Abstract: A medical image assistance system and a medical image assistance method are provided. During a medical process, an image capturing apparatus located at a local location captures a first image and transmits the first image to a control device located at the local location, and the control device transmits the first image captured by the image capturing apparatus to an electronic apparatus located at a remote location. The electronic apparatus performs a marking operation on the first image to generate a second image, and transmits the second image to the control device. The control device transmits the second image to a head-mounted display apparatus located at the local location so that the head-mounted display apparatus simultaneously displays the second image and a real-time local image. The first image and the second image are at least partially the same in content.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: An automatic fluid replacement device is adapted to be mounted on an opening of a storage barrel. The automatic fluid replacement device includes a robotic arm, at least one fluid convey joint and a controller. The robotic arm has a gripper. The fluid convey joint includes a convey pipe, a sleeve and a sealing bag. The convey pipe is configured to deliver a fluid. The sleeve is sleeved on the convey pipe. The gripper clamps the sleeve. The sealing bag is sleeved on the sleeve. The controller is configured for automatically controlling the robotic arm to move the fluid convey joint into the opening and controlling the sealing bag to be inflated to seal the opening.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: An automatic fluid replacement device is adapted to be mounted on an opening of a storage barrel. The automatic fluid replacement device includes a robotic arm, at least one fluid convey joint and a controller. The robotic arm has a gripper. The fluid convey joint includes a convey pipe, a sleeve and a sealing bag. The convey pipe is configured to deliver a fluid. The sleeve is sleeved on the convey pipe. The gripper clamps the sleeve. The sealing bag is sleeved on the sleeve. The controller is configured for automatically controlling the robotic arm to move the fluid convey joint into the opening and controlling the sealing bag to be inflated to seal the opening.

Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.

Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.

Abstract: The present invention discloses a method for fabricating a heat-resistant, humidity-resistant oxide-confined vertical-cavity surface-emitting laser (VCSEL) by slowing down the oxidizing rate during a VCSEL oxidation process to thereby reduce stress concentration of an oxidation layer and by preventing moisture invasion using a passivation layer disposed on a laser window. The VCSEL device thus fabricated is heat-resistant, humidity-resistant, and highly reliable. In a preferred embodiment, the oxidation process takes place at an oxidizing rate of less than 0.4 ?m/min, and the passivation layer is a SiON passivation layer.

Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.

Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.

Abstract: The present invention discloses a method for fabricating a heat-resistant, humidity-resistant oxide-confined vertical-cavity surface-emitting laser (VCSEL) by slowing down the oxidizing rate during a VCSEL oxidation process to thereby reduce stress concentration of an oxidation layer and by preventing moisture invasion using a passivation layer disposed on a laser window. The VCSEL device thus fabricated is heat-resistant, humidity-resistant, and highly reliable. In a preferred embodiment, the oxidation process takes place at an oxidizing rate of less than 0.4 ?m/min, and the passivation layer is a SiON passivation layer.

Abstract: An apparatus and method for compensation of central wavelength shifting of a fiber grating by material with Invar effect. In the present invention, a substrate having a negative thermal expansion coefficient and a fiber with fiber grating is provided, and two portions of the fiber at both sides of the fiber grating are fixed to the substrate. The substrate and the fiber are satisfied with ?eff?bragg=K?AfEf(?c??f) in which ?eff is an effective thermal expansion coefficient of the fiber grating, ?bragg is a Bragg wavelength, K? is a constant, Af is a cross-section area of the fiber, Ef is an elastic modulus of the fiber, ?c is the negative thermal expansion coefficient of the substrate, and ?f is a thermal expansion coefficient of the fiber.

Abstract: An automatic device for assembling a fiber collimator. The fiber collimator includes a transparent tubular holder, an optical fiber having a first end surface disposed at an end of the tubular holder, and a GRIN lens having a second end surface disposed at the other end of the tubular holder. The automatic device includes an image pick-up device, a processor, a first driving table for rotating and moving the optical fiber, and a second driving table for rotating and moving the GRIN lens. The image pick-up device films the first and second end surfaces, and outputs image data corresponding to the first and second end surfaces. The processor receives and processes the image data to control the first and second driving table to rotate so that the first and second end surfaces are parallel to each other, and control the first and second driving table to move so that a distance between the first and second end surfaces is equal to a predetermined value.

Abstract: An apparatus and method for compensation of central wavelength shifting of a fiber grating by material with Invar effect. In the present invention, a substrate having a negative thermal expansion coefficient and a fiber with fiber grating is provided, and two portions of the fiber at both sides of the fiber grating are fixed to the substrate.

Abstract: An automatic device for assembling a fiber collimator. The fiber collimator includes a transparent tubular holder, an optical fiber having a first end surface disposed at an end of the tubular holder, and a GRIN lens having a second end surface disposed at the other end of the tubular holder. The automatic device includes an image pick-up device, a processor, a first driving table for rotating and moving the optical fiber, and a second driving table for rotating and moving the GRIN lens. The image pick-up device films the first and second end surfaces, and outputs image data corresponding to the first and second end surfaces. The processor receives and processes the image data to control the first and second driving table to rotate so that the first and second end surfaces are parallel to each other, and control the first and second driving table to move so that a distance between the first and second end surfaces is equal to a predetermined value.