Abstract: An integrated circuit package includes an inductance loop formed from a connection of bonding wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a bonding pad on the integrated circuit chip to an I/O pin of the package and a second wire which connects the same bonding pad to the same pin. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization.

Abstract: An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from first and second wires which connect a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a third and fourth wires which connect a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a third conductor between the pins. The third conductor may include one or more bonding wires and the I/O pins are preferably ones which are adjacent one another. However, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors. In another embodiment, connection between the first and second I/O pins is established by making the I/O pins have a unitary construction.

Abstract: An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a second wire which connects a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a conductive bridge between the pins. The bridge may be formed by making the I/O pins have a unitary construction. In another embodiment, the bridge is formed by a metallization layer located either on the surface of the package substrate or within this substrate. The I/O pins are preferably ones which are adjacent one another; however, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors.

Abstract: An integrated circuit package includes an inductance loop formed from a connection of bonding wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a bonding pad on the integrated circuit chip to an I/O pin of the package and a second wire which connects the same bonding pad to the same pin. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization.

Abstract: An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a second wire which connects a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a conductive bridge between the pins. The bridge may be formed by making the I/O pins have a unitary construction. In another embodiment, the bridge is formed by a metallization layer located either on the surface of the package substrate or within this substrate. The I/O pins are preferably ones which are adjacent one another; however, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors.

Abstract: An integrated circuit package includes an inductance loop formed from a connection of bonding wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a bonding pad on the integrated circuit chip to an I/O pin of the package and a second wire which connects the same bonding pad to the same pin. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization.

Abstract: An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from first and second wires which connect a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a third and fourth wires which connect a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a third conductor between the pins. The third conductor may include one or more bonding wires and the I/O pins are preferably ones which are adjacent one another. However, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors. In another embodiment, connection between the first and second I/O pins is established by making the I/O pins have a unitary construction.

Abstract: A phase-locked loop (PLL) fractional-N type frequency synthesizer incorporates a sample-and-hold circuit. The synthesizer can reduce circuit size by eliminating a loop filter. Further, the synthesizer can incorporate fractional spur compensation circuitry to compensate charge pump ripple whenever a charge pump operates. The synthesizer or fractional-N type PLL can use a divider and at least two phase detectors coupled to a sample-and-hold circuit. A lock detecting circuit can initially determine a reference voltage for the sample-and-hold circuit. Also, fractional compensation is accomplished dynamically and in a manner that is robust to environmental changes while a control voltage is stably maintained for the voltage controlled oscillator.

Abstract: A phase-locked loop (PLL) frequency synthesizer incorporates fractional spur compensation circuitry. This fractional spur compensation circuitry dynamically compensates charge pump ripple whenever a charge pump operates. It can utilize a programmable divider, two phase detectors each using a charge pump stage pumps. A fractional accumulator stage determines the number of charge pumps that operate during a phase comparison. The PLL frequency synthesizer avoids the need for compensation current trimming. Also, fractional compensation is accomplished dynamically and in a manner that is robust to environmental changes.

Abstract: A phase-locked loop (PLL) frequency synthesizer incorporates fractional spur compensation circuitry. This fractional spur compensation circuitry dynamically compensates charge pump ripple whenever a charge pump operates. It can utilize a programmable divider, two phase detectors each using a charge pump stage pumps. A fractional accumulator stage determines the number of charge pumps that operate during a phase comparison. The PLL frequency synthesizer avoids the need for compensation current trimming. Also, fractional compensation is accomplished dynamically and in a manner that is robust to environmental changes.

Abstract: A phase-locked loop (PLL) fractional-N type frequency synthesizer incorporates a sample-and-hold circuit. The synthesizer can reduce circuit size by eliminating a loop filter. Further, the synthesizer can incorporate fractional spur compensation circuitry to compensate charge pump ripple whenever a charge pump operates. The synthesizer or fractional-N type PLL can use a divider and at least two phase detectors coupled to a sample-and-hold circuit. A lock detecting circuit can initially determine a reference voltage for the sample-and-hold circuit. Also, fractional compensation is accomplished dynamically and in a manner that is robust to environmental changes while a control voltage is stably maintained for the voltage controlled oscillator.