Patents by Inventor Hyun Kyu Im

Hyun Kyu Im has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088198
    Abstract: A display device comprises a first electrode, a second electrode disposed to be spaced apart from the first electrode and face the first electrode, a first insulating layer disposed to cover the first electrode and the second electrode, a second insulating layer disposed on at least a part of the first insulating layer and exposing at a part of a region where the first electrode and the second electrode overlaps the first insulating layer and at least one light emitting element on the exposed first insulating layer between the first electrode and the second electrode, wherein the second insulating layer includes at least one opening exposing the first insulating layer and disposed to be spaced apart from each other on a region where the first electrode and the second electrode face each other, and a bridge portion between the openings, and the light emitting element is disposed on the opening.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 14, 2024
    Inventors: Hyun Min CHO, Dae Hyun KIM, Jin Oh KWAG, Dong Hyun KIM, Keun Kyu SONG, Hyun Deok IM, Sung Chan JO
  • Publication number: 20230132788
    Abstract: A coil component includes a body including one surface and a plurality of side surfaces respectively connected to the one surface, a coil portion disposed within the body, and a lead-out portion disposed within the body and connected to the coil portion. The body includes a groove portion disposed in a corner where two adjacent side surfaces of the plurality of side surfaces of the body are in contact with each other. The groove portion has a width narrower than a width of the body, and extends from a portion of the lead-out portion.
    Type: Application
    Filed: September 30, 2022
    Publication date: May 4, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Hyun Kyu IM
  • Patent number: 9447482
    Abstract: The present invention relates to a magnesium-based alloy, and to a method for producing same. The method comprises the steps of: melting a magnesium alloy into a liquid state; adding a silicon compound to said molten magnesium alloy; exhausting the silicon compound through a full reaction between said molten magnesium alloy and said added silicon compound such that the silicon compound does not substantially remain in the magnesium alloy; and exhausting the silicon produced as a result of said exhaustion in the precious step such that the silicon may not substantially remain in said magnesium alloy.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: September 20, 2016
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Shae K. Kim, Young Ok Yoon, Jin Kyu Lee, Jung Ho Seo, Hyun Kyu Im
  • Publication number: 20140202284
    Abstract: The present invention relates to a magnesium-based alloy, and to a method for producing same. The method comprises the steps of: melting a magnesium alloy into a liquid state; adding a silicon compound to said molten magnesium alloy; exhausting the silicon compound through a full reaction between said molten magnesium alloy and said added silicon compound such that the silicon compound does not substantially remain in the magnesium alloy; and exhausting the silicon produced as a result of said exhaustion in the precious step such that the silicon may not substantially remain in said magnesium alloy.
    Type: Application
    Filed: May 18, 2012
    Publication date: July 24, 2014
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Shae K. Kim, Young Ok Yoon, Jin Kyu Lee, Jung Ho Seo, Hyun Kyu Im
  • Patent number: 8675342
    Abstract: Disclosed herein are a stacked chip device including: a stacked body in which a plurality of sheets having an internal electrode made of a conductive material are stacked; external electrodes provided at both sides of the stacked body; and connection electrodes extending from the internal electrode and electrically connecting the internal electrode with the external electrodes, wherein the connection electrodes include: a plating solution permeation preventing section extending from the internal electrode, however, extending with a thickness smaller than the thickness of the internal electrode; and a contact reinforcement section extending from the plating solution permeation preventing section, however, extending in the form in which the thickness thereof is gradually extended toward the external electrode, and a manufacturing method thereof.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: March 18, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Beom Shin, Hyun Woo Kim, Doo Young Kim, Hyung Kyu Shim, Hyun Kyu Im, Youn Sik Jin, Dong Gun Kim
  • Publication number: 20120320496
    Abstract: Disclosed herein are a stacked chip device including: a stacked body in which a plurality of sheets having an internal electrode made of a conductive material are stacked; external electrodes provided at both sides of the stacked body; and connection electrodes extending from the internal electrode and electrically connecting the internal electrode with the external electrodes, wherein the connection electrodes include: a plating solution permeation preventing section extending from the internal electrode, however, extending with a thickness smaller than the thickness of the internal electrode; and a contact reinforcement section extending from the plating solution permeation preventing section, however, extending in the form in which the thickness thereof is gradually extended toward the external electrode, and a manufacturing method thereof.
    Type: Application
    Filed: June 12, 2012
    Publication date: December 20, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Beom Shin, Hyun Woo Kim, Doo Young Kim, Hyung Kyu Shim, Hyun Kyu Im, Youn Sik Jin, Dong Gun Kim