Patents by Inventor Hyun-Su YUN

Hyun-Su YUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240177865
    Abstract: A method of predicting pressure ulcers is provided. The method includes predicting, by a first pressure ulcer predictor, occurrence of pressure ulcers of a patient to output first prediction result data, based on body data of the patient, predicting, by a second pressure ulcer predictor, occurrence of pressure ulcers of the patient to output second prediction result data, based on whole body pressure data of the patient, predicting, by a third pressure ulcer predictor, occurrence of pressure ulcers of the patient to output third prediction result data, based on skin image data of the patient, and concatenating the first to third prediction result data to output final prediction result data.
    Type: Application
    Filed: June 22, 2023
    Publication date: May 30, 2024
    Inventors: Jeong Eun KIM, Seihyoung LEE, Hyun Seo KANG, Gi Hyeon MIN, Kwang Su YUN, Kwon-Seob LIM
  • Publication number: 20240097535
    Abstract: An electric compressor capable of reducing a size and lightening weight of a package of an inverter unit, as a common mode choke (CM choke) is disposed radially outside of a circuit board of the inverter unit, and a high voltage connector, a CM choke, and a low voltage connector are integrated into a support body.
    Type: Application
    Filed: September 6, 2022
    Publication date: March 21, 2024
    Inventors: Hyun Woo Lee, Min Gyu Kim, Sang Woo Bae, Hye Rim An, Sung Taeg Oh, Je Su Yun
  • Publication number: 20220285886
    Abstract: A high-speed communication connector capable of improving transmission quality and of controlling transmission characteristics is disclosed. The connector is a board-to-board-type connector for high-speed data communication in band of 10 to 25 GHz, and is constructed so as to reduce signal interference by virtue of a finger body having a PCB structure and shield structures between signal lines of a receptacle body filled with a dielectric material and to realize matching between impedances by virtue of the dielectric material and the signal lines.
    Type: Application
    Filed: August 25, 2020
    Publication date: September 8, 2022
    Applicant: EL TECH Co., Ltd.
    Inventors: Hyun-Su YUN, Jong-Moon KIM, Dong-Won YANG