Abstract: A semiconductor device includes a substrate having a logic region and a magnetoresistive random access memory (MRAM) region, a MTJ on the MRAM region, a metal interconnection on the MTJ, and a blocking layer on the metal interconnection. Preferably, the blocking layer includes a stripe pattern according to a top view and the blocking layer could include metal or a dielectric layer.

Abstract: A temperature adjusting apparatus for a server and a temperature adjusting method thereof are provided. Rotation speeds and rotation directions of fans are controlled according to sensing results of temperature sensors, so as to adjust temperatures of server units by heat generated from the server units during operation.

Abstract: A temperature adjusting apparatus for a server and a temperature adjusting method thereof are provided. Rotation speeds and rotation directions of fans are controlled according to sensing results of temperature sensors, so as to adjust temperatures of server units by heat generated from the server units during operation.

Abstract: A packaging structure is provided, including a bottom plate, an arching roof, and a bent portion. The arching roof connects to the bottom plate and forms a first curved surface. An opening is formed between the first curved surface and the bottom plate. The bent portion is connected to the bottom plate and is adjacent to the opening.

Abstract: An electronic device including a main body, a carrying layer disposed at the main body, a waterproof layer stacked on the carrying layer and located between the carrying layer and the main body, a supporting element disposed on the carrying layer, a key disposed on the supporting element, and a guiding element connected to the key is provided. The main body has an inner space and an opening exposing the inner space. The carrying layer covering the opening has a first ventilation hole and an assembly hole. The waterproof layer has a second ventilation hole. The first ventilation hole is exposed by the second ventilation hole and connected with the inner space. The assembly hole is covered by the waterproof layer. The supporting element covers the first ventilation hole and has a third ventilation hole connected with the first ventilation hole. The guiding element is locked at the assembly hole.

Abstract: A heat dissipation system suited for dissipating heat of a heat source. The heat dissipation system includes at least one flow channel, at least one electrode pair, and a control unit. The flow channel passing through the heat source has at least two openings. The electrode pair disposed in the flow channel is near the openings. The control unit is electrically connected to the electrode pair to control the voltage of the electrode pair, so that the electrode pair is discharged to ionize the air nearby, and to produce an ionized flow in the flow channel. The control unit controls a polarity and a magnitude of the voltage of the electrode pair to change the direction and the speed of the ionized flow, so that the ionized flow flows out of or into the flow channel from at least one of the openings. A heat dissipation method is also provided.

Abstract: An electronic device including a main body, a carrying layer disposed at the main body, a waterproof layer stacked on the carrying layer and located between the carrying layer and the main body, a supporting element disposed on the carrying layer, a key disposed on the supporting element, and a guiding element connected to the key is provided. The main body has an inner space and an opening exposing the inner space. The carrying layer covering the opening has a first ventilation hole and an assembly hole. The waterproof layer has a second ventilation hole. The first ventilation hole is exposed by the second ventilation hole and connected with the inner space. The assembly hole is covered by the waterproof layer. The supporting element covers the first ventilation hole and has a third ventilation hole connected with the first ventilation hole. The guiding element is locked at the assembly hole.

Abstract: A method for controlling a heat-dissipating fan for an electronic component includes the steps of: detecting a temperature of the electronic component, and outputting a first control signal corresponding to the temperature thus detected; receiving a load current of the electronic component, and converting the load current into a second control signal; and controlling a rotating speed of the heat-dissipating fan with reference to the first control signal and the second control signal. A device employing the method includes a current detecting module adapted for detecting a load current, a temperature control circuit adapted for detecting a temperature, and a logic circuit unit coupled to the current detecting module and the temperature control circuit and controlling a rotating speed of a heat-dissipating fan.

Abstract: A motherboard includes a central processing unit (CPU) slot, a voltage regulator module (VRM), a VRM slot area, and a control unit. The VRM is electrically connected to the CPU slot and used for supplying a CPU installed inside the CPU slot with a first power. When a VRM card is inserted into the VRM slot area, the control unit electrically conducts the VRM slot area with the CPU slot so as to make the VRM card and the VRM together supply the CPU installed in the CPU slot with a second power. The second power is greater than the first power.

Abstract: The present invention discloses a liquid cooling heat dissipating device for at least one heat source. The liquid cooling heat dissipating device comprises a base, at least a cooling fin and a liquid cooling module. The device is characterized in that the cooling fin is disposed on the first area of surface of the base, and the liquid cooling module is removably installed on the first area of surface of the base. By this way, the users can optionally install the liquid cooling module according to the degrees of the generated heat. Computer suppliers can also reduce the cost effectively.

Abstract: A method for controlling a heat-dissipating fan for an electronic component includes the steps of: detecting a temperature of the electronic component, and outputting a first control signal corresponding to the temperature thus detected; receiving a load current of the electronic component, and converting the load current into a second control signal; and controlling a rotating speed of the heat-dissipating fan with reference to the first control signal and the second control signal. A device employing the method includes a current detecting module adapted for detecting a load current, a temperature control circuit adapted for detecting a temperature, and a logic circuit unit coupled to the current detecting module and the temperature control circuit and controlling a rotating speed of a heat-dissipating fan.

Abstract: A system and a method for moderating computer fan speed are applied to a computer. The system comprises a temperature sensor, a fan and an adjustment circuit. The temperature sensor detects a temperature of a heat source to generate a temperature signal. The adjustment circuit receives the temperature signal, and extends the response time of the temperature signal to output an adjusted temperature signal to the fan, so that speed of the fan can be adjusted based on the adjusted temperature signal.

Abstract: The present invention is related to a venting apparatus for a computer. The apparatus includes a chassis plate and a venting plate. The chassis plate has a first hole and a second hole. The venting plate has a plurality of venting apertures. The venting plate is selectively disposed over the first hole and the second hole.

Abstract: The present invention is related to a venting apparatus for a computer. The apparatus includes a chassis plate and a venting plate. The chassis plate has a first hole and a second hole. The venting plate has a plurality of venting apertures. The venting plate is selectively disposed over the first hole and the second hole.

Abstract: A storage box for hard disk drive (HDD) is provided. The storage box includes an outer frame, a first holder, a second holder, a cooling module and a back panel board. The first and second holders are opposite and for supporting the HDD. The cooling module, for cooling the HDD, is fixed in the storage box via the second holder and the outer frame. The cooling air is drawn into the storage box by the cooling module. The back panel board is electrically connected to the cooling module. The back panel board has an outlet positioned relative to the cooling module. The cooling air is flowed through surface of the HDD and a heat sink of the cooling module, and then exhausted from the outlet of the back panel board.