Patents by Inventor Hyun Woo Ryou

Hyun Woo Ryou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11937382
    Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.
    Type: Grant
    Filed: January 11, 2023
    Date of Patent: March 19, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Hyun Woo Ryou
  • Publication number: 20230171899
    Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.
    Type: Application
    Filed: January 11, 2023
    Publication date: June 1, 2023
    Inventor: Hyun Woo RYOU
  • Patent number: 11582873
    Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: February 14, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Hyun Woo Ryou
  • Publication number: 20210410298
    Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.
    Type: Application
    Filed: September 9, 2021
    Publication date: December 30, 2021
    Inventor: Hyun Woo RYOU
  • Patent number: 11172582
    Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: November 9, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Hyun Woo Ryou
  • Publication number: 20200359509
    Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.
    Type: Application
    Filed: July 24, 2020
    Publication date: November 12, 2020
    Inventor: Hyun Woo RYOU
  • Patent number: 10765014
    Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: September 1, 2020
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hyun Woo Ryou
  • Publication number: 20190269022
    Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.
    Type: Application
    Filed: May 7, 2019
    Publication date: August 29, 2019
    Inventor: HYUN WOO RYOU
  • Patent number: 10334743
    Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to prevent interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: June 25, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Hyun Woo Ryou
  • Publication number: 20180332722
    Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to prevent interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.
    Type: Application
    Filed: July 27, 2016
    Publication date: November 15, 2018
    Inventor: HYUN WOO RYOU
  • Patent number: 9635232
    Abstract: Disclosed is a camera module including a substrate which is provided with an electrode pad and an image sensor; a housing which is stacked on the substrate and of which an upper portion is opened so that light is incident to the image sensor; a MEMS actuator which is installed at the housing and has an electrode terminal at one side thereof, and a conductive pattern which is formed at the housing, wherein a lower end of the conductive pattern is connected with the electrode pad of the substrate, and an upper end thereof is connected with the electrode terminal of the MEMS actuator, whereby it is possible to improve electrical reliability between the electrode terminal of the MEMS actuator and the electrode pad of the substrate and facilely form the electrical connection therebetween, thereby reducing the number of processes.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: April 25, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Hyun Woo Ryou