Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.

Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin. The first and second S/Ds respectively covers another portion of the first semiconductor fin and another portion of the second semiconductor fin.

Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.

Abstract: A method for processing printing information of a powder-bed type 3D printer is disclosed. The method comprises following steps of: generating a color image and an adhesive image for each printing slice in accordance with a 3D file; adjusting adhesive information of the adhesive image based on color information of the color image; and, generating a final printing image based on the color image and the adjusted adhesive image. The method prevents the 3D printing from jetting adhesive that may overlap with jetted colored ink by using the final printing image, so as to avoid the jetted color-ink being diluted by the adhesive, and powders being moist because of the overlap of the colored ink and the adhesive.

Abstract: A method for adjusting a printing head usage amount of a 3D printer and a control device are provided. The method is adapted to control the control device of the 3D printer. The method includes following steps. At least one printing head of the 3D printer is divided into a plurality of sections. An accumulated printing point number of each of the sections is obtained. At least one specific section used for printing a 3D object is selected from the sections according to the accumulated printing point number of each of the sections. The method for adjusting the printing head usage amount of the 3D printer and the control device can avoid excessively high usage amount of some nozzles.

Abstract: A method for processing printing information of a powder-bed type 3D printer is disclosed. The method comprises following steps of: generating a color image and an adhesive image for each printing slice in accordance with a 3D file; adjusting adhesive information of the adhesive image based on color information of the color image; and, generating a final printing image based on the color image and the adjusted adhesive image. The method prevents the 3D printing from jetting adhesive that may overlap with jetted colored ink by using the final printing image, so as to avoid the jetted color-ink being diluted by the adhesive, and powders being moist because of the overlap of the colored ink and the adhesive.

Abstract: A method for adjusting a printing head usage amount of a 3D printer and a control device are provided. The method is adapted to control the control device of the 3D printer. The method includes following steps. At least one printing head of the 3D printer is divided into a plurality of sections. An accumulated printing point number of each of the sections is obtained. At least one specific section used for printing a 3D object is selected from the sections according to the accumulated printing point number of each of the sections. The method for adjusting the printing head usage amount of the 3D printer and the control device can avoid excessively high usage amount of some nozzles.

Abstract: A printing compensation method for an inkjet printing system is provided. The inkjet printing system includes a printing module, an image capture module and a dynamic compensation module. The printing module includes plural nozzles. First, a nozzle test pattern corresponding to the plural nozzles is printed out by the printing module. Then, a digital data corresponding to the nozzle test pattern is acquired by the image capture module, and a judging step is performed to judge whether any of the plural nozzles is abnormal according to the digital data. If at least one of the plural nozzles is abnormal, an information about at least one failed-print part corresponding to the at least one nozzle is acquired. Then, the dynamic compensation module is enabled to perform a compensation printing operation according to the information about the at least one failed-print part.