Abstract: Disclosed is a ball grid array package with stacked center pad chips, which realizes a BGA package with stacked chips using center pad type semiconductor chips, and a method for manufacturing the same. The semiconductor chips are glued on each of upper and lower circuit boards, which have active surfaces facing each other; the chip pads are connected to each of the upper and lower circuit boards with gold wires; the upper and lower circuit boards are joined together with bumps interposed between them for electrical connection; the upper circuit board is included in a package mold; and the opposite ends of the lower circuit board are exposed to the lower portion of the package mold. The lower circuit board can be made of flexible insulation film. The exposed opposite ends of the lower circuit board can have solder balls formed thereon. Also, the opposite ends of the lower circuit board may be joined to a printed circuit board. Solder balls may be formed on the lower surface of the printed circuit board.

Abstract: Disclosed is a ball grid array package with stacked center pad chips, which realizes a BGA package with stacked chips using center pad type semiconductor chips, and a method for manufacturing the same. The semiconductor chips are glued on each of upper and lower circuit boards, which have active surfaces facing each other; the chip pads are connected to each of the upper and lower circuit boards with gold wires; the upper and lower circuit boards are joined together with bumps interposed between them for electrical connection; the upper circuit board is included in a package mold; and the opposite ends of the lower circuit board are exposed to the lower portion of the package mold. The lower circuit board can be made of flexible insulation film. The exposed opposite ends of the lower circuit board can have solder balls formed thereon. Also, the opposite ends of the lower circuit board may be joined to a printed circuit board. Solder balls may be formed on the lower surface of the printed circuit board.

Abstract: Disclosed is a ball grid array package with stacked center pad chips, which realizes a BGA package with stacked chips using center pad type semiconductor chips, and a method for manufacturing the same. The semiconductor chips are glued on each of upper and lower circuit boards, which have active surfaces facing each other; the chip pads are connected to each of the upper and lower circuit boards with gold wires; the upper and lower circuit boards are joined together with bumps interposed between them for electrical connection; the upper circuit board is included in a package mold; and the opposite ends of the lower circuit board are exposed to the lower portion of the package mold. The lower circuit board can be made of flexible insulation film. The exposed opposite ends of the lower circuit board can have solder balls formed thereon. Also, the opposite ends of the lower circuit board may be joined to a printed circuit board. Solder balls may be formed on the lower surface of the printed circuit board.

Abstract: The stack package includes at least two semiconductor chips disposed up and down. Bonding pads are formed in the respective semiconductor chips along a center line. Inner leads of a first lead frame and a second lead frame are attached to bonding-pad-disposed faces of the respective semiconductor chips. The inner lead of each lead frame is electrically connected to its corresponding bonding pad by means of metal wires. The inner lead of the first lead frame is also electrically connected to the second lead frame by utilizing a conductive adhesive material. A connecting hole is formed in the outer end of the inner lead for better electrical connection when soldered. The entire resultant structure is molded with an epoxy compound so as to expose a connecting part between the first and second lead frames and an outer lead of the second lead frame.

Abstract: Disclosed is a ball grid array package with stacked center pad chips, which realizes a BGA package with stacked chips using center pad type semiconductor chips, and a method for manufacturing the same. The semiconductor chips are glued on each of upper and lower circuit boards, which have active surfaces facing each other; the chip pads are connected to each of the upper and lower circuit boards with gold wires; the upper and lower circuit boards are joined together with bumps interposed between them for electrical connection; the upper circuit board is included in a package mold; and the opposite ends of the lower circuit board are exposed to the lower portion of the package mold. The lower circuit board can be made of flexible insulation film. The exposed opposite ends of the lower circuit board can have solder balls formed thereon. Also, the opposite ends of the lower circuit board may be joined to a printed circuit board. Solder balls may be formed on the lower surface of the printed circuit board.

Abstract: The present invention relates to a wafer level chip-scale package and a method for manufacturing such a package. The chip-scale package includes a semiconductor chip having chip pads, a conductor formed on the semiconductor chip and connected to a corresponding chip pad ball land on an extended portion of the conductor, an adhesive layer provided between the semiconductor chip and the conductor, a conductive plug filling the opening part connecting the chip pad to the conductor, a molded body covering the conductor and conductive plug while exposing the ball lands, and a substrate onto which the inserted semiconductor chip is mounted conductive structures and provided to electrically connect and affix the semiconductor chip to the substrate.

Abstract: The present invention relates to a stack package, as well as a method for fabricating the same, the stack package includes at least two semiconductor chips disposed up and down. Bonding pads are formed in the respective semiconductor chips along a center line. Inner leads of a first lead frame and a second lead frame are attached to bonding pad-disposed faces of the respective semiconductor chips. The inner lead of each lead frame is electrically connected to its corresponding bonding pad by means of metal wires. The inner lead of the first lead frame is also electrically connected to the second lead frame. The entire structure is molded with an epoxy compound so as to expose a connecting part between the first and second lead frames and an outer lead of the second lead frame.

Abstract: The present invention relates to a stack package, as well as a method for fabricating the same, the stack package includes at least two semiconductor chips disposed up and down. Bonding pads are formed in the respective semiconductor chips along a center line. Inner leads of a first lead frame and a second lead frame are attached to bonding pad-disposed faces of the respective semiconductor chips. The inner lead of each lead frame is electrically connected to its corresponding bonding pad by means of metal wires. The inner lead of the first lead frame is also electrically connected to the second lead frame. The entire structure is molded with an epoxy compound so as to expose a connecting part between the first and second lead frames and an outer lead of the second lead frame.