Abstract: According to the present invention, an electro-optic device comprises: a substrate which is split into a light emitting unit and a non-light emitting unit, wherein said light emitting unit is divided into a plurality of driving regions; an electrode pad which is formed in the non-light emitting unit of the substrate; and an electrode unit which comprises a plurality of supplementary electrodes each of which has one end connected to the electrode pad and has the other end connected to the centers of each of the plurality of driving regions, and transparent electrodes formed on the upper sides of the plurality of supplementary electrodes in the light emitting unit, wherein the area of each of the plurality of driving regions is set to an area in which no voltage drop occurs, and the plurality of supplementary electrodes are manufactured in the same length.

Abstract: In one embodiment, a semiconductor device includes a single layer substrate having an insulation layer and conductive patterns on a first surface of the insulation layer. A semiconductor die is attached on a first surface of the single layer substrate and electrically connected to the conductive patterns. Conductive bumps are also on the first surface of the single layer substrate and electrically connected to the semiconductor die through the conductive patterns. An encapsulant overlaps at least portions of the first surface of the single layer substrate. The conductive bumps are at least partially exposed in the encapsulant.

Abstract: In one embodiment, an electronic package structure includes a lead having a first width. An electronic chip having a conductive bump on a major surface, the conductive bump has a second width greater than the first width. The conductive bump is attached to the lead such that a portion of the conductive bump extends to at least partially surround a side surface of the lead. A molding compound resin encapsulates the electronic chip, the conductive bump, and at least a portion of the lead. The lead is configured so strengthen the joining force between the lead and conductive bump.

Abstract: In one embodiment, a lead frame package structure includes a lead frame having sides that surround a die paddle and on which a plurality of leads are formed. An electronic chip is attached to the die paddle and a case is attached to the lead frame to seal the leads and the electronic chip. One or more discharge holes are formed on and extending through one or more specific leads and/or on and extending through a predetermined position of the die paddle. The discharge holes are configured to discharge air pressure that forms during the assembly process thereby improving the reliability of the packaged electronic chip.

Abstract: A display device includes a substrate, gate lines extended in a first direction on the substrate, data lines extended in a second direction substantially perpendicular to the first direction on the substrate, and pixels connected to the gate and data lines. Each pixel includes a transistor having one end connected to a data line, and a gate electrode connected to a corresponding gate line, a liquid crystal layer disposed in a tunnel-shaped cavity, first and second electrodes for applying an electric field to the liquid crystal layer. The first electrode of each pixel is connected to another end of the transistor, a second electrode of each pixel overlaps the first electrode of one of its adjacent pixels, and the first electrode of each pixel overlaps a second electrode of another one of its adjacent pixels.

Abstract: A display apparatus includes a display panel, and at least one flexible printed circuit board connected to the display panel. The display panel includes signal lines, pixels connected to the signal lines, and contact pads provided at one end of the signal lines. The flexible printed circuit board includes a fan-out part including a plurality of connection lines corresponding to the contact pads in a one-to-one correspondence, overlapping with the contact pads and connected to the contact pads, and a driving driver connected to the connection lines, the driving driver applying a driving signal to the pixels.

Abstract: A display apparatus includes a first display substrate, a second display substrate which faces the first display substrate and is coupled to the first display substrate, first and second spacers disposed on one of the first and second display substrates, and a transparent electrode disposed between the one of the first and second display substrates and the first spacer.

Abstract: In one embodiment, a lead frame package structure includes a lead frame having sides that surround a die paddle and on which a plurality of leads are formed. An electronic chip is attached to the die paddle and a case is attached to the lead frame to seal the leads and the electronic chip. One or more discharge holes are formed on and extending through one or more specific leads and/or on and extending through a predetermined position of the die paddle. The discharge holes are configured to discharge air pressure that forms during the assembly process thereby improving the reliability of the packaged electronic chip.

Abstract: A display device having a substrate including a first display area, a second display area, a non-display area disposed adjacent to the first and second display areas, a plurality of first pixels disposed in the first display area, a plurality of second pixels disposed in the second display area, a first groove disposed in the non-display area and recessed downward from an upper surface of the substrate, a first flexible film disposed in the first groove, and a plurality of pad electrodes disposed on the first flexible film in the non-display area between the first and second display areas and connecting the first pixels are connected to the second pixels in a row.

Abstract: In one embodiment, an electronic package structure includes a lead having a first width. An electronic chip having a conductive bump on a major surface, the conductive bump has a second width greater than the first width. The conductive bump is attached to the lead such that a portion of the conductive bump extends to at least partially surround a side surface of the lead. A molding compound resin encapsulates the electronic chip, the conductive bump, and at least a portion of the lead. The lead is configured so strengthen the joining force between the lead and conductive bump.

Abstract: A liquid crystal display includes a gate line formed on an insulation substrate. A data line, insulated from the gate line, crosses the gate line. A first pixel is connected to the gate line and the data line. The pixel includes a thin film transistor having a control terminal connected to the gate line and an input terminal connected to the data line. A first liquid crystal capacitor has one end connected to an output terminal of the thin film transistor. A second liquid crystal capacitor has one end connected to the other end of the first liquid crystal capacitor. The first liquid crystal capacitor includes a first liquid crystal layer formed in a first microcavity and the second liquid crystal capacitor includes a second liquid crystal layer formed in a second microcavity.

Abstract: In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis.

Abstract: In one embodiment, a miniaturized, multi-function, highly integrated and high performance semiconductor device or package includes a microphone implemented using a MEMS (Micro Electro Mechanical System) die. The semiconductor device includes a leadframe and a body collectively defining a port hole. The port hole facilitates the exposure of a diaphragm of the MEMS die in the semiconductor device.

Abstract: A display device includes a substrate, gate lines extended in a first direction on the substrate, data lines extended in a second direction substantially perpendicular to the first direction on the substrate, and pixels connected to the gate and data lines. Each pixel includes a transistor having one end connected to a data line, and a gate electrode connected to a corresponding gate line, a liquid crystal layer disposed in a tunnel-shaped cavity, first and second electrodes for applying an electric field to the liquid crystal layer. The first electrode of each pixel is connected to another end of the transistor, a second electrode of each pixel overlaps the first electrode of one of its adjacent pixels, and the first electrode of each pixel overlaps a second electrode of another one of its adjacent pixels.

Abstract: A display apparatus includes a backlight unit generating light and a display substrate displaying an image using the light. The display substrate includes a substrate, a first electrode, a light blocking layer, a thin film transistor, a second electrode, a liquid crystal and a color filter. The substrate includes a pixel area and a non-pixel area, the first electrode is in the pixel area, and the light blocking layer is in the non-pixel area to block the light. The thin film transistor is on the light blocking layer and electrically connected to the first electrode. The second electrode faces the first electrode, and a cavity is defined therebetween. The liquid crystal is in the cavity, the color filter is on the second electrode, and the color filter is closer to the backlight unit than the substrate.

Abstract: An electrophoretic display according to an exemplary embodiment of the present invention may include: a first substrate, a first electrode formed on the first substrate, a second electrode spaced apart from the first electrode, a second substrate facing the first substrate, and a plurality of charged particles arranged between the first substrate and the second substrate, pairs of the charged particles having different polarities. Each charged particle has at least two threshold voltages, where the threshold voltages are voltage magnitudes below which a voltage applied across the first and second electrodes does not move the associated charged particle. The pixels may represent any one of colors such as red, green, blue, white, and black by including two charged particles of different colors in one pixel and changing the attractive and repulsive force threshold voltages of each of two charged particles of different colors contained in the pixel.

Abstract: An electrophoretic display device is provided. The device includes an array substrate including a plurality of pixels, an opposite substrate facing the array substrate, and an electrophoretic layer provided between the array substrate and the opposite substrate. The electrophoretic layer includes a non-polar solvent and at least two types of polar particles dispersed in the non-polar solvent that display different colors from each other. One of the array substrate and the opposite substrate includes a plurality of capturing holes configured to capture the polar particles when an electric field is applied between the array substrate and the opposite substrate.

Abstract: A display apparatus includes a backlight unit generating light and a display substrate displaying an image using the light. The display substrate includes a substrate, a first electrode, a light blocking layer, a thin film transistor, a second electrode, a liquid crystal and a color filter. The substrate includes a pixel area and a non-pixel area, the first electrode is in the pixel area, and the light blocking layer is in the non-pixel area to block the light. The thin film transistor is on the light blocking layer and electrically connected to the first electrode. The second electrode faces the first electrode, and a cavity is defined therebetween. The liquid crystal is in the cavity, the color filter is on the second electrode, and the color filter is closer to the backlight unit than the substrate.

Abstract: A liquid crystal display includes a gate line formed on an insulation substrate. A data line, insulated from the gate line, crosses the gate line. A first pixel is connected to the gate line and the data line. The pixel includes a thin film transistor having a control terminal connected to the gate line and an input terminal connected to the data line. A first liquid crystal capacitor has one end connected to an output terminal of the thin film transistor. A second liquid crystal capacitor has one end connected to the other end of the first liquid crystal capacitor. The first liquid crystal capacitor includes a first liquid crystal layer formed in a first microcavity and the second liquid crystal capacitor includes a second liquid crystal layer formed in a second microcavity.

Abstract: A display device is provided. The display device includes a substrate including a pixel region, a thin film transistor formed on the substrate, a light blocking member formed at a boundary of the pixel region, and a pixel electrode formed in the pixel region, the pixel electrode connected to the thin film transistor. The display device also includes a common electrode formed on the light blocking member, the common electrode spaced apart from the pixel electrode with a microcavity interposed between the common electrode and the pixel electrode, and a roof layer comprising a color filter formed on the common electrode. The display device further includes an opening formed in the common electrode and the roof layer to expose a portion of the microcavity, a liquid crystal filling the microcavity, and an overcoat formed on the roof layer to cover the opening and seal the microcavity for each pixel region.