Patents by Inventor Hyung Seob SHIM

Hyung Seob SHIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220305611
    Abstract: A substrate polishing method for polishing a substrate through a polishing pad according to an embodiment may comprise: a preheating step of increasing the temperature of the polishing pad by supplying heated pure water to the polishing pad before polishing the substrate; and a temperature control step of controlling the temperature of the polishing pad by adjusting the temperature of the slurry supplied to the polishing pad in a polishing process of the substrate.
    Type: Application
    Filed: March 17, 2022
    Publication date: September 29, 2022
    Applicant: KCTECH CO., LTD.
    Inventors: Hee Cheul JUNG, Geun Sik YUN, Hyung Seob SHIM, Sung Ho SHIN