and type of the phosphors during the manufacture of sputtering targets, high quality LED devices can be manufactured easily.