Abstract: A bonding tool includes a gas supply line that may extend directly between valves associated with one or more gas supply tanks and a processing chamber such that gas supply line is uninterrupted without any intervening valves or other types of structures that might otherwise cause a pressure buildup in the gas supply line between the processing chamber and the valves associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or near the pressure in the processing chamber so that gas provided to the processing chamber through the gas supply line does not cause a pressure imbalance in the processing chamber, which might otherwise cause early or premature contact between semiconductor substrates that are to be bonded in the processing chamber.

Abstract: A system for effectively curing dry film ink throughout its thickness on circuit boards being made applies an exposure system, a circuit board, and a method for making the circuit board. The exposure system includes a plurality of mixed light sources with different wavelengths within a range of 365 nm to 440 nm, the mixed light sources can output at least three different wavelengths of light each of substantially a single wavelength and a fourth source of light able to output light of a spectrum of wavelengths, the ranges of light being between 365 nm and 440 nm.

Abstract: A system for effectively curing dry film ink throughout its thickness on circuit boards being made applies an exposure system, a circuit board, and a method for making the circuit board. The exposure system includes a plurality of mixed light sources with different wavelengths within a range of 365 nm to 440 nm, the mixed light sources can output at least three different wavelengths of light each of substantially a single wavelength and a fourth source of light able to output light of a spectrum of wavelengths, the ranges of light being between 365 nm and 440 nm.

Abstract: This application provides a server and a debugging method therefor. The debugging method for a server includes receiving, by a complex programmable logic device (CPLD), a control signal generated by a switching member, and generating a switching signal; and switching, by a bus switch, a communication connection of a communications port to a debug port or a Serial Over LAN port of a baseboard management controller (BMC) based on the switching signal. In this way, debugging work is completed or industrial control application information is received at the communications port.

Abstract: This application provides a server and a debugging method therefor. The debugging method for a server includes receiving, by a complex programmable logic device (CPLD), a control signal generated by a switching member, and generating a switching signal; and switching, by a bus switch, a communication connection of a communications port to a debug port or a Serial Over Lan port of a baseboard management controller (BMC) based on the switching signal. In this way, debugging work is completed or industrial control application information is received at the communications port.

Abstract: A method for forming contact holes includes following steps. A substrate including a dense region and an isolation region is provided. A material layer is formed on the substrate. Sacrificed patterns are formed on the material layer in the dense region, wherein there is a first opening between the two adjacent sacrificed patterns. A spacer is formed on each of two sides of each of the sacrificed patterns, wherein the spacers are separated from each other. The sacrificed patterns are removed to form a second opening between two adjacent spacers. A planar layer is formed to fill up the second openings. A first slit is formed in the planar layer, wherein the first slit exposes a portion of the material layer under the second openings. The portion of the material layer exposed by the first slit is removed to form third openings in the material layer.

Abstract: A method for forming contact holes includes following steps. A substrate including a dense region and an isolation region is provided. A material layer is formed on the substrate. Sacrificed patterns are formed on the material layer in the dense region, wherein there is a first opening between the two adjacent sacrificed patterns. A spacer is formed on each of two sides of each of the sacrificed patterns, wherein the spacers are separated from each other. The sacrificed patterns are removed to form a second opening between two adjacent spacers. A planar layer is formed to fill up the second openings. A first slit is formed in the planar layer, wherein the first slit exposes a portion of the material layer under the second openings. The portion of the material layer exposed by the first slit is removed to form third openings in the material layer.

Abstract: An electrical connector (1) includes a dielectric housing (10), a plurality of terminals (13) received in the housing, and a retention mechanism (12) pivotally attached to the housing. The housing defines a plurality of terminal-passages (108) and first mating members (103). Each of terminals includes a bent portion (134). The retention mechanism has an elongate stopper member (120). A pair of cantilevers (122) depends from the stopper member. A second mating member (1222) is formed on each of the cantilevers, for engaging one of the first mating members. Thus the stopper member is rotatable between a first position in which the stopper is protected from thermal warp or deformation, and a second position in which the terminals are secured in the corresponding terminal-passages.