Patents by Inventor I-Ting Ho

I-Ting Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6678566
    Abstract: Within both a method for operating a plurality of fabrication facilities and a system for operating the plurality of fabrication facilities there is providing within each of the plurality of fabrication facilities a corresponding plurality of backup control systems. Within the method and the system, each backup control system is connected with the remaining backup control systems within the remaining fabrication facilities within the plurality of fabrication facilities, and each backup control system is programmed to forward a request for fabrication in a remote fabrication facility within the plurality of fabrication facilities and receive a request for fabrication from a remote fabrication facility within the plurality of fabrication facilities. The method and the system are particularly useful for fabricating semiconductor integrated circuit microelectronic fabrications.
    Type: Grant
    Filed: May 2, 2001
    Date of Patent: January 13, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: I-Ting Ho, I-Chieh Chung, Chuen-He Liou
  • Publication number: 20020165629
    Abstract: Within both a method for operating a plurality of fabrication facilities and a system for operating the plurality of fabrication facilities there is providing within each of the plurality of fabrication facilities a corresponding plurality of backup control systems. Within the method and the system, each backup control system is connected with the remaining backup control systems within the remaining fabrication facilities within the plurality of fabrication facilities, and each backup control system is programmed to forward a request for fabrication in a remote fabrication facility within the plurality of fabrication facilities and receive a request for fabrication from a remote fabrication facility within the plurality of fabrication facilities. The method and the system are particularly useful for fabricating semiconductor integrated circuit microelectronic fabrications.
    Type: Application
    Filed: May 2, 2001
    Publication date: November 7, 2002
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: I-Ting Ho, I-Chieh Chung, Chuen-He Liou
  • Patent number: D777470
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: January 31, 2017
    Inventor: I-Ting Ho
  • Patent number: D823717
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: July 24, 2018
    Assignee: Duraflex Hong Kong Limited
    Inventor: I-Ting Ho