Abstract: An organic light emitting display device includes a substrate, a display unit on the substrate, a sealing substrate on the display unit, a sealing member around the display unit and bonding the substrate and the sealing substrate, and a filler inside the sealing member and filling a gap between the substrate and the sealing substrate, wherein the filler is a non-hardening type, and a molecular weight of the filler is from about 100 kg/mol to about 5,000 kg/mol.

Abstract: An organic light emitting display device includes a substrate, a display unit on the substrate, a sealing substrate on the display unit, a sealing member around the display unit and bonding the substrate and the sealing substrate, and a filler inside the sealing member and filling a gap between the substrate and the sealing substrate, wherein the filler is a non-hardening type, and a molecular weight of the filler is from about 100 kg/mol to about 5,000 kg/mol.

Abstract: Provided is a display window for a display apparatus, the display window including a base plate; a plurality of first coating patterns on an entire first surface of the base plate spaced from one another; and a plurality of second coating patterns on an entire second surface of the base plate spaced from one another and corresponding to the first coating patterns. A width of each of the first coating patterns is less than a width of a corresponding second coating pattern.

Abstract: There is provided a flexible display device including a display panel for displaying an image, and a window substrate covering the touch screen panel, the widow substrate including a flexible base layer including an externally facing first surface, and a second surface opposite the first surface and facing the display panel, a hard coating layer having a hardness that is larger than that of the base layer, and including a plurality of coating tiles on the first surface of the base layer that are spaced to have a gap between adjacent ones of the coating tiles, and a self-healing coating layer including a self-healing material and covering the hard coating layer on the base layer.

Abstract: A display device according to one or more embodiments of the present invention includes: a flexible display panel that is configured to be widened or narrowed, the flexible display panel including a display part configured to display an image at a first surface of the flexible display panel, and a bending part configured to be folded in a direction away from the display part; and a driving unit including one or more rollers in close proximity to the bending part, and configured to rotate to widen or narrow the flexible display panel.

Abstract: A display device is disclosed. In one aspect, the display device includes a flexible display configured to display an image and a flexible adhesive layer formed on a side of the display and configured to adhere the display to an object that is not part of the display device. The adhesive layer includes a base layer and a plurality of adhesive projections extending from an outer surface of the base layer and configured to be adhered to the object.

Abstract: A flexible display device including a display panel configured to display an image, a touch screen panel on the display panel, and a window substrate covering the touch screen panel. The window substrate includes: a flexible base layer including a first surface facing an outside and a second surface facing the display panel in an opposite direction to the first surface; a first coating layer having hardness higher than that of the base layer and having a plurality of first coating tiles arranged on the first surface of the base layer thereof, at a first gap from each other; and a second coating layer having hardness higher than that of the base layer and having a plurality of second coating tiles arranged on a layer different from the first surface of the base layer thereof, at a second gap from each other.

Abstract: Disclosed herein is a flexible display device including a display panel displaying an image, a touch screen panel on the display panel, and a window substrate covering the touch screen panel. The window substrate includes: a flexible base layer including a first surface facing an outside and a second surface facing the display panel in an opposite direction to the first surface; and a coating layer having hardness higher than that of the base layer and having a plurality of coating tiles arranged on the first surface of the base layer thereof, each coating tile being spaced from adjacent ones of the coating tiles.

Abstract: A stretchable display device, including a stretchable display panel to display images; and a window on a touch sensing layer, the window including a soft part and a plurality of hard parts attached on a surface of the soft part, the hard parts including an attachment portion attached to the soft part and a non-attachment portion not attached to the soft part.

Abstract: Provided is a display window for a display apparatus, the display window including a base plate; a plurality of first coating patterns on an entire first surface of the base plate spaced from one another; and a plurality of second coating patterns on an entire second surface of the base plate spaced from one another and corresponding to the first coating patterns. A width of each of the first coating patterns is less than a width of a corresponding second coating pattern.

Abstract: An organic light-emitting display apparatus and a method of manufacturing the same are disclosed. An organic light-emitting display apparatus including a substrate, a display unit on the substrate, an encapsulation substrate on the display unit, a sealing member on an edge of the display unit, the sealing member being for bonding the substrate and the encapsulation substrate together, and a filling material filled between the display unit and the encapsulation substrate is disclosed. The filling material has a non-uniform dispersion of fillers such that an amount of the fillers in a first region closer to the display unit is higher than an amount of the fillers in a second region closer to the encapsulation substrate.

Abstract: Disclosed is an organic light emitting display device which prevents or inhibits external gas, such as, oxygen or moisture, from penetrating into a display unit and reinforces a mechanical strength by providing a first sealant and a second sealant. The organic light emitting display device may include: a first substrate; a display unit on the first substrate; a second substrate covering the display unit; a first sealant adhering the first substrate to the second substrate; and a second sealant around the first sealant, the second sealant sealing the first substrate and the second substrate. A filler may be included in the second sealant, and a particle size of the filler may be larger than a gap between the first substrate and the second substrate.

Abstract: There is provided an adhesive film and an organic light emitting display using the same. The adhesive film includes a first protective layer, an adhesive layer and a second protective layer. The adhesive layer is formed on the first protective layer and has a pattern formed in one surface thereof, the pattern including one or more openings shaped and sized to accommodate particulate matter. The second protective layer is formed on the adhesive layer.

Abstract: An organic light-emitting display apparatus and a method of manufacturing the same are disclosed. An organic light-emitting display apparatus including a substrate, a display unit on the substrate, an encapsulation substrate on the display unit, a sealing member on an edge of the display unit, the sealing member being for bonding the substrate and the encapsulation substrate together, and a filling material filled between the display unit and the encapsulation substrate is disclosed. The filling material has a non-uniform dispersion of fillers such that an amount of the fillers in a first region closer to the display unit is higher than an amount of the fillers in a second region closer to the encapsulation substrate.

Abstract: An organic light emitting display device includes a substrate, a display unit on the substrate, a sealing substrate on the display unit, a sealing member around the display unit and bonding the substrate and the sealing substrate, and a filler inside the sealing member and filling a gap between the substrate and the sealing substrate, wherein the filler is a non-hardening type, and a molecular weight of the filler is from about 100 kg/mol to about 5,000 kg/mol.

Abstract: Disclosed is an organic light emitting display device which prevents or inhibits external gas, such as, oxygen or moisture, from penetrating into a display unit and reinforces a mechanical strength by providing a first sealant and a second sealant. The organic light emitting display device may include: a first substrate; a display unit on the first substrate; a second substrate covering the display unit; a first sealant adhering the first substrate to the second substrate; and a second sealant around the first sealant, the second sealant sealing the first substrate and the second substrate. A filler may be included in the second sealant, and a particle size of the filler may be larger than a gap between the first substrate and the second substrate.

Abstract: A vacuum bonding tool method for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank. The shank is adapted for cooperative engagement with the suction part at the second end, and the shank has a plate at the second end to support the suction part. The suction part has a surface for contacting a semiconductor chip during pick-and place operation. According to the invention, the suction part is made of an elastically deformable conductive or non-conductive material. In various embodiments, the chip contacting surface of the elastically deformable suction part flat overall, or is concave, of has a flat central region and concave regions.

Abstract: A vacuum bonding tool for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank. The shank is adapted for cooperative engagement with the suction part at the second end, and the shank has a plate at the second end to support the suction part. The suction part has a surface for contacting a semiconductor chip during pick-and place operation. According to the invention, the suction part is made of an elastically deformable conductive or non-conductive material. In various embodiments, the chip contacting surface of the elastically deformable suction part flat overall, or is concave, of has a flat central region and concave regions.

Abstract: A vacuum bonding tool for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank. The shank is adapted for cooperative engagement with the suction part at the second end, and the shank has a plate at the second end to support the suction part. The suction part has a surface for contacting a semiconductor chip during pick-and place operation. According to the invention, the suction part is made of an elastically deformable conductive or non-conductive material. In various embodiments, the chip contacting surface of the elastically deformable suction part flat overall, or is concave, of has a flat central region and concave regions.

Abstract: Individual pieces of film adhesive (42) are placed on a support surface (46). Diced semiconductor chips (24) are individually placed on the individual pieces of the film adhesive thereby securing the diced semiconductor chips to the support surface to create first chip subassemblies (52). The diced semiconductor chip and support surface of each of a plurality of the first chip subassemblies are electrically connected, such as by wires (54), to create second chip subassemblies ((56). At least a portion of at least some of the second chip subassemblies are encapsulated, such as with molding compound (58), to create semiconductor chip packages (60).