Patents by Inventor Hyun-Suk Lee

Hyun-Suk Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11475423
    Abstract: A printing method performed by an image forming apparatus is provided. The image forming apparatus receives job information of content, and generates payment amount information based on the job information of the content. The image forming apparatus receives payment method information from a user, and generates billing information by using the payment amount information and the payment method information. The image forming apparatus transmits the billing information to a payment system.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: October 18, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hyun Suk Lee, Min Hyun Kim, Seon Ae Park, Su Dong Kim, Yun Jong Lee
  • Publication number: 20220328303
    Abstract: Semiconductor devices are provided. A semiconductor device includes a first portion of a lower electrode structure on a substrate. The semiconductor device includes a first support pattern being in contact with a first portion of a sidewall of the first portion of the lower electrode structure. The semiconductor device includes a second portion of the lower electrode structure on a second portion of the sidewall of the first portion of the lower electrode structure. The semiconductor device includes an upper electrode on the second portion of the lower electrode structure and on the first support pattern. Moreover, the semiconductor device includes a dielectric layer between the upper electrode and the second portion of the lower electrode structure.
    Type: Application
    Filed: June 28, 2022
    Publication date: October 13, 2022
    Inventors: Hyun-Suk Lee, Jungoo Kang, Gihee Cho, Sanghyuck Ahn
  • Patent number: 11411075
    Abstract: A semiconductor device and a method of manufacturing the same, the device including a plurality of lower electrodes on a semiconductor substrate; a support pattern connecting the lower electrodes at sides of the lower electrodes; and a dielectric layer covering the lower electrodes and the support pattern, wherein each of the plurality of lower electrodes includes a pillar portion extending in a vertical direction perpendicular to a top surface of the semiconductor substrate; and a protrusion protruding from a sidewall of the pillar portion so as to be in contact with the support pattern, the pillar portion includes a conductive material, the protrusion includes a same conductive material as the pillar portion and is further doped with impurities.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: August 9, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gihee Cho, Sangyeol Kang, Jungoo Kang, Taekyun Kim, Jiwoon Park, Sanghyuck Ahn, Jin-Su Lee, Hyun-Suk Lee, Hongsik Chae
  • Patent number: 11404266
    Abstract: Semiconductor devices are provided. A semiconductor device includes a first portion of a lower electrode structure on a substrate. The semiconductor device includes a first support pattern being in contact with a first portion of a sidewall of the first portion of the lower electrode structure. The semiconductor device includes a second portion of the lower electrode structure on a second portion of the sidewall of the first portion of the lower electrode structure. The semiconductor device includes an upper electrode on the second portion of the lower electrode structure and on the first support pattern. Moreover, the semiconductor device includes a dielectric layer between the upper electrode and the second portion of the lower electrode structure.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: August 2, 2022
    Inventors: Hyun-Suk Lee, Jungoo Kang, Gihee Cho, Sanghyuck Ahn
  • Publication number: 20220216209
    Abstract: A semiconductor memory device includes a capacitor having a bottom electrode and a top electrode, a dielectric layer between the bottom and top electrodes, and an interface layer between the top electrode and the dielectric layer, the interface layer including a metal oxide and an additional constituent at a grain boundary of the interface layer.
    Type: Application
    Filed: March 23, 2022
    Publication date: July 7, 2022
    Inventors: Gihee CHO, Jungoo KANG, Hyun-Suk LEE, Sanghyuck AHN
  • Patent number: 11342329
    Abstract: A semiconductor memory device includes a capacitor having a bottom electrode and a top electrode, a dielectric layer between the bottom and top electrodes, and an interface layer between the top electrode and the dielectric layer, the interface layer including a metal oxide and an additional constituent at a grain boundary of the interface layer.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: May 24, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gihee Cho, Jungoo Kang, Hyun-Suk Lee, Sanghyuck Ahn
  • Publication number: 20220139335
    Abstract: The present disclosure relates to a display panel and a display device using the same. The display panel includes a pixel array in which a plurality of data lines, a plurality of gate lines crossing the data lines, and a plurality of pixels are disposed; a first gate driver configured to supply a gate signal to gate lines connected to pixels disposed in a first area of the pixel array; and a second gate driver configured to receive a carry signal from the first gate driver and supply a gate signal to gate lines connected to pixels disposed in a second area of the pixel array. The second gate driver includes a signal transmission unit disposed in the pixel array to receive the carry signal from the first gate driver.
    Type: Application
    Filed: October 5, 2021
    Publication date: May 5, 2022
    Applicant: LG DISPLAY CO., LTD.
    Inventors: Hyun Suk LEE, Seung Taek OH
  • Publication number: 20220037325
    Abstract: A semiconductor device includes a substrate, first and second supporter patterns stacked sequentially on the substrate in a first direction and spaced apart from an upper surface of the substrate, a lower electrode hole that extends through the first and second supporter patterns on the substrate in the first direction, an interface film on side walls and a bottom surface of the lower electrode hole, a lower electrode inside of the lower electrode hole on the interface film, a capacitor dielectric film that is in physical contact with side walls of the interface film, an uppermost surface of the interface film, and an uppermost surface of the lower electrode, the uppermost surface of the interface film is formed on a same plane as an upper surface of the second supporter pattern.
    Type: Application
    Filed: April 1, 2021
    Publication date: February 3, 2022
    Inventors: Jun Goo Kang, Sang Hyuck Ahn, Sang Yeol Kang, Jin-Su Lee, Hyun-Suk Lee, Gi Hee Cho, Hong Sik Chae
  • Publication number: 20220037461
    Abstract: A semiconductor device and a method of manufacturing the same, the device including a plurality of lower electrodes on a semiconductor substrate; a support pattern connecting the lower electrodes at sides of the lower electrodes; and a dielectric layer covering the lower electrodes and the support pattern, wherein each of the plurality of lower electrodes includes a pillar portion extending in a vertical direction perpendicular to a top surface of the semiconductor substrate; and a protrusion protruding from a sidewall of the pillar portion so as to be in contact with the support pattern, the pillar portion includes a conductive material, the protrusion includes a same conductive material as the pillar portion and is further doped with impurities.
    Type: Application
    Filed: March 2, 2021
    Publication date: February 3, 2022
    Inventors: Gihee CHO, Sangyeol KANG, Jungoo KANG, Taekyun KIM, Jiwoon PARK, Sanghyuck AHN, Jin-Su LEE, Hyun-Suk LEE, Hongsik CHAE
  • Patent number: 11234910
    Abstract: The present invention relates to a capsule comprising a pigment and a method for producing the same. More specifically, the present invention relates to a capsule which comprises therein a pigment inside which is likely to be discolored due to external environment, and thereby can easily crack or break and cause color development when applied to the skin, while isolating the pigment from the external environment, and a method for producing the same.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: February 1, 2022
    Assignee: AMOREPACIFIC CORPORATION
    Inventors: Yan Li, Hyun Suk Lee, Sun Kyung Choi, Yong Jin Kim, John Hwan Lee, Eun Jeong Kim
  • Patent number: 11232422
    Abstract: An electronic device and an operating method of an electronic device are provided. The operating method includes obtaining first policy information including device information of a first image forming apparatus and information of a payment process with respect to the first image forming apparatus, preparing one or more applications used for driving the first image forming apparatus or used for the payment process, based on the first policy information, receiving a request for a first job of the first image forming apparatus and generating, based on the first policy information, first charging information corresponding to the first job, calling a first application from among the one or more applications used to pay a first payment amount based on the first charging information, and, when the first payment amount is paid via the first application, controlling the first image forming apparatus to perform the first job.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: January 25, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Hyun Suk Lee
  • Publication number: 20210390220
    Abstract: A method for auto-generating an AutoCAD drawing includes providing an interface for extracting only input data required for drawing equipment from strength calculation data, displaying all components and nozzles constituting the equipment and providing or correcting information thereon. The AutoCAD drawing is automatically generated based on information on all components constituting the equipment and nozzles.
    Type: Application
    Filed: June 10, 2021
    Publication date: December 16, 2021
    Applicants: SAMSUNG ENGINEERING CO., LTD.
    Inventors: Gyun Ho HA, Hyun Suk LEE, Young Sik JI, Yun Ha SHIN, Geun Yong CHOI, Do Young PARK, Sung Jin MOON, Won Seok CHOI, Ji Yoon HYUN
  • Patent number: 11195474
    Abstract: A display device and a driving method thereof are discussed. This display device receives first and second input reference voltages, generates gamma reference voltages having different voltage levels, receives each of the gamma reference voltages, and generates a data voltage of pixel data. The first and second input reference voltages and the reference voltage are changed according to a variation of the pixel driving voltage.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: December 7, 2021
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Seung Jin Yoo, Sang Jin Nam, Hyun Suk Lee
  • Patent number: 11128880
    Abstract: A method in which a server recognizes and determines an object in an image may include calculating a feature map including an object feature point within the image by learning the image based on a first model, calculating compression feature information by compressing the feature map based on a first filter, inputting the compression feature information for each at least one layer and calculating respective prediction information by learning the compression feature information for each layer based on a second model, and calculating prediction result information by determining whether the respective prediction information sequentially exceeds a predetermined threshold value in order from a top layer.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: September 21, 2021
    Assignee: doinglab Corp.
    Inventors: Jae Yeol Kim, Dae Han Kim, Hyun Suk Lee
  • Publication number: 20210273041
    Abstract: An integrated circuit device includes a conductive region on a substrate and a lower electrode structure including a main electrode part spaced apart from the conductive region and a bridge electrode part between the main electrode part and the conductive region. A dielectric layer contacts an outer sidewall of the main electrode part. To manufacture the integrated circuit device, a preliminary bridge electrode layer is formed in a hole of a mold pattern on the substrate, and the main electrode part is formed on the preliminary bridge electrode layer in the hole. The mold pattern is removed to expose a sidewall of the preliminary bridge electrode layer, and a portion of the preliminary electrode part is removed to form the bridge electrode part. The dielectric layer is formed to contact the outer sidewall of the main electrode part.
    Type: Application
    Filed: May 18, 2021
    Publication date: September 2, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jun-goo KANG, Hyun-suk LEE, Gi-hee CHO
  • Publication number: 20210241244
    Abstract: An electronic device and an operating method of an electronic device are provided. The operating method includes obtaining first policy information including device information of a first image forming apparatus and information of a payment process with respect to the first image forming apparatus, preparing one or more applications used for driving the first image forming apparatus or used for the payment process, based on the first policy information, receiving a request for a first job of the first image forming apparatus and generating, based on the first policy information, first charging information corresponding to the first job, calling a first application from among the one or more applications used to pay a first payment amount based on the first charging information, and, when the first payment amount is paid via the first application, controlling the first image forming apparatus to perform the first job.
    Type: Application
    Filed: December 18, 2018
    Publication date: August 5, 2021
    Inventor: Hyun Suk LEE
  • Patent number: 11057945
    Abstract: The present disclosure provides an apparatus and a method for random access in a wireless communication system having a base station and wireless terminals, where the wireless terminal can select a detection sub-segment from a preamble detection segment that is divided into a multiple number of detection sub-segments, transmit a random access preamble with the timing adjusted such that the random access preamble is received at the base station in the selected detection sub-segment, and when a random access response message is received from the base station, transmit a terminal identification message to the base station and receive a contention resolution message from the base station.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: July 6, 2021
    Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Jang Won Lee, Byung Hyun Lee, Seok Jae Moon, Hyun Suk Lee
  • Patent number: 11031460
    Abstract: An integrated circuit device includes a conductive region on a substrate and a lower electrode structure including a main electrode part spaced apart from the conductive region and a bridge electrode part between the main electrode part and the conductive region. A dielectric layer contacts an outer sidewall of the main electrode part. To manufacture the integrated circuit device, a preliminary bridge electrode layer is formed in a hole of a mold pattern on the substrate, and the main electrode part is formed on the preliminary bridge electrode layer in the hole. The mold pattern is removed to expose a sidewall of the preliminary bridge electrode layer, and a portion of the preliminary electrode part is removed to form the bridge electrode part. The dielectric layer is formed to contact the outer sidewall of the main electrode part.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: June 8, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-goo Kang, Hyun-suk Lee, Gi-hee Cho
  • Publication number: 20210159310
    Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.
    Type: Application
    Filed: January 13, 2021
    Publication date: May 27, 2021
    Inventors: Hyun-suk LEE, Ji-won YU, Ji-woon PARK
  • Publication number: 20210134803
    Abstract: A semiconductor memory device includes a capacitor having a bottom electrode and a top electrode, a dielectric layer between the bottom and top electrodes, and an interface layer between the top electrode and the dielectric layer, the interface layer including a metal oxide and an additional constituent at a grain boundary of the interface layer.
    Type: Application
    Filed: June 17, 2020
    Publication date: May 6, 2021
    Inventors: Gihee CHO, Jungoo KANG, Hyun-Suk LEE, Sanghyuck AHN