Abstract: A method of manufacturing a semiconductor device includes preparing etched mapping data by measuring an etching amount of a wafer subjected to an etching process, determining an error region in which the etching amount of the wafer is outside of a reference value, based on the etched mapping data, compensating distribution of an electrical field applied to the wafer, and compensating exhaust distribution of a process gas, changed by the compensating distribution of an electrical field.

Abstract: A shower head assembly for a plasma processing apparatus in which a substrate is accommodatable on a substrate stage within a chamber, a plasma processing apparatus, and a plasma processing method, the shower head assembly including a shower plate including a plurality of injection holes through which a gas is sprayable out toward the substrate; and a compensation plate on a lower surface of the shower plate and facing the substrate, the compensation plate including a first compensating portion having first gas passages of a first length and a second compensating portion having second gas passages of a second length that is greater than the first length, wherein the first gas passage and the second gas passage are respectively in fluid communication with the injection holes.

Abstract: A method of manufacturing a semiconductor device includes preparing etched mapping data by measuring an etching amount of a wafer subjected to an etching process, determining an error region in which the etching amount of the wafer is outside of a reference value, based on the etched mapping data, compensating distribution of an electrical field applied to the wafer, and compensating exhaust distribution of a process gas, changed by the compensating distribution of an electrical field.

Abstract: A shower head assembly for a plasma processing apparatus in which a substrate is accommodatable on a substrate stage within a chamber, a plasma processing apparatus, and a plasma processing method, the shower head assembly including a shower plate including a plurality of injection holes through which a gas is sprayable out toward the substrate; and a compensation plate on a lower surface of the shower plate and facing the substrate, the compensation plate including a first compensating portion having first gas passages of a first length and a second compensating portion having second gas passages of a second length that is greater than the first length, wherein the first gas passage and the second gas passage are respectively in fluid communication with the injection holes.