Abstract: A semiconductor package includes first and second semiconductor elements electrically interconnected by a connection structure. The first and second semiconductor elements are joined by a protection structure that includes an adhesive layer surrounded by a retention layer.

Abstract: A semiconductor package including an internal package including at least one semiconductor chip sealed with an internal seal, an external substrate on which the internal package is mounted, and an external seal sealing the internal package is provided. Also provided is a method of manufacturing the semiconductor package including forming an internal package including at least one semiconductor chip sealed with an internal seal, mounting the internal package on an external substrate, and sealing the internal package with an external seal. The internal seal and the external seal have different Young's moduli, for example, a Young's modulus of the internal seal is smaller than a Young's modulus of the external seal. Accordingly, the semiconductor package is less susceptible to warpage and can be handled with relative ease in subsequent semiconductor package processes.

Abstract: A stack of semiconductor chips, a semiconductor device, and a method of manufacturing are disclosed. The stack of semiconductor chips may comprise a first chip of the stack, a second chip of the stack over the first chip, conductive bumps, a homogeneous integral underfill material, and a molding material. The conductive bumps may extend between an upper surface of the first chip and a lower surface of the second chip. The homogeneous integral underfill material may be interposed between the first chip and the second chip, encapsulate the conductive bumps, and extend along sidewalls of the second chip. The homogeneous integral underfill material may have an upper surface extending in a direction parallel to an upper surface of the second chip and located adjacent the upper surface of the second chip.

Abstract: A semiconductor package including an internal package including at least one semiconductor chip sealed with an internal seal, an external substrate on which the internal package is mounted, and an external seal sealing the internal package is provided. Also provided is a method of manufacturing the semiconductor package including forming an internal package including at least one semiconductor chip sealed with an internal seal, mounting the internal package on an external substrate, and sealing the internal package with an external seal. The internal seal and the external seal have different Young's moduli, for example, a Young's modulus of the internal seal is smaller than a Young's modulus of the external seal. Accordingly, the semiconductor package is less susceptible to warpage and can be handled with relative ease in subsequent semiconductor package processes.

Abstract: A stack of semiconductor chips, a semiconductor device, and a method of manufacturing are disclosed. The stack of semiconductor chips may comprise a first chip of the stack, a second chip of the stack over the first chip, conductive bumps, a homogeneous integral underfill material, and a molding material. The conductive bumps may extend between an upper surface of the first chip and a lower surface of the second chip. The homogeneous integral underfill material may be interposed between the first chip and the second chip, encapsulate the conductive bumps, and extend along sidewalls of the second chip. The homogeneous integral underfill material may have an upper surface extending in a direction parallel to an upper surface of the second chip and located adjacent the upper surface of the second chip.

Abstract: A method of controlling a portable device including at least one foldable panel and first and second touch screens is provided. The method includes displaying, on the first touch screen, a first page designated as a home screen and an icon related to at least one application, and a dock area, and displaying, on the second touch screen, first information in a state where the foldable panel is unfolded. The method also includes replacing the first page and the dock area with an outgoing call screen, receiving a phone number input, replacing the outgoing call screen with a dialing screen, and displaying, on the second touch screen, a guide message indicating to fold the portable device for a call. The method also includes replacing the dialing screen with a mid-call screen, and removing the guide message displayed on the second touch screen, and displaying the first information.

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a sealing member. The first semiconductor chip includes a substrate having a first surface and a second surface opposite to the first surface and having an opening that extends in a predetermined depth from the second surface, and a plurality of through electrodes extending in a thickness direction from the first surface, end portions of the through electrodes being exposed through a bottom surface of the opening. The second semiconductor chip is received in the opening and mounted on the bottom surface of the opening. The sealing member covers the second semiconductor chip in the opening.

Abstract: A semiconductor package including an internal package including at least one semiconductor chip sealed with an internal seal, an external substrate on which the internal package is mounted, and an external seal sealing the internal package is provided. Also provided is a method of manufacturing the semiconductor package including forming an internal package including at least one semiconductor chip sealed with an internal seal, mounting the internal package on an external substrate, and sealing the internal package with an external seal. The internal seal and the external seal have different Young's moduli, for example, a Young's modulus of the internal seal is smaller than a Young's modulus of the external seal. Accordingly, the semiconductor package is less susceptible to warpage and can be handled with relative ease in subsequent semiconductor package processes.

Abstract: A stack of semiconductor chips, a semiconductor device, and a method of manufacturing are disclosed. The stack of semiconductor chips may comprise a first chip of the stack, a second chip of the stack over the first chip, conductive bumps, a homogeneous integral underfill material, and a molding material. The conductive bumps may extend between an upper surface of the first chip and a lower surface of the second chip. The homogeneous integral underfill material may be interposed between the first chip and the second chip, encapsulate the conductive bumps, and extend along sidewalls of the second chip. The homogeneous integral underfill material may have an upper surface extending in a direction parallel to an upper surface of the second chip and located adjacent the upper surface of the second chip.

Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.

Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.

Abstract: According to example embodiments, an apparatus for picking up a semiconductor die includes an electromagnetic collet unit configured to selectively generate an attractive force between the electromagnetic collet unit and a magnetic wafer adhesive tape disposed on a surface of the semiconductor die. The apparatus further includes a transfer head unit attached to the electromagnetic collet unit, the transfer head unit structured to move the semiconductor die picked up by the collet unit through a drive of a drive device.

Abstract: Provided is a method of dicing a wafer where a plurality of semiconductor device regions is formed on a front side of the wafer, the semiconductor device regions being separated by scribe lanes, the method comprising dicing the wafer by irradiating a laser beam on a backside of the wafer along the scribe lanes. A laser beam is irradiated from an opposite side of the semiconductor device regions of the wafer so that thermal influence on the semiconductor device regions is minimized to improve the strength of a semiconductor chip. Furthermore, a third tape is used to maintain an arrangement of the semiconductor chips so as to minimize adherence problems caused by the laser beam.

Abstract: In one aspect, a method of manufacturing a semiconductor package includes providing a semiconductor substrate which includes a plurality of semiconductor chips and a scribe lane defined between the semiconductor chips, forming a trench within the scribe lane, filling the trench with a photolytic polymer, grinding a back side of the semiconductor substrate including the photolytic polymer within the trench, and radiating light onto a front surface of the semiconductor substrate to dissolve the photolytic polymer.

Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.