Abstract: A cleaning composition for removing post-etch or post-ash residues from a semiconductor substrate, and a cleaning method using the same are disclosed. The cleaning composition can comprise water; a fluorine compound; an alkanolamine compound; and a corrosion inhibitor. The corrosion inhibitor is a mixture of a first corrosion inhibitor and a second corrosion inhibitor. When using the cleaning composition, it is possible to efficiently remove the residues of various aspects existing on a surface of the substrate or the semiconductor device without damage to a substrate or a semiconductor device including various metal layers, insulating layers, etc. Accordingly, when a highly integrated and miniaturized semiconductor device is manufactured, it may be advantageously applied to the removal of residues generated on the surface of the substrate or the semiconductor device.

Abstract: A method for manufacturing a trunnion for a constant velocity joint, the trunnion having a plurality of journal units provided outside around a hub unit, the method including a first step of manufacturing the trunnion, a second step of thermally treating a rounded outer circumferential surface of the journal unit, and a third step of thermally treating a connection unit disposed between the journal unit and the hub unit and having a diameter smaller than that of the journal unit.

Abstract: A method for manufacturing a trunnion for a constant velocity joint, the trunnion having a plurality of journal units provided outside around a hub unit, the method including a first step of manufacturing the trunnion, a second step of thermally treating a rounded outer circumferential surface of the journal unit, and a third step of thermally treating a connection unit disposed between the journal unit and the hub unit and having a diameter smaller than that of the journal unit.