Patents by Inventor Hyun Bang
Hyun Bang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240190339Abstract: A lighting device of a steering wheel and an assembling method of the lighting device improving an assembly process and mass productivity of the lighting device by simplifying an assembly structure thereof, includes a grip body forming a rim of the steering wheel and including a body groove portion formed in a shape in which the body groove portion is cut away along the rim, a bezel fitted to the body groove portion and assembled to the grip body so that the body groove portion is covered by the bezel, the bezel including a center portion provided with a light transmission hole, and includes a light emitting body assembled to the bezel to overlap the light transmission hole from between the body groove portion and the bezel, the light emitting body being configured to emit light through the light transmission hole.Type: ApplicationFiled: July 5, 2023Publication date: June 13, 2024Applicants: Hyundai Motor Company, Kia Corporation, DAYOU AUTOPARTS Co., Ltd.Inventors: Soo Hee KIM, Hyo Ryeol SIM, Jun Ho BANG, Eung Joo KIM, Seok Geun LEE, In Taek JEONG, Yun Su KIM, Jong Hyun KOO
-
Patent number: 12009289Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.Type: GrantFiled: October 14, 2021Date of Patent: June 11, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
-
Patent number: 12004327Abstract: Disclosed is a containerized heating, ventilation, and air-conditioning (HVAC) system comprising an HVAC unit and one or more ducts from the HVAC unit to an equipment rack. The ducts prevent mixing between the fresh and exhaust airflow, thus improving efficiency. Sensors located at sources of heat generating equipment within the racks may be used by controllers to monitor temperatures of the components at the source of heat generation, typically at the highest temperatures. The temperatures may be aggregated to determine the temperatures of devices, modules, racks, and the container interior cavity. Dampers on the ducts, at the rack inlets, at the module inlets, at the devices inlets, and such may assist in regulating airflow preferentially to the hottest components, devices, modules, or racks.Type: GrantFiled: December 23, 2020Date of Patent: June 4, 2024Assignee: SolarEdge Technologies Korea Limited CompanyInventors: Ho-June Yu, Jeong-Hyun Bang, Jong-Sik Park
-
Publication number: 20240153831Abstract: An apparatus and method for measuring air currents on the surface of a substrate, which can accurately measure the magnitude and direction of air currents on the surface of a wafer with wafer-type air current measurement sensors, are provided. The apparatus includes: a first air current measurement module measuring a magnitude of air currents on a surface of a first substrate, which is processed in accordance with a semiconductor manufacturing process; a second air current measurement module measuring a movement direction of the air currents; and a power module supplying power to the first and second air current measurement modules, wherein the first air current measurement module, the second air current measurement module, and the power module are mounted on a second substrate, which has the same shape as the first substrate.Type: ApplicationFiled: October 19, 2023Publication date: May 9, 2024Inventors: Yong Jun SEO, Su Jin CHAE, Sang Hyun SON, Sang Min HA, Young Sik BANG, Jeong Mo HWANG, Dong Ok AHN
-
Publication number: 20240153075Abstract: The electronic device for recommending an AI-based melanoma biopsy site according to an exemplary embodiment of the present invention includes a processor which classifies a skin image that is input by using a classification model as melanoma or nevus, identifies melanoma features in the skin image by using a generation model when the skin image is classified as melanoma to generate an image from which the melanoma features are removed, and compares the skin image with the generated image to identify at least one candidate biopsy site.Type: ApplicationFiled: November 1, 2023Publication date: May 9, 2024Inventors: Ju Hee HAN, Ji Ho PARK, Young-Min PARK, Ji-Hyun LEE, Chul Hwan BANG, Woo Hyup LEE, Jeong Wook MOON
-
Patent number: 11961457Abstract: A display device, includes: a display panel including a pixel electrically coupled to a gate line and a data line; a gate driver configured to provide a gate signal to the gate line; and a data driver configured to provide a data signal to the data line, wherein the gate driver is configured to sequentially provide a first gate signal and a second gate signal to the gate line during a first frame period, wherein the data driver is configured to provide a first data signal to the data line in response to the first gate signal, and to provide a second data signal to the data line in response to the second gate signal, and wherein the second data signal is different from the first data signal and varies dependent on the first data signal.Type: GrantFiled: January 9, 2023Date of Patent: April 16, 2024Assignee: Samsung Display Co., Ltd.Inventors: Jae Hyun Koh, Sung Hoon Bang, Eui Myeong Cho, Ho Cheol Kang, Seok Young Yoon
-
Patent number: 11951965Abstract: A system and method includes upgrading a metamodel for friction coefficient prediction of a brake, in which the metamodel for friction coefficient prediction may be constructed using various derivative parameters relating to the speed, temperature and pressure of a brake disc in addition to basic parameters, such as the speed, temperature and pressure of the brake disc, to greatly improve performance and accuracy in friction coefficient prediction using the metamodel for friction coefficient prediction and to improve accuracy in evaluation of the driving performance of a vehicle through an increase in accuracy of determination of brake torque.Type: GrantFiled: October 1, 2021Date of Patent: April 9, 2024Assignees: Hyundai Motor Company, Kia CorporationInventors: Sung Hyun Cho, Sung Hoon Bang
-
Publication number: 20240076127Abstract: Provided is a ceiling storage system capable of correcting a working position and constantly checking stability of a structure by detecting an amount of change in a facility. According to the ceiling storage system, a transport vehicle moves to an upper portion of a first storage area of a plurality of storage areas in a state of gripping an article, and the transport vehicle measures a first distance value between the transport vehicle and the first storage area using a distance sensor and measures a relative position value between the transport vehicle and the first storage area using a vision sensor, before unloading the article from the first storage area.Type: ApplicationFiled: May 23, 2023Publication date: March 7, 2024Inventors: Sang Kyung LEE, Seung Gyu KANG, Hyun Jae KANG, Young Wook KIM, Sang A BANG, Yong-Jun AHN, Min Kyun LEE, Hyun Woo LEE, Jeong Hun LIM, Jun Hyuk CHANG
-
Publication number: 20240071732Abstract: A dry etching apparatus includes a process chamber; a support provided in the process chamber and configured to support a substrate; a gas supply configured to supply a process gas including a hydrogen gas (H2) and a fluorocarbon gas (CxFy) into the process chamber; a plasma source configured to generate plasma using the process gas in the process chamber, wherein the support includes: an electrostatic chuck on which the substrate is disposed; an edge ring provided along a circumference of the electrostatic chuck and supporting an edge region of the substrate; an adhesive gel pad provided between the electrostatic chuck and the edge ring; and a coating layer formed only on a surface of the edge ring, which is exposed to the plasma.Type: ApplicationFiled: August 22, 2023Publication date: February 29, 2024Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyun-Sik HWANG, Jinyoung BANG, Sungil CHO, Junghwan UM
-
Patent number: 11917871Abstract: A display device includes: a base layer including a display area (DA) and a non-DA; a circuit element layer on the base layer and including: a power supply electrode (PSE) overlapping the non-DA, circuit elements, and a shielding electrode connected to the PSE and overlapping some of the circuit elements; a display element layer on the circuit element layer and including: a light emitting element including a first electrode, a light emitting unit, and a second electrode, and a connection electrode connecting the second electrode to the PSE and including first through-holes; a thin film encapsulation layer (TFEL) on the display element layer and including an organic layer overlapping the DA; and an input sensing layer on the TFEL and including sensing electrodes and sensing signal lines connected to the sensing electrodes. The sensing signal lines overlap the connection electrode. Some of the first through-holes overlap the shielding electrode.Type: GrantFiled: February 17, 2023Date of Patent: February 27, 2024Assignee: Samsung Display Co., Ltd.Inventors: Ki Ho Bang, Seong Ryong Lee, Sang Hyun Jun
-
Publication number: 20230369240Abstract: In one example, a semiconductor device comprises a substrate comprising a conductive structure, a first electronic component over the substrate, an encapsulant over the substrate and contacting a lateral side of the first electronic component, a shield over the encapsulant and contacting a lateral side of the encapsulant and a portion of a lateral side of the substrate, and a communication structure coupled with the substrate. The substrate comprises a vertical groove side and a horizontal groove side defining a groove in the substrate, wherein a portion of the groove is uncovered by the shield. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: July 28, 2023Publication date: November 16, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Ji Hoon Oh, Dong Hyun Bang, Soo Jin Shin, Young Ik Kwon, Tae Kyeong Hwang, Min Jae Lee, Min Jae Kong
-
Patent number: 11781622Abstract: A chain tensioner transmits power of a crankshaft provided in an engine to peripheral auxiliary devices and guides a chain belt that transfers engine oil. The chain tensioner includes a body portion that tensions the chain belt through a pivot, the upper surface of the body portion includes an oil guiding rib that collects the engine oil scattered from the chain belt to the upper part, one surface of the body portion in contact with the upper surface includes a pivot journal, and one surface of the body portion includes a first oil flow path that guides the engine oil to flow down to the pivot journal.Type: GrantFiled: June 8, 2022Date of Patent: October 10, 2023Assignees: Hyundai Motor Company, Kia CorporationInventor: Sang Hyun Bang
-
Patent number: 11742300Abstract: In one example, a semiconductor device comprises a substrate comprising a conductive structure, a first electronic component over the substrate, an encapsulant over the substrate and contacting a lateral side of the first electronic component, a shield over the encapsulant and contacting a lateral side of the encapsulant and a portion of a lateral side of the substrate, and a communication structure coupled with the substrate. The substrate comprises a vertical groove side and a horizontal groove side defining a groove in the substrate, wherein a portion of the groove is uncovered by the shield. Other examples and related methods are also disclosed herein.Type: GrantFiled: June 7, 2022Date of Patent: August 29, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Ji Hoon Oh, Dong Hyun Bang, Soo Jin Shin, Young Ik Kwon, Tae Kyeong Hwang, Min Jae Lee, Min Jae Kong
-
Publication number: 20230257257Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.Type: ApplicationFiled: February 6, 2023Publication date: August 17, 2023Inventors: Yung Woo Lee, Byung Jun Kim, Dong Hyun Bang, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee
-
Publication number: 20230250279Abstract: A hard coating composition includes a norbomene-based compound represented by a Chemical Formula 1 and a polymer including at least one of an epoxy-based resin, a polyurethane-based resin, or an acrylic resin.Type: ApplicationFiled: December 13, 2022Publication date: August 10, 2023Inventors: KYUNGTAE KIM, BONG JIN MOON, JI HYUN BANG, SANG-IL PARK, SUNGGUK AN
-
Patent number: 11572269Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.Type: GrantFiled: November 2, 2020Date of Patent: February 7, 2023Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Yung Woo Lee, Byung Jun Kim, Dong Hyun Bang, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee
-
Publication number: 20220412452Abstract: A chain tensioner transmits power of a crankshaft provided in an engine to peripheral auxiliary devices and guides a chain belt that transfers engine oil. The chain tensioner includes a body portion that tensions the chain belt through a pivot, the upper surface of the body portion includes an oil guiding rib that collects the engine oil scattered from the chain belt to the upper part, one surface of the body portion in contact with the upper surface includes a pivot journal, and one surface of the body portion includes a first oil flow path that guides the engine oil to flow down to the pivot journal.Type: ApplicationFiled: June 8, 2022Publication date: December 29, 2022Applicants: Hyundai Motor Company, Kia CorporationInventor: Sang Hyun Bang
-
Publication number: 20220302044Abstract: In one example, a semiconductor device comprises a substrate comprising a conductive structure, a first electronic component over the substrate, an encapsulant over the substrate and contacting a lateral side of the first electronic component, a shield over the encapsulant and contacting a lateral side of the encapsulant and a portion of a lateral side of the substrate, and a communication structure coupled with the substrate. The substrate comprises a vertical groove side and a horizontal groove side defining a groove in the substrate, wherein a portion of the groove is uncovered by the shield. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: June 7, 2022Publication date: September 22, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Ji Hoon Oh, Dong Hyun Bang, Soo Jin Shin, Young Ik Kwon, Tae Kyeong Hwang, Min Jae Lee, Min Jae Kong
-
Publication number: 20220282352Abstract: The present invention relates to structural steel that can be desirably used in offshore structures and the like, more specifically, to a thin steel plate having excellent low-temperature toughness and CTOD properties, and to a method for manufacturing the same.Type: ApplicationFiled: August 21, 2020Publication date: September 8, 2022Applicant: POSCOInventors: Woo-Gyeom Kim, Sang-Ho Kim, Ki-Hyun Bang
-
Patent number: 11355451Abstract: In one example, a semiconductor device comprises a substrate comprising a conductive structure, a first electronic component over the substrate, an encapsulant over the substrate and contacting a lateral side of the first electronic component, a shield over the encapsulant and contacting a lateral side of the encapsulant and a portion of a lateral side of the substrate, and a communication structure coupled with the substrate. The substrate comprises a vertical groove side and a horizontal groove side defining a groove in the substrate, wherein a portion of the groove is uncovered by the shield. Other examples and related methods are also disclosed herein.Type: GrantFiled: August 25, 2020Date of Patent: June 7, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Ji Hoon Oh, Dong Hyun Bang, Soo Jin Shin, Young Ik Kwon, Tae Kyeong Hwang, Min Jae Lee, Min Jae Kong