Patents by Inventor Hyo-Seok Kim

Hyo-Seok Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11981851
    Abstract: A quantum dot including a core comprising a first semiconductor nanocrystal including a zinc chalcogenide and a semiconductor nanocrystal shell disposed on the surface of the core and comprising zinc, selenium, and sulfur. The quantum dot does not comprise cadmium, emits blue light, and may exhibit a digital diffraction pattern obtained by a Fast Fourier Transform of a transmission electron microscopic image including a (100) facet of a zinc blende structure. In an X-ray diffraction spectrum of the quantum dot, a ratio of a defect peak area with respect to a peak area of a zinc blende crystal structure is less than about 0.8:1. A method of producing the quantum dot, and an electroluminescent device including the quantum dot are also disclosed.
    Type: Grant
    Filed: November 11, 2022
    Date of Patent: May 14, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Woo Kim, Jin A Kim, Tae Hyung Kim, Kun Su Park, Yuho Won, Jeong Hee Lee, Eun Joo Jang, Hyo Sook Jang, Yong Seok Han, Heejae Chung
  • Publication number: 20240154042
    Abstract: A semiconductor device includes a substrate including an upper surface and a lower surface that are opposite to each other in a first direction, an active pattern which is on the upper surface of the substrate and extends in a second direction, a gate electrode which is on the active pattern and extends in a third direction, a first source/drain pattern which is connected to the active pattern on the upper surface of the substrate, and includes a lower epitaxial region and an upper epitaxial region, the upper epitaxial region including an epitaxial recess, and the lower epitaxial region being inside the epitaxial recess, a first source/drain contact, which is connected to the first source/drain pattern and extends into the substrate, and a contact silicide layer, which is between the first source/drain contact and the first source/drain pattern and contacts the lower epitaxial region.
    Type: Application
    Filed: July 17, 2023
    Publication date: May 9, 2024
    Inventors: Jun Ki PARK, Wan Don KIM, Jeong Hyuk YIM, Hyo Seok CHOI, Sung Hwan KIM
  • Patent number: 11978893
    Abstract: A cathode active material for a lithium secondary battery includes a lithium metal oxide particle and a thio-based compound formed on at least portion of a surface of the lithium metal oxide particle. The thio-based compound has a double bond that contains a sulfur atom. Chemical stability of the lithium metal oxide particle may be improved and surface residues may be reduced by the thio-based compound.
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: May 7, 2024
    Assignee: SK ON CO., LTD.
    Inventors: Jik Soo Kim, Sang Bok Kim, Hyo Shin Kwak, Myoung Lae Kim, Se Rah Moon, Jin Seok Seo, Mi Jung Noh, Duck Chul Hwang
  • Publication number: 20240146409
    Abstract: The present application relates to a method of generating a downlink frame. The method of generating the downlink frame includes: generating a first short sequence and a second short sequence indicating cell group information; generating a first scrambling sequence and a second scrambling sequence determined by the primary synchronization signal; generating a third scrambling sequence determined by the first short sequence and a fourth scrambling sequence determined by the second short sequence; scrambling the short sequences with the respective scrambling sequences; and mapping the secondary synchronization signal that includes the first short sequence scrambled with the first scrambling sequence, the second short sequence scrambled with the second scrambling sequence and the third scrambling sequence, the second short sequence scrambled with the first scrambling sequence and the first short sequence scrambled by the second scrambling sequence and the fourth scrambling sequence to a frequency domain.
    Type: Application
    Filed: January 6, 2024
    Publication date: May 2, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Kap Seok CHANG, Il Gyu KIM, Hyeong Geun PARK, Young Jo KO, Hyo Seok Yl, Chan Bok JEONG, Young Hoon KIM, Seung Chan BANG
  • Publication number: 20240129725
    Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 18, 2024
    Applicant: ESTORM CO., LTD.
    Inventors: Jong Hyun WOO, Tae Il LEE, Il Jin JUNG, Hee Jun SHIN, Hyung Seok JANG, Min Jae SON, Sang Heon BAEK, Seo Bin PARK, Hyo Sang KWON, Mi Ju KIM, Jung Hoon SONG, Rakhmanov DILSHOD, Dong Hee KIM, Jeon Gjin KIM
  • Patent number: 11959607
    Abstract: A vehicle lamp for forming a predetermined beam pattern using a plurality of lamp modules is provided. Each of the lamp modules includes a light source unit that generates light and includes a plurality of light source chips; an optical path adjustment unit that guides a path of the light irradiated from the light source unit; and an optical unit that transmits the light guided by the optical path adjustment unit to form a beam pattern including at least one light irradiation pattern formed by at least one of the plurality of light source chips. In particular, the plurality of light source chips are arranged in a left-right direction.
    Type: Grant
    Filed: March 31, 2023
    Date of Patent: April 16, 2024
    Assignee: SL Corporation
    Inventors: Kae Hong Kim, Tae Seok Seo, Hyo Jin Han
  • Patent number: 11963467
    Abstract: An electronic device includes a semiconductor memory. A method for fabricating the electronic device includes forming a first memory cell extending vertically from a surface of substrate and having a first upper portion that protrudes laterally, forming a second memory cell extending vertically from the surface of the substrate and having a second upper portion that protrudes laterally towards the first upper portion, and forming a liner layer over the first and second memory cells, the liner layer having a first portion disposed over the first upper portion and a second portion disposed over the second upper portion, the first and second portions of the liner layer contacting each other.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: April 16, 2024
    Assignee: SK hynix Inc.
    Inventors: Hyo-June Kim, Hyun-Seok Kang, Chi-Ho Kim, Jae-Geun Oh
  • Publication number: 20240120279
    Abstract: A semiconductor device may include a first film and a second film defining parts of a trench, a plug conductive film, a via, and a wiring in the trench. The trench may include a second sub-trench having a second width below a first sub-trench having a first width. The plug conductive film may extend from a first side of the first film to penetrate a bottom face of the trench. An uppermost face of the plug conducive film may be in the trench. The via may include an insulating liner between the plug conductive film and the first film. The uppermost face of the plug conductive film and at least a part of a side wall of the plug conductive film may be in contact with the wiring. An upper face of the insulating liner may be exposed by a bottom face of the second sub-trench.
    Type: Application
    Filed: September 21, 2023
    Publication date: April 11, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jeong Hyuk YIM, Wan Don KIM, Hyun Bae LEE, Hyo Seok CHOI, Geun Woo KIM
  • Patent number: 11935835
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device, the device including gate structures on a substrate; source/drain layers on portions of the substrate that are adjacent the gate structures, respectively; first contact plugs contacting upper surfaces of the source/drain layers, respectively; a second contact plug contacting one of the gate structures, a sidewall of the second contact plug being covered by an insulating spacer; and a third contact plug commonly contacting an upper surface of at least one of the gate structures and at least one of the first contact plugs, at least a portion of a sidewall of the third contact plug not being covered by an insulating spacer.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: March 19, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyo-Jin Kim, Chang-Hwa Kim, Hwi-Chan Jun, Chul-Hong Park, Jae-Seok Yang, Kwan-Young Chun
  • Patent number: 11935984
    Abstract: A quantum dot including a core that includes a first semiconductor nanocrystal including zinc and selenium, and optionally sulfur and/or tellurium, and a shell that includes a second semiconductor nanocrystal including zinc, and at least one of sulfur or selenium is disclosed. The quantum dot has an average particle diameter of greater than or equal to about 13 nm, an emission peak wavelength in a range of about 440 nm to about 470 nm, and a full width at half maximum (FWHM) of an emission wavelength of less than about 25 nm. A method for preparing the quantum dot, a quantum dot-polymer composite including the quantum dot, and an electronic device including the quantum dot is also disclosed.
    Type: Grant
    Filed: December 14, 2022
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Seok Han, Sung Woo Kim, Jin A Kim, Tae Hyung Kim, Kun Su Park, Yuho Won, Jeong Hee Lee, Eun Joo Jang, Hyo Sook Jang
  • Patent number: 11929367
    Abstract: A semiconductor device includes a substrate having a first region and a second region, first active fins that extend in a first direction in the first region, second active fins that extend in the first direction in the second region, a first field insulating layer between the first active fins and that extend in a second direction, a second field insulating layer between the second active fins and extending in the second direction, a gate line that extends in the second direction on the second field insulating layer, the gate line linearly along with the first field insulating layer, a gate isolation layer between the first field insulating layer and the gate line, and gate spacers that extend in the second direction, the gate spacers in contact with both sidewalls of each of the first field insulating layer, the gate line, and the gate isolation layer.
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung Seok Ha, Hyun Seung Song, Hyo Jin Kim, Kyoung Mi Park, Guk Il An
  • Publication number: 20240075853
    Abstract: An apparatus of tilting a seat cushion of a vehicle, includes a tilting motor, a pinion gear, a sector gear, and a tilting link which perform the tilting operation of the seat cushion and exert a binding force in a tilted state of the seat cushion and are provided to be connected to both of one side and the other side of a seat cushion frame, and has two sector gears positioned on left and right sides and connected to each other by a connection bar so that, by strengthening a binding force of the front portion of the seat cushion, it is possible to secure the safety of passengers in the event of a collision.
    Type: Application
    Filed: April 13, 2023
    Publication date: March 7, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, DAS CO., LTD, Faurecia Korea, Ltd., Hyundai Transys Inc.
    Inventors: Sang Soo LEE, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Sang Do PARK, Chan Ho JUNG, Dong Hoon LEE, Hea Yoon KANG, Deok Soo LIM, Seung Pil JANG, Seon Ho KIM, Jong Seok YUN, Hyo Jin KIM, Dong Gyu SHIN, Jin Ho SEO, Young Jun KIM, Taek Jun NAM
  • Publication number: 20230328956
    Abstract: A semiconductor device includes a substrate including a first active pattern having first and second source/drain regions of a cell region, a device isolation layer in a trench defining the first active pattern on the cell region, a buffer layer on the cell region, a line structure extends in a third direction, extends from the cell region to a boundary region, and including a first conductive pattern that passes through the buffer layer and contacts the first source/drain region, a bit line on the first conductive pattern, and a first barrier pattern between the bit line and the first conductive pattern, a pair of spacers respectively on both sidewalls of the line structure, a contact on the second source/drain region, a landing pad on the contact, a first abrasive particle between the contact and the landing pad, and a data storage element on the landing pad.
    Type: Application
    Filed: September 30, 2022
    Publication date: October 12, 2023
    Inventors: Jihye Son, Hojoong Kim, Youngsin Kim, Hyo-Seok Kim, Bongsik Choi, Taewoong Koo, Taeha Suh
  • Patent number: 11440393
    Abstract: A fluid-enclosed engine mount may include an insulator mounted between a core configured to be connected to an engine and an external pipe configured to be connected to a vehicle body, the insulator being provided with an internal space enclosing fluid; an orifice module disposed at the inside of a lower side portion of the insulator to divide the internal space into an upper chamber and a lower chamber, the orifice module being provided with a fluid passage for allowing fluid to fluidically-communicate between the upper chamber and the lower chamber; a support member disposed between an external surface of the orifice module and the lower side portion of the insulator to elastically support the orifice module to be vertically movable; and a pipe member disposed between the lower side portion of the insulator and the support member to support an external surface of the support member.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: September 13, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Hyo Seok Kim
  • Publication number: 20220153115
    Abstract: A hydro engine mount for a vehicle may include a locking body including a plurality of locking portions; a body plate including a plurality of fastening grooves configured to be fastened to the plurality of locking portions, wherein a main rubber is mounted in the body plate; and a diaphragm stacked between the main rubber and the locking body.
    Type: Application
    Filed: September 21, 2021
    Publication date: May 19, 2022
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Jae Hyung Yun, Jang Ho Kim, Hyo Seok Kim, Gu Gyun Kwon, Sang Hoon Han, Seung Won Kim
  • Patent number: 11255396
    Abstract: A fluid-sealed engine mount may include an insulator integrally formed on an external side of a mount core configured to be coupled to an engine and having a chamber with which fluid for insulation of vibration is sealed; an orifice module mounted below the mount core to divide the chamber into two chambers and having a fluid passage for flow of the fluid; an air chamber provided at a center portion of the orifice module and filled with air; and an elastic membrane mounted above the air chamber at the center portion of the orifice module to seal the air chamber airtightly.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: February 22, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Seung Won Kim, Hyo Seok Kim
  • Patent number: 11223026
    Abstract: An organic light emitting display panel includes a light emitting diode array substrate and an encapsulation substrate adhered to the light emitting array diode substrate by an adhesive film. The light emitting array diode substrate includes a driving thin film transistor formed on a substrate, an organic light emitting diode including a first electrode connected to the driving thin film transistor, an organic emission layer formed on the first electrode, and a second electrode formed on the organic emission layer, and first and second passivation layers formed on the second electrode. In this regard, the first passivation layer is formed of an organic compound having at least one of the structural formulae described in Formula 1 below: wherein R1, R2, R3, R4, R5, and R6 are each independently selected from substituted or unsubstituted C6-C40 aromatic groups.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: January 11, 2022
    Assignee: LG Display Co., Ltd.
    Inventors: Jeong-Dae Seo, Chang-Wook Han, Yoon-Heung Tak, Hyo-Seok Kim
  • Patent number: 10933727
    Abstract: An engine mount which connects an engine to a vehicle body is provided. The engine mount includes a housing which defines a body of the engine mount and a main rubber body that is installed within the housing and defines a space portion that accommodates a fluid that flows through a nozzle plate. A core is inserted into and fixed to the main rubber body and an a fixing bolt is coupled to the core. A lower support bracket is coupled to the vehicle body and the fixing bolt is inserted therein. A damper that attenuates vibration is disposed at a lower side of the core or at first and second ends of the lower support bracket of the of the engine mount.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: March 2, 2021
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Seung-Won Kim, Hyo-Seok Kim
  • Publication number: 20200391583
    Abstract: A fluid-enclosed engine mount may include an insulator mounted between a core configured to be connected to an engine and an external pipe configured to be connected to a vehicle body, the insulator being provided with an internal space enclosing fluid; an orifice module disposed at the inside of a lower side portion of the insulator to divide the internal space into an upper chamber and a lower chamber, the orifice module being provided with a fluid passage for allowing fluid to fluidically-communicate between the upper chamber and the lower chamber; a support member disposed between an external surface of the orifice module and the lower side portion of the insulator to elastically support the orifice module to be vertically movable; and a pipe member disposed between the lower side portion of the insulator and the support member to support an external surface of the support member.
    Type: Application
    Filed: December 4, 2019
    Publication date: December 17, 2020
    Applicants: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Hyo Seok KIM
  • Publication number: 20200378463
    Abstract: A fluid-sealed engine mount may include an insulator integrally formed on an external side of a mount core configured to be coupled to an engine and having a chamber with which fluid for insulation of vibration is sealed; an orifice module mounted below the mount core to divide the chamber into two chambers and having a fluid passage for flow of the fluid; an air chamber provided at a center portion of the orifice module and filled with air; and an elastic membrane mounted above the air chamber at the center portion of the orifice module to seal the air chamber airtightly.
    Type: Application
    Filed: November 26, 2019
    Publication date: December 3, 2020
    Applicants: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Seung Won Kim, Hyo Seok Kim