Patents by Inventor Hyun-Ki Kim

Hyun-Ki Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240081124
    Abstract: A display device includes a via insulating layer on a substrate; a first electrode on the via insulating layer; a pixel defining layer including an inclined region on the first electrode and including a first opening exposing a portion of the first electrode, and a flat region at a side of the inclined region and in contact with the via insulating layer; a light emitting layer on the portion of the first electrode exposed by the first opening; organic particles on the flat region of the pixel defining layer; an encapsulation layer covering the pixel defining layer, the light emitting layer, and the organic particles, and including a first layer, a second layer, and a third layer; and a first light blocking layer on the third layer of the encapsulation layer to overlap the flat region of the pixel defining layer and form a second opening.
    Type: Application
    Filed: May 8, 2023
    Publication date: March 7, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Hyun Ho KIM, Dong Uk KIM, Hyoeng Ki KIM, Hyeon Bum LEE, Hoon Gi LEE, Chaun Gi CHOI
  • Publication number: 20240073666
    Abstract: The present disclosure relates to a method of providing a proximal user networking service by means of a near-field communication network and a system therefor. Specifically, the present disclosure implements an environment in which, when an ad packet is broadcast using a certain host device, a guest device that receives the ad packet in the vicinity uploads relevant information to a service server, thereby allowing the host device to check guest devices that have been present in proximity thereto in the vicinity.
    Type: Application
    Filed: October 26, 2023
    Publication date: February 29, 2024
    Inventors: Seok Ki KIM, Jung In CHOI, Jae Kyu LEE, Keol HEO, Hyun Seo LIM
  • Publication number: 20240069658
    Abstract: A display device, includes: a light emitting element layer including a sub-pixel and a pixel defining film defining the sub-pixel; a thin film encapsulation layer on the light emitting element layer; a pseudo-reflection pattern overlapping the pixel defining film and formed on the thin film encapsulation film; a connection electrode on the pseudo-reflection pattern; a second touch insulating layer on the connection electrode; and a driving electrode and a sensing electrode on the second touch insulating layer, wherein a width of the connection electrode is greater than a width of the driving electrode.
    Type: Application
    Filed: August 15, 2023
    Publication date: February 29, 2024
    Inventors: Hyoeng Ki KIM, Hyeon Bum LEE, Hyun Ho KIM
  • Publication number: 20240071299
    Abstract: A display device includes connection lines, pulse amplitude modulation (PAM) data lines configured to receive pulse width modulation (PWM) data voltages, PWM data lines configured to receive the PWM data voltages, a first connection control line configured to receive a first connection control signal, a second connection control line configured to receive a second connection control signal, subpixels connected to the PWM data lines and the PAM data lines, and a first demultiplexer (demux) unit configured to connect the connection lines to the PAM data lines or to the PWM data lines according to the first connection control signal and the second connection control signal.
    Type: Application
    Filed: October 30, 2023
    Publication date: February 29, 2024
    Inventors: Jung Hwan HWANG, Hyun Joon KIM, Kye Uk LEE, Jun Ki JEONG, Sang Jin JEON
  • Patent number: 11880421
    Abstract: Disclosed herein are an apparatus and method for providing a search service based on important sentences. The apparatus for providing a search service based on important sentences includes memory in which at least one program and a previously trained word importance measurement model are recorded and a processor for executing the program. The program may include a word importance measurement unit for measuring the importance of each of multiple words included in input text in the corresponding input text based on the word importance measurement model and a sentence importance measurement unit for measuring the importance of each of at least one sentence included in the text based on the measured importance of each of the multiple words.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: January 23, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong-Jin Bae, Joon-Ho Lim, Min-Ho Kim, Hyun Kim, Hyun-Ki Kim, Ji-Hee Ryu, Kyung-Man Bae, Hyung-Jik Lee, Soo-Jong Lim, Myung-Gil Jang, Mi-Ran Choi, Jeong Heo
  • Patent number: 11862570
    Abstract: There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.
    Type: Grant
    Filed: August 19, 2022
    Date of Patent: January 2, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Joo Kim, Sun Chul Kim, Min Keun Kwak, Hyun Ki Kim, Hyung Gil Baek, Yong Kwan Lee
  • Patent number: 11771273
    Abstract: A drying apparatus includes a main body composed of a front end frame and a rear end frame. A fan receiving part may be disposed on the upper end of the front end frame and protruding forward therefrom, and a fan assembly may be located in the fan receiving part. The open part may be disposed at the lower part of the fan receiving part of the front end frame, and the outlets may be located along the upper end edge and opposite edges of the open part. Air may be delivered to the outlets through the duct disposed at the main body.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: October 3, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Seong Woo An, Yeon A Jo, Gi seop Kwon, Hyun Ki Kim, Dae woong Kim, Ji hye Lee, Min Kyu Oh
  • Patent number: 11732304
    Abstract: The present invention relates to a system for predicting prognosis and benefit from adjuvant chemotherapy for patients with stage II and III gastric cancer, and an algorithm that can predict prognosis and chemotherapy responsiveness using quantitative analysis results of mRNA expression levels of a prognosis or chemotherapy responsiveness-related marker gene group and a reference gene group in advanced gastric cancer is developed, and can be used as supplementary information to determine a method for treating a gastric cancer patient.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: August 22, 2023
    Assignee: Novomics Co., Ltd.
    Inventors: Jae Ho Cheong, Sung Hoon Noh, Yong Min Huh, Hyun Ki Kim
  • Patent number: 11699626
    Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: July 11, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-young Oh, Hyun-ki Kim, Sang-soo Kim, Seung-hwan Kim, Yong-kwan Lee
  • Publication number: 20230105610
    Abstract: Disclosed herein are an apparatus and method for providing a search service based on important sentences. The apparatus for providing a search service based on important sentences includes memory in which at least one program and a previously trained word importance measurement model are recorded and a processor for executing the program. The program may include a word importance measurement unit for measuring the importance of each of multiple words included in input text in the corresponding input text based on the word importance measurement model and a sentence importance measurement unit for measuring the importance of each of at least one sentence included in the text based on the measured importance of each of the multiple words.
    Type: Application
    Filed: November 24, 2021
    Publication date: April 6, 2023
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Yong-Jin BAE, Joon-Ho LIM, Min-Ho KIM, Hyun KIM, Hyun-Ki KIM, Ji-Hee RYU, Kyung-Man BAE, Hyung-Jik LEE, Soo-Jong LIM, Myung-Gil JANG, Mi-Ran CHOI, Jeong HEO
  • Patent number: 11560610
    Abstract: A copper alloy for valve seats, and more particularly a copper alloy for valve seats with improved wear resistance, contains 12 to 24% by weight of Ni, 2 to 4% by weight of Si, 7 to 13% by weight of Cr, 20 to 35% by weight of Fe, and a balance of Cu and other impurities.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: January 24, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Min Woo Kang, Soon Woo Kwon, Hyun Ki Kim, Chung An Lee, Seung Hyun Hong, Young Nam Kim
  • Patent number: 11562965
    Abstract: A semiconductor package includes a first substrate, a first semiconductor chip disposed on the first substrate, a second substrate disposed on the first semiconductor chip, a second semiconductor chip disposed on the second substrate, and a mold layer disposed between the first substrate and the second substrate. The second substrate includes a recess formed at an edge, the mold layer fills the recess, and the recess protrudes concavely inward from the edge of the second substrate toward a center of the second substrate.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: January 24, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sun Chul Kim, Sang Soo Kim, Yong Kwan Lee, Hyun Ki Kim, Seok Geun Ahn, Jun Young Oh
  • Publication number: 20220392845
    Abstract: There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.
    Type: Application
    Filed: August 19, 2022
    Publication date: December 8, 2022
    Inventors: Jung Joo KIM, Sun Chul KIM, Min Keun KWAK, Hyun Ki KIM, Hyung Gil BAEK, Yong Kwan LEE
  • Patent number: 11479842
    Abstract: A heat treatment method of a component for a vehicle includes: heating an inner space of a heat treatment furnace in which a component for a vehicle is disposed in the inner space; stabilizing hydrogen (H2) by injecting the H2 into the inner space; and performing nitrification heat treatment for the component by injecting only ammonia (NH3) into the inner space after the stabilizing. The heat treatment method may adjust the degree of vacuum and the flow rate instead of a Kn without additionally injecting the H2 gas into an NH3 gas, thereby implementing the nitrification heat treatment of a quality similar to that of a conventional nitrification heat treatment for a short time.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: October 25, 2022
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Dong-Hwi Kim, Soon-Woo Kwon, Chung-An Lee, Hyun-Ki Kim, Seung-Hyun Hong, Min-Woo Kang
  • Patent number: 11450614
    Abstract: There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: September 20, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Joo Kim, Sun Chul Kim, Min Keun Kwak, Hyun Ki Kim, Hyung Gil Baek, Yong Kwan Lee
  • Publication number: 20220178010
    Abstract: A heat treatment method of a component for a vehicle includes: heating an inner space of a heat treatment furnace in which a component for a vehicle is disposed in the inner space; stabilizing hydrogen (H2) by injecting the H2 into the inner space; and performing nitrification heat treatment for the component by injecting only ammonia (NH3) into the inner space after the stabilizing. The heat treatment method may adjust the degree of vacuum and the flow rate instead of a Kn without additionally injecting the H2 gas into an NH3 gas, thereby implementing the nitrification heat treatment of a quality similar to that of a conventional nitrification heat treatment for a short time.
    Type: Application
    Filed: February 12, 2021
    Publication date: June 9, 2022
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Dong-Hwi Kim, Soon-Woo Kwon, Chung-An Lee, Hyun-Ki Kim, Seung-Hyun Hong, Min-Woo Kang
  • Publication number: 20220108076
    Abstract: The present invention relates to an apparatus and method for automatically generating machine reading comprehension training data, and more particularly, to an apparatus and method for automatically generating and managing machine reading comprehension training data based on text semantic analysis. The apparatus for automatically generating machine reading comprehension training data according to the present invention includes a domain selection text collection unit configured to collect pieces of text data according to domains and subjects, a paragraph selection unit configured to select a paragraph using the pieces of collected text data and determine whether questions and correct answers are generatable, and a question and correct answer generation unit configured to generate questions and correct answers from the selected paragraph.
    Type: Application
    Filed: October 7, 2021
    Publication date: April 7, 2022
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Yong Jin BAE, Joon Ho LIM, Min Ho KIM, Hyun KIM, Hyun Ki KIM, Ji Hee RYU, Kyung Man BAE, Hyung Jik LEE, Soo Jong LIM, Myung Gil JANG, Mi Ran CHOI, Jeong HEO
  • Publication number: 20220090253
    Abstract: A carburizing steel includes, based on a total wt % of the carburizing steel: 0.1 wt % or more and 0.3 wt % or less of C (carbon); 2.0 wt % or more and 2.7 wt % or less of Cr (chrome); 0.4 wt % or more of Si (silicon); 0.3 wt % or more and 0.7 wt % or less of Mo (molybdenum); less than 0.7 wt % of Mn (manganese); and 0.6 wt % or more and 1.5 wt % or less of Ni (nickel).
    Type: Application
    Filed: January 14, 2021
    Publication date: March 24, 2022
    Inventors: Min-Woo Kang, Soon-Woo Kwon, Min-Woo Kang, Hyun-Ki Kim, Dong-Hwi Kim, In-Beom Lee, Chung-An Lee, Seung-Hyun Hong
  • Publication number: 20220079397
    Abstract: A drying apparatus includes a main body composed of a front end frame and a rear end frame. A fan receiving part may be disposed on the upper end of the front end frame and protruding forward therefrom, and a fan assembly may be located in the fan receiving part. The open part may be disposed at the lower part of the fan receiving part of the front end frame, and the outlets may be located along the upper end edge and opposite edges of the open part. Air may be delivered to the outlets through the duct disposed at the main body.
    Type: Application
    Filed: January 19, 2021
    Publication date: March 17, 2022
    Inventors: Seong Woo An, Yeon A Jo, Gi seop Kwon, Hyun Ki Kim, Dae woong Kim, Ji hye Lee, Min Kyu Oh
  • Publication number: 20220061603
    Abstract: A main body (100) may constitute the frame of a drying apparatus, and a moving bar (230) may be mounted to the main body (100) to move up and down along the front surface thereof. The moving bar (230) may be moved up and down by being driven by the drive assembly (210). Most of the drive assembly (210) may be installed at a position corresponding to the installation space (150) of a duct (130) formed in the main body (100).
    Type: Application
    Filed: January 19, 2021
    Publication date: March 3, 2022
    Inventors: Seong Woo An, Seung Yup Lee, Min Kyu Oh, Hyun Ki Kim, Dae Woong Kim, Yang Hwan No, Sang Yoon Lee, Byung Soo Oh, Yeon A Jo, Gi Seop Kwon