Patents by Inventor Hyo-Jic Jung
Hyo-Jic Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8699234Abstract: An EMI noise shield board, in which an EBG structure is inserted, includes a first board portion and a second board portion. The first board portion has an upper surface, on which an electronic part is disposed, and a circuit for transferring a signal and power to the electronic part. The second board portion is located on a lower surface of the first board portion. The electromagnetic bandgap structure is inserted into the second board portion, and has a band stop frequency property such that an EMI noise transferred from the first board portion is shielded from being radiated to the outside of the EMI noise shield board.Type: GrantFiled: January 5, 2011Date of Patent: April 15, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Han Kim, Mi-Ja Han, Dae-Hyun Park, Hyo-Jic Jung, Kang-Wook Bong
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Patent number: 8598468Abstract: An electromagnetic bandgap structure including: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate, wherein the first stitching via electrically connects the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above or below the one conductive plate, and the second stitching via electrically connects the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface that is different from the planar surface through which the part of the first stitching via is connected, the two planar surfaces being placed in a same direction based on the conductive plates.Type: GrantFiled: April 2, 2012Date of Patent: December 3, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Han Kim, Mi-Ja Han, Hyo-Jic Jung
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Patent number: 8314341Abstract: Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a planar surface that is different from that of the second conductive plate, a connection pattern arranged on a planar surface that is different from that of the second conductive plate, a first stitching via unit configured to connect the first conductive plate to one end of the connection pattern through the planar surface where the second conductive plate is arranged, and a second stitching via unit configured to connect the third conductive plate to the other end of the connection pattern through the planar surface where the second conductive plate is arranged.Type: GrantFiled: December 17, 2009Date of Patent: November 20, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Han Kim, Mi-Ja Han, Kang-Wook Bong, Hyo-Jic Jung
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Publication number: 20120234591Abstract: An electromagnetic bandgap structure including: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate, wherein the first stitching via electrically connects the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above or below the one conductive plate, and the second stitching via electrically connects the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface that is different from the planar surface through which the part of the first stitching via is connected, the two planar surfaces being placed in a same direction based on the conductive plates.Type: ApplicationFiled: April 2, 2012Publication date: September 20, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Han KIM, Mi-Ja Han, Hyo-Jic Jung
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Patent number: 8258408Abstract: As a multi-layered board, an EMI noise reduction board, having an electromagnetic bandgap structure with band stop frequency properties inserted into an inner portion of the board, includes a first area, in which a ground layer and a power layer are formed, and a second area, placed on a side surface of the first area, in which it has the electromagnetic bandgap structure formed therein so as to shield an EMI noise radiated to the outside through the side surface of the first area. The electromagnetic bandgap structure includes a plurality of first conductive plates, placed along the edge of the board, a plurality of second conductive plates, disposed on a planar surface that is different from the first conductive plates such that the second conductive plates are alternately disposed with the first conductive plates, and a via, which connects the first conductive plates to the second conductive plates.Type: GrantFiled: December 22, 2009Date of Patent: September 4, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Han Kim, Mi-Ja Han, Dae-Hyun Park, Hyo-Jic Jung, Kang-Wook Bong
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Patent number: 8242377Abstract: Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.Type: GrantFiled: December 17, 2009Date of Patent: August 14, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hyo-Jic Jung, Han Kim, Mi-Ja Han, Kang-Wook Bong, Dae-Hyun Park
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Patent number: 8212150Abstract: An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes: a first area having a ground layer and a power layer; a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes: a plurality of first conductive plates and a plurality of second conductive plates placed on a same planar surface along the side portion of the first area; and a stitching via configured to electrically connect the first conductive plate to the second conductive plate through a planar surface that is different from the first conductive plate and the second conductive plate.Type: GrantFiled: December 17, 2009Date of Patent: July 3, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Han Kim, Mi-Ja Han, Dae-Hyun Park, Hyo-Jic Jung, Kang-Wook Bong
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Patent number: 8164006Abstract: According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate. In the electromagnetic bandgap structure of the present invention, the first stitching via can electrically connect the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above the one conductive plate, and the second stitching via can electrically connect the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface below the one conductive plate.Type: GrantFiled: September 29, 2008Date of Patent: April 24, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Han Kim, Mi-Ja Han, Hyo-Jic Jung
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Publication number: 20110299264Abstract: The present invention provides an EMI noise shield board in which an EBG structure is inserted. The EMI noise shield board in accordance with an embodiment of the present invention can include: a first board portion, an electronic part being mounted on an upper surface of the first board portion, a circuit for transferring a signal and power to the electronic part being in the first board portion; and a second board portion located on a lower surface of the first board portion, an electromagnetic bandgap structure being inserted into the second board portion, the electromagnetic bandgap structure having a band stop frequency property in such a way that an EMI noise transferred from the first board portion can be shielded from being radiated to the outside of a board.Type: ApplicationFiled: January 5, 2011Publication date: December 8, 2011Inventors: Han KIM, Mi-Ja Han, Dae-Hyun Park, Hyo-Jic Jung, Kang-Wook Bong
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Publication number: 20110067914Abstract: Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.Type: ApplicationFiled: December 17, 2009Publication date: March 24, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyo-Jic Jung, Han Kim, Mi-Ja Han, Kang-Wook Bong, Dae-Hyun Park
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Publication number: 20110067916Abstract: Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a planar surface that is different from that of the second conductive plate, a connection pattern arranged on a planar surface that is different from that of the second conductive plate, a first stitching via unit configured to connect the first conductive plate to one end of the connection pattern through the planar surface where the second conductive plate is arranged, and a second stitching via unit configured to connect the third conductive plate to the other end of the connection pattern through the planar surface where the second conductive plate is arranged.Type: ApplicationFiled: December 17, 2009Publication date: March 24, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Han Kim, Mi-Ja Han, Kang-Wook Bong, Hyo-Jic Jung
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Publication number: 20110067915Abstract: An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes: a first area having a ground layer and a power layer; a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes: a plurality of first conductive plates and a plurality of second conductive plates placed on a same planar surface along the side portion of the first area; and a stitching via configured to electrically connect the first conductive plate to the second conductive plate through a planar surface that is different from the first conductive plate and the second conductive plate.Type: ApplicationFiled: December 17, 2009Publication date: March 24, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Han Kim, Mi-Ja Han, Dae-Hyun Park, Hyo-Jic Jung, Kang-Wook Bong
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Publication number: 20110031007Abstract: As a multi-layered board, an EMI noise reduction board, having an electromagnetic bandgap structure with band stop frequency properties inserted into an inner portion of the board, includes a first area, in which a ground layer and a power layer are formed, and a second area, placed on a side surface of the first area, in which it has the electromagnetic bandgap structure formed therein so as to shield an EMI noise radiated to the outside through the side surface of the first area. The electromagnetic bandgap structure includes a plurality of first conductive plates, placed along the edge of the board, a plurality of second conductive plates, disposed on a planar surface that is different from the first conductive plates such that the second conductive plates are alternately disposed with the first conductive plates, and a via, which connects the first conductive plates to the second conductive plates.Type: ApplicationFiled: December 22, 2009Publication date: February 10, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Han Kim, Mi-Ja Han, Dae-Hyun Park, Hyo-Jic Jung, Kang-Wook Bong
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Patent number: 7764149Abstract: An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a metal layer; and a plurality of mushroom type structures including a metal plate and a via. Here, the plurality of mushroom type structures can be formed on the metal layer in a stacked structure. With the present invention, the small sized electromagnetic bandgap structure can have a lower bandgap frequency.Type: GrantFiled: January 7, 2008Date of Patent: July 27, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Mi-Ja Han, Han Kim, Dae-Hyun Park, Hyo-Jic Jung
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Publication number: 20090236141Abstract: According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate. In the electromagnetic bandgap structure of the present invetion, the first stitching via can electrically connect the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above the one conductive plate, and the second stitching via can electrically connect the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface below the one conductive plate.Type: ApplicationFiled: September 29, 2008Publication date: September 24, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Han Kim, Mi-Ja Han, Hyo-Jic Jung
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Publication number: 20080266018Abstract: An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a metal layer; and a plurality of mushroom type structures including a metal plate and a via. Here, the plurality of mushroom type structures can be formed on the metal layer in a stacked structure. With the present invention, the small sized electromagnetic bandgap structure can have a lower bandgap frequency.Type: ApplicationFiled: January 7, 2008Publication date: October 30, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi-Ja Han, Han Kim, Dae-Hyun Park, Hyo-Jic Jung