Patents by Inventor Hyun Tae Jang
Hyun Tae Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11805633Abstract: According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.Type: GrantFiled: July 11, 2018Date of Patent: October 31, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyun-Tae Jang, Min Park, Byung Hoon Lee, Youngchul Lee, Changjoon Lee, Jiyoung Jang, Youngjun Moon, Minyoung Park, Jeonggen Yoon, Won Choi, Siho Jang
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Patent number: 11387220Abstract: A display according to one embodiment of the present invention comprises: a light-transmitting first layer and including a plurality of cavities; a plurality of light-emitting diode (LED) chips disposed in the cavities; and a second layer including a circuit electrically connected to the plurality of LED chips. Various other embodiments are also possible.Type: GrantFiled: July 17, 2018Date of Patent: July 12, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung Woon Jang, Hyun-Tae Jang, Youngjun Moon, Changjoon Lee
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Patent number: 11355479Abstract: A display according to one embodiment of the present invention comprises: a light-transmitting first layer and including a plurality of cavities; a plurality of light-emitting diode (LED) chips disposed in the cavities; and a second layer including a circuit electrically connected to the plurality of LED chips. Various other embodiments are also possible.Type: GrantFiled: July 17, 2018Date of Patent: June 7, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung Woon Jang, Hyun-Tae Jang, Youngjun Moon, Changjoon Lee
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Patent number: 11032952Abstract: An electronic device includes a printed circuit board (PCB) including a first surface, a second surface facing a direction opposite the first surface, and a side surface surrounding a space between the first surface and the second surface, at least one component disposed on the first surface, a shield can surrounding the at least one component and a partial area of the PCB, and an adhesive that bonds the shield can and the first surface, and that bonds the shield can and the second surface, and at least a portion of the shield can does not bond with the side surface.Type: GrantFiled: March 13, 2018Date of Patent: June 8, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Chang Joon Lee, Yong Won Lee, Hyun Tae Jang
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Publication number: 20210136966Abstract: According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.Type: ApplicationFiled: July 11, 2018Publication date: May 6, 2021Inventors: Hyun-Tae JANG, Min PARK, Byung Hoon LEE, Youngchul LEE, Changjoon LEE, Jiyoung JANG, Youngjun MOON, Minyoung PARK, Jeonggen YOON, Won CHOI, Siho JANG
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Publication number: 20200235078Abstract: A display according to one embodiment of the present invention comprises: a light-transmitting first layer and including a plurality of cavities; a plurality of light-emitting diode (LED) chips disposed in the cavities; and a second layer including a circuit electrically connected to the plurality of LED chips. Various other embodiments are also possible.Type: ApplicationFiled: July 17, 2018Publication date: July 23, 2020Inventors: Kyung Woon JANG, Hyun-Tae JANG, Youngjun MOON, Changjoon LEE
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Patent number: 10698461Abstract: An electronic device according to an embodiment includes a battery supplying power to the electronic device, at least one circuit board having one or more components disposed thereon, a first temperature sensor disposed in a first region of the circuit board that is adjacent to one of the one or more components, a second temperature sensor disposed in a second region away from the first region, and a processor configured to measure a first temperature corresponding to the first region using the first temperature sensor, measure a second temperature corresponding to the second region or the outside of the electronic device using the second temperature sensor, determine a third temperature for the battery based at least on the first and second temperatures, and control the use of a resource of the electronic device when the third temperature satisfies a specified condition. Other various embodiments are also possible.Type: GrantFiled: December 21, 2017Date of Patent: June 30, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Ki Youn Jang, Kyung Ha Koo, Kun Tak Kim, Hyun Tae Jang, Chi Hwan Jeong, Chi Hyun Cho
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Patent number: 10573951Abstract: A split resonator and a printed circuit board (PCB) including the same are disclosed. The split resonator is mounted to one side of the PCB to improve the electromagnetic shielding effect, and absorbs a radiation field emitted to the outer wall of the PCB. The PCB includes: a substrate on which one or more electronic components are populated; a dielectric substrate mounted to one side of the substrate; one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and a connection portion configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate.Type: GrantFiled: May 24, 2017Date of Patent: February 25, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Soon Yong Lee, Yeon Sik Yu, Il Kim, Keon Young Seo, Min-Goo Seo, Jae-Deok Lim, Si Ho Jang, Hyun-Tae Jang
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Patent number: 10542646Abstract: According to various embodiments of the present disclosure, a metal unit may include: a core metal layer that is mainly composed of iron (Fe); and an outer layer formed on at least one face of the core metal layer, and bonded to solder so as to be attached to a printed circuit board. The metal unit and an electronic device including the same may be variously implemented according to embodiments.Type: GrantFiled: March 27, 2018Date of Patent: January 21, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Chang-Joon Lee, Yong-Won Lee, Hyun-Tae Jang
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Patent number: 10117367Abstract: A fastening structure for a shield can is capable of ensuring easy attachment/detachment of the shield can and prevents deformation caused by excessive impact when the shield can is attached and detached by improving the fastening structure for a shield can fixed to a printed circuit board. The fastening structure for a shield can provided to shield a printed circuit board on which electronic components are mounted and the electronic components from electromagnetic waves includes a frame provided with a fixing part allowing the frame to be fixed to the printed circuit board, a shield cover provided to surround an outer side of the frame, fastening parts provided at the shield cover and the frame, respectively, such that the shield cover and the frame are attached/detached to/from each other. The fastening parts and the fixing part are disposed without overlapping each other.Type: GrantFiled: February 18, 2015Date of Patent: October 30, 2018Assignees: SAMSUNG ELECTRONIC CO., LTD., S-CONNECT CO., LTD.Inventors: Hyun-Tae Jang, Yong Won Lee, Jung Je Bang, Kwang Sub Lee
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Publication number: 20180279516Abstract: According to various embodiments of the present disclosure, a metal unit may include: a core metal layer that is mainly composed of iron (Fe); and an outer layer formed on at least one face of the core metal layer, and bonded to solder so as to be attached to a printed circuit board. The metal unit and an electronic device including the same may be variously implemented according to embodiments.Type: ApplicationFiled: March 27, 2018Publication date: September 27, 2018Inventors: Chang-Joon LEE, Yong-Won LEE, Hyun-Tae JANG
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Publication number: 20180270997Abstract: An electronic device includes a printed circuit board (PCB) including a first surface, a second surface facing a direction opposite the first surface, and a side surface surrounding a space between the first surface and the second surface, at least one component disposed on the first surface, a shield can surrounding the at least one component and a partial area of the PCB, and an adhesive that bonds the shield can and the first surface, and that bonds the shield can and the second surface, and at least a portion of the shield can does not bond with the side surface.Type: ApplicationFiled: March 13, 2018Publication date: September 20, 2018Inventors: Chang Joon LEE, Yong Won LEE, Hyun Tae JANG
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Publication number: 20180181171Abstract: An electronic device according to an embodiment includes a battery supplying power to the electronic device, at least one circuit board having one or more components disposed thereon, a first temperature sensor disposed in a first region of the circuit board that is adjacent to one of the one or more components, a second temperature sensor disposed in a second region away from the first region, and a processor configured to measure a first temperature corresponding to the first region using the first temperature sensor, measure a second temperature corresponding to the second region or the outside of the electronic device using the second temperature sensor, determine a third temperature for the battery based at least on the first and second temperatures, and control the use of a resource of the electronic device when the third temperature satisfies a specified condition. Other various embodiments are also possible.Type: ApplicationFiled: December 21, 2017Publication date: June 28, 2018Inventors: Ki Youn Jang, Kyung Ha Koo, Kun Tak Kim, Hyun Tae Jang, Chi Hwan Jeong, Chi Hyun Cho
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Patent number: 10010016Abstract: A shield can device is provided. The shield can device includes a frame which is fixed to a printed circuit board (PCB) and surrounds at least one circuit device as an electromagnetic shielding target, a cover which is coupled to the frame and closes an opening formed in a top of the frame, and a plurality of contact projections which are formed between the frame and the cover and allow the frame and the cover to be in electrical contact with each other.Type: GrantFiled: January 25, 2017Date of Patent: June 26, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae-deok Lim, Jung-je Bang, Hyun-tae Jang, Hye-in Park, Jae-heung Ye, Chan-beom Jeong, Sae-bom Lee, Yong-won Lee
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Publication number: 20180048047Abstract: A split resonator and a printed circuit board (PCB) including the same are disclosed. The split resonator is mounted to one side of the PCB to improve the electromagnetic shielding effect, and absorbs a radiation field emitted to the outer wall of the PCB. The PCB includes: a substrate on which one or more electronic components are populated; a dielectric substrate mounted to one side of the substrate; one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and a connection portion configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate.Type: ApplicationFiled: May 24, 2017Publication date: February 15, 2018Inventors: Soon Yong LEE, Yeon Sik YU, Il Kim, Keon Young SEO, Min-Goo SEO, Jae-Deok LIM, Si Ho JANG, Hyun-Tae JANG
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Patent number: 9832859Abstract: A printed circuit board (PCB) assembly includes a PCB, electronic components mounted on the PCB, a shield can provided to block electromagnetic waves of the electronic components, and an insulating layer provided to prevent an electrical short between the electronic components and the shield can, and the insulating layer is sprayed and formed on the shield can. The insulating layer which is sprayed and formed on the shield can does not have an adhesive layer, and thus the thickness thereof can be remarkably reduced compared to insulating materials requiring an adhesive layer.Type: GrantFiled: July 30, 2015Date of Patent: November 28, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong Won Lee, Hyun-Tae Jang, Jung Je Bang
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Publication number: 20170215306Abstract: A shield can device is provided. The shield can device includes a frame which is fixed to a printed circuit board (PCB) and surrounds at least one circuit device as an electromagnetic shielding target, a cover which is coupled to the frame and closes an opening formed in a top of the frame, and a plurality of contact projections which are formed between the frame and the cover and allow the frame and the cover to be in electrical contact with each other.Type: ApplicationFiled: January 25, 2017Publication date: July 27, 2017Applicant: Samsung Electronics Co., Ltd.Inventors: Jae-deok LIM, Jung-je BANG, Hyun-tae JANG, Hye-in PARK, Jae-heung YE, Chan-beom JEONG, Sae-bom LEE, Yong-won LEE
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Patent number: 9582051Abstract: A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.Type: GrantFiled: February 19, 2015Date of Patent: February 28, 2017Assignee: Samsung Electronics Co., Ltd.Inventors: Ki-Youn Jang, Kyung-Ha Koo, Kun-Tak Kim, Ki-Cheol Bae, Hyun-Deok Seo, Hyun-Tae Jang, Jong-Chul Choi
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Publication number: 20160044835Abstract: A printed circuit board (PCB) assembly includes a PCB, electronic components mounted on the PCB, a shield can provided to block electromagnetic waves of the electronic components, and an insulating layer provided to prevent an electrical short between the electronic components and the shield can, and the insulating layer is sprayed and formed on the shield can. The insulating layer which is sprayed and formed on the shield can does not have an adhesive layer, and thus the thickness thereof can be remarkably reduced compared to insulating materials requiring an adhesive layer.Type: ApplicationFiled: July 30, 2015Publication date: February 11, 2016Applicant: Samsung Electronics Co., Ltd.Inventors: Yong Won LEE, Hyun-Tae JANG, Jung Je BANG
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Patent number: RE48641Abstract: A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.Type: GrantFiled: February 27, 2019Date of Patent: July 13, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Ki-Youn Jang, Kyung-Ha Koo, Kun-Tak Kim, Ki-Cheol Bae, Hyun-Deok Seo, Hyun-Tae Jang, Jong-Chul Choi