Abstract: The present invention relates to: a method for producing a polyimide aerogel having low dielectric properties, high insulation, and high strength; and a polyimide aerogel prepared therefrom. The present invention has the technical gist of a method for producing a polyimide aerogel having low dielectric properties, high insulation, and high strength, and a polyimide aerogel prepared therefrom, the method including: a first step of preparing a solvent; a second step of preparing a polyamic acid resin by reacting a diamine-based monomer with an acid anhydride monomer in a solvent; a third step of preparing a polyimide resin solution by imidizing the polyamic acid resin at 150 to 200° C.

Abstract: Proposed are a polyimide aerogel having a controlled particle size and pore structure, and a method for producing the same. More particularly, proposed are a polyimide aerogel in which not only can the particle size of a polyimide resin be controlled, but the pore structure of the polyimide aerogel can also be controlled through an organic solvent mixture, and a method for producing the polyimide aerogel. This can be achieved through: a first step of preparing a solvent; a second step of synthesizing a polyamic acid resin by reacting a diamine-based monomer and an acid anhydride monomer in the solvent; a third step of forming a polyimide resin through imidization of the polyamic acid resin by subjecting the polyamic acid resin to a high-temperature reaction at 150 to 200° C.

Abstract: The present invention relates to a heat dissipation coating agent and to a heat-dissipating plate including same, which efficiently dissipate heat from the surface of a heat-dissipating plate of an electric/electronic component. Particularly, the heat dissipation coating agent, which is applied to the surface of a heat-dissipating plate of an electric/electronic component, includes infrared radiation powder and a binder, and the heat-dissipating plate is coated with a heat dissipation layer consisting of the heat dissipation coating agent. Since the heat dissipation coating agent applied to the heat-dissipating plate is highly conductive, heat is emitted from the heat-dissipating plate by conduction as well as convection. In particular, the heat dissipation coating agent, which conducts heat with high conductivity, can be applied to a heat-dissipating plate of a high-power LED light source.

Abstract: The present invention relates to a heat dissipation coating agent and to a heat-dissipating plate including same, which efficiently dissipate heat from the surface of a heat-dissipating plate of an electric/electronic component. Particularly, the heat dissipation coating agent, which is applied to the surface of a heat-dissipating plate of an electric/electronic component, includes infrared radiation powder and a binder, and the heat-dissipating plate is coated with a heat dissipation layer consisting of the heat dissipation coating agent. Since the heat dissipation coating agent applied to the heat-dissipating plate is highly conductive, heat is emitted from the heat-dissipating plate by conduction as well as convection. In particular, the heat dissipation coating agent, which conducts heat with high conductivity, can be applied to a heat-dissipating plate of a high-power LED light source.