Patents by Inventor Hyung-Mo Yang

Hyung-Mo Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160027796
    Abstract: According to example embodiments, a semiconductor device includes a substrate, a plurality of word lines spaced apart from each other in a first direction on the substrate, a channel layer in a channel hole defined by the plurality of word lines, a gate insulating layer in the channel hole along an inner wall of the channel hole; and a self-aligned contact on an upper portion of the channel layer in the channel hole. The gate insulating layer is between the plurality of word lines and the channel layer. The first direction is perpendicular to an upper surface of the substrate. The channel hole exposes the upper surface of the substrate.
    Type: Application
    Filed: March 12, 2015
    Publication date: January 28, 2016
    Inventors: Hyung-mo YANG, Sang-in KIM, Hae-na KIM, Seung-min SON, Hee-sung YANG, Sang-min HAN
  • Patent number: 8187410
    Abstract: The present invention purposes to provide a hollow fiber membrane module that minimizes the error rate in a manufacturing process thereof, disperses weight by separating an enlarged hollow fiber membrane module into a plurality of small modules, and provides a manufacturing method thereof. The present invention includes a central water tube having a plurality of inlets formed in the circumferential direction thereof, a central air tube provided in the central water tube, a plurality of housings longitudinally provided in the circumferential direction of the central water tube, a hollow fiber membrane provided in the respective housing and in which water is treated by difference of pressure, a fixing part fixing the lower part of the hollow fiber membrane to the housing, and a collector provided in the lower part of the housing, a plurality of small modules being provided in the housing.
    Type: Grant
    Filed: May 18, 2005
    Date of Patent: May 29, 2012
    Assignee: Woongjin Coway, Co. Ltd.
    Inventors: Soo-Hong Noh, Oh-Sung Kwon, So-Dam Yoon, Hee-Sung Yoon, Hyung-Mo Yang
  • Publication number: 20090308797
    Abstract: The present invention purposes to provide a hollow fiber membrane module that minimizes the error rate in a manufacturing process thereof, disperses weight by separating an enlarged hollow fiber membrane module into a plurality of small modules, and provides a manufacturing method thereof. The present invention includes a central water tube having a plurality of inlets formed in the circumferential direction thereof, a central air tube provided in the central water tube, a plurality of housings longitudinally provided in the circumferential direction of the central water tube, a hollow fiber membrane provided in the respective housing and in which water is treated by difference of pressure, a fixing part fixing the lower part of the hollow fiber membrane to the housing, and a collector provided in the lower part of the housing, a plurality of small modules being provided in the housing.
    Type: Application
    Filed: May 18, 2005
    Publication date: December 17, 2009
    Applicant: Industry-Academic Cooperation Foundation, Yonsei University
    Inventors: Soo-Hong Noh, Oh-Sung Kwon, So-Dam Yoon, Hee-Sung Yoon, Hyung-Mo Yang
  • Patent number: 7585757
    Abstract: In a semiconductor device and method of manufacturing the semiconductor device, a punch-through prevention film pattern and a channel film pattern are formed on an insulation layer. The punch-through prevention pattern and the insulation layer may include nitride and oxide, respectively. The punch-through prevention pattern is located under the channel pattern.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: September 8, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Seon Ahn, Joon Kim, Jin-Hong Kim, Suk-Chul Bang, Eun-Kuk Chung, Hyung-Mo Yang, Chang-Yeon Yoo, Yun-Seung Kang, Kyung-Tae Jang
  • Publication number: 20060281290
    Abstract: In a semiconductor device and method of manufacturing the semiconductor device, a punch-through prevention film pattern and a channel film pattern are formed on an insulation layer. The punch-through prevention pattern and the insulation layer may include nitride and oxide, respectively. The punch-through prevention pattern is located under the channel pattern.
    Type: Application
    Filed: June 5, 2006
    Publication date: December 14, 2006
    Inventors: Jong-Seon Ahn, Joon Kim, Jin-Hong Kim, Suk-Chul Bang, Eun-Kuk Chung, Hyung-Mo Yang, Chang-Yeon Yoo, Yun-Seung Kang, Kyung-Tae Jang