Patents by Inventor Hyo Derk Park

Hyo Derk Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8065920
    Abstract: A gripper and a driving method using the same are disclosed, wherein an actuator has a configuration combined with a piezoelectric operating unit and a bending structure, whereby an amount of variation of a gap between fingers are amplified more than that of the piezoelectric operating unit by generating a movement of the fingers perpendicular to a movement direction of the piezoelectric operating unit, and wherein the gripper having arms including a strain gauge sensor can precisely measure a force applied to a micro object.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: November 29, 2011
    Assignee: Korea Electronics Technology Institute
    Inventors: Kwang Bum Park, Joon Shik Park, Hyo Derk Park
  • Publication number: 20090199651
    Abstract: A gripper and a driving method using the same are disclosed, wherein an actuator has a configuration combined with a piezoelectric operating unit and a bending structure, whereby an amount of variation of a gap between fingers are amplified more than that of the piezoelectric operating unit by generating a movement of the fingers perpendicular to a movement direction of the piezoelectric operating unit, and wherein the gripper having arms including a strain gauge sensor can precisely measure a force applied to a micro object.
    Type: Application
    Filed: February 2, 2009
    Publication date: August 13, 2009
    Inventors: Kwang Bum Park, Joon Shik Park, Hyo Derk Park
  • Patent number: 7050163
    Abstract: The present invention provides an apparatus for solution component analysis and fabricating method thereof, by which a mixing channel, reaction channel, and measurement channel are formed as continuous micro-grooves on one substrate to implement the miniature apparatus for analyzing solution components, by which the apparatus is provided with portability facilitating access to a spot outside a laboratory to perform an instant sample analysis, and by which an optical system configuration for sample analysis can be simplified in a manner of facilitating an optical transfer by forming a transparent silicon oxide (SiO2) layer between a micro channel of the apparatus and an optical fiber to insert the optical fiber therein.
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: May 23, 2006
    Assignee: Korea Electronics Technology Institute
    Inventors: Kwang Bum Park, Joon Shik Park, Kyu Sik Shin, Hyo Derk Park
  • Publication number: 20050140972
    Abstract: The present invention provides an apparatus for solution component analysis and fabricating method thereof, by which a mixing channel, reaction channel, and measurement channel are formed as continuous micro-grooves on one substrate to implement the miniature apparatus for analyzing solution components, by which the apparatus is provided with portability facilitating access to a spot outside a laboratory to perform an instant sample analysis, and by which an optical system configuration for sample analysis can be simplified in a manner of facilitating an optical transfer by forming a transparent silicon oxide (SiO2) layer between a micro channel of the apparatus and an optical fiber to insert the optical fiber therein.
    Type: Application
    Filed: October 28, 2004
    Publication date: June 30, 2005
    Inventors: Kwang Bum Park, Joon Shik Park, Kyu Sik Shin, Hyo Derk Park
  • Patent number: 6651506
    Abstract: A pressure sensor using two capacitors for measuring a pressure stimulus includes a substrate having a diaphragm positioned at a center portion thereof. The diaphragm has a reduced thickness so that the diaphragm displaces upward and downward in response to a pressure stimulus. A first capacitor is provided on the diaphragm and at least a second capacitor is provided on a bulk portion of the substrate so as to be adjacent to the first capacitor. The first and the second capacitor are connected to each other in series, wherein capacitance differs between the first and the second capacitor when the diaphragm moves up and down in response to the pressure stimulus.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: November 25, 2003
    Assignee: Korea Electronics Technology Institute
    Inventors: Dae-Sung Lee, Hyo-Derk Park, Kyoung-II Lee, Yoo-Jin Lee, Yeon-Shik Choi
  • Patent number: 6558878
    Abstract: Disclosed is a microlens manufacturing method which comprises the step of: positioning a X-ray mask for manufacturing the microlens on an substrate on which a sensitive film is formed, and arranging a rotation axis of the substrate and a central axis of the X-ray mask; applying X-rays to the X-ray mask to expose the sensitive film while fixing the X-ray mask and rotating the substrate; developing the sensitive film to form the microlens; performing an electroplating process on the plating base to form a metal layer; and separating the metal layer from the sensitive film structure and combining the metal layer with a mold frame for injection molding the microlens and manufacturing an injection mold.
    Type: Grant
    Filed: June 1, 2000
    Date of Patent: May 6, 2003
    Assignee: Korea Electronics Technology Institute
    Inventors: Hyo-Derk Park, Suk-Won Jung, Kwang-Bum Park, In-Hoe Kim, Hyun-Chan Moon, Kun-Nyun Kim, Soon-Sup Park, Sang-Mo Shin
  • Publication number: 20020194919
    Abstract: A differential capacitive pressure sensor includes a substrate, a first to a third lower electrode sequentially arranged on the substrate, a first to a third upper electrode respectively floating over the first to the third lower electrode, and a first to a third supporting member downwardly extending from the first to the third upper electrode, respectively. The substrate includes a diaphragm positioned at a center portion thereof and the diaphragm has a reduced thickness. The second lower electrode is positioned corresponding to the diaphragm, and the first lower electrode and the second lower electrode are electrically connected to each other. The second upper electrode crosses over the second lower electrode. The first and the second supporting member contact the second lower electrode.
    Type: Application
    Filed: March 15, 2002
    Publication date: December 26, 2002
    Inventors: Dae-Sung Lee, Hyo-Derk Park, Kyoung-ll Lee, Yoo-Jin Lee, Yeon-Shik Choi