Abstract: An RFID device includes a substrate and a lead frame secured to the substrate. The lead frame includes a pair of connection pads formed of a conductive material. An RFID chip and an antenna are electrically coupled to the lead frame. The width of the lead frame is substantially equal to the height of the lead frame. The connection pads of the lead frame may be oriented, among other options, along a direction parallel to a height of the substrate or along a direction parallel to a width of the substrate.

Abstract: Dual-mode RFID devices are provided with an integrated dual-mode RFID strap including either a UHF/HF dual-mode RFID chip or the combination of a UHF RFID chip and an HF RFID chip. An HF antenna and a UHF antenna are both coupled to the integrated dual-mode RFID strap, with the UHF antenna being formed by an approach other than etching, such as a cutting or printing operation, thereby reducing the cost to manufacture the device. If a pair of chips is employed, one of the chips may have a greater thickness than the other chip, which allows for the thicker chip to be incorporated into the device after the thinner chip without requiring a minimum separation between the two chips due to the size of a thermode used to secure the chips. Additionally, the first chip may be tested before securing the second chip, thereby limiting the cost of a rejected device.

Abstract: A radio frequency identification (RFID) tag with a configurable anti-tamper structure includes an RFID chip electrically connected to a configurable anti-tamper structure. The configurable anti-tamper structure includes a plurality of conductive segments substantially oriented in a ladder configuration. At least some of the plurality of conductive segments are cut to leave a single conductive path in accordance to the desired tamper detection application, and the RFID tag is attached with the anti-tamper structure placed across a break point to be monitored for tampering. When tampering occurs, the conductive path is broken and the RFID chip changes the data sent in response to interrogation by an RFID reader.

Abstract: A temperature-sensing RFID device includes an RFID chip and an antenna electrically coupled thereto. The RFID chip includes a temperature sensor, while the antenna is adapted to receive energy from an RF field and produce a signal. A shielding structure and/or a thermally conductive or absorbent structure may be associated with the RFID chip. The shielding structure is oriented so as to be positioned between at least a portion of the RFID chip and an outside environment and configured to shield the temperature sensor from at least one environmental factor capable of affecting a temperature sensed by the temperature sensor of an article to which the RFID device is secured. The thermally conductive or absorbent structure is oriented so as to be positioned between at least a portion of the RFID chip and the article and configured to enhance thermal coupling between the temperature sensor and the article.

Abstract: Radio frequency identification (RFID) systems for use with tires include a stud comprising reactive strap technology including an RFID chip and conductor. The stud is configured so as to be connected to a tire and to provide near field communication. The stud also may be coupled to an antenna structure to provide a far field RFID tag. The stud may unintentionally move with respect to the antenna structure during use, so the antenna structure may be configured to accommodate such movement without a change in the tuning of the RFID tag. A multi-antenna label may be provided to allow for selective coupling of the stud to a particular antenna, with differently configured tires being coupled to different antennas of the same type of multi-antenna label, which allows for the same label configuration to be used with a wider variety of tires.

Abstract: A temperature-sensing RFID device includes an RFID chip and an antenna electrically coupled thereto. The RFID chip includes a temperature sensor, while the antenna is adapted to receive energy from an RF field and produce a signal. A shielding structure and/or a thermally conductive or absorbent structure may be associated with the RFID chip. The shielding structure is oriented so as to be positioned between at least a portion of the RFID chip and an outside environment and configured to shield the temperature sensor from at least one environmental factor capable of affecting a temperature sensed by the temperature sensor of an article to which the RFID device is secured. The thermally conductive or absorbent structure is oriented so as to be positioned between at least a portion of the RFID chip and the article and configured to enhance thermal coupling between the temperature sensor and the article.

Abstract: Improved RFID devices and manufacturing methods that utilize more efficient RFID designs, result in less manufacturing material waste and increased recycling opportunities, all without sacrificing RFID device performance, are disclosed herein. Some exemplary embodiments of the improved RFID device may make use of a thinner foil, a hollowed-out foil, a “no-strip” design, or a tessellated design that may reduce material usage. Other exemplary embodiments may use a lower-impact and/or biodegradable adhesive so as to improve aluminum recycling and lessen risks to the environment.

Abstract: A packaging system that is manufactured entirely out of recyclable materials and that allows consumers to view the items, such as food items, within the package container is disclosed. Specifically, the packaging system comprises a package container manufactured entirely out of recyclable materials, and a code identifier component positioned thereon which is linked to an image or other information of the product contained within the package container. The code identifier component is typically a 2D bar code or an RFID tag. Further, the image linked to the code identifier component can be generic, or the actual individual image of the product in the container, and the image can be associated with the product during its manufacture, or when it is packaged. The image can be viewed with a tablet, mobile phone, virtual reality headset, a provided terminal, or other suitable device.

Abstract: Semiconductor wafer devices are formed of a wafer or a portion of a wafer. The wafer or wafer portion includes a plurality of functional blocks, one of which comprises an energy source and another which takes some other form, such as digital logic, data storage, a communication module, a display, a display driver, or a sensor. A functional block may be formed as part of processing of the wafer or may comprise a post-processing element. The functional blocks combine to provide an operational system having a plurality of functions. The wafer may be formed of an amorphous material, allowing the device to have a three-dimensional, non-planar structure, such as a cuboidal or tubular structure. If the device comprises only a portion of a wafer, a plurality of devices may be formed from a single wafer, with each portion being removed from the remainder of the wafer to define a device.

Abstract: RFID tags are provided for incorporation into the packaging of a microwavable food item, with the RFID tag being configured to be safely microwaved. The RFID tag includes an antenna defining a gap and configured to operate at a first frequency. An RFID chip is electrically coupled to the antenna across the gap. A shielding structure is electrically coupled to the antenna across the gap and overlays the RFID chip. The shielding structure includes a shield conductor and a shield dielectric at least partially positioned between the shield conductor and the RFID chip. The shielding structure is configured to limit the voltage across the gap when the antenna is exposed to a second frequency that is greater than first frequency. In additional embodiments, RFID tags are provided for incorporation into the packaging of a microwavable food item, with the RFID tag being configured to be safely microwaved. The RFID tag includes an RFID chip and an antenna electrically coupled to the RFID chip.

Abstract: A temperature-sensing RFID device includes an RFID chip and an antenna electrically coupled thereto. The RFID chip includes a temperature sensor, while the antenna is adapted to receive energy from an RF field and produce a signal. A shielding structure and/or a thermally conductive or absorbent structure may be associated with the RFID chip. The shielding structure is oriented so as to be positioned between at least a portion of the RFID chip and an outside environment and configured to shield the temperature sensor from at least one environmental factor capable of affecting a temperature sensed by the temperature sensor of an article to which the RFID device is secured. The thermally conductive or absorbent structure is oriented so as to be positioned between at least a portion of the RFID chip and the article and configured to enhance thermal coupling between the temperature sensor and the article.

Abstract: A high-field emission tolerant RFID tag device that may be secured to a product to be cooked, heated, reheated and/or thawed in a heating apparatus such as, but not limited to, a microwave oven and that does not need to be removed from the product before initiating the heating process. The RFID device is microwave safe and does not damage the product or food item to which it is attached during the microwave process, and may contain data to control the microwave process. The microwave safe RFID tag comprises a split ring (or shield) conductor formed on one side of a substrate (or dielectric), a coil antenna conductor formed on an opposite side of the substrate, and a RFID chip. The split ring conductor capacitively couples to the coil antenna conductor via the dielectric and a gap in the split ring conductor prevents arcing.

Abstract: Systems and methods are provided for assembling an RFID device mounted to a fabric substrate via a “flip chip” approach. The system includes a pin thermode with a tip configured to penetrate the fabric substrate. The pin thermode may include or omit a heating element, with the tip being variously configured. The tip may have a variable cross-sectional area or include a plurality of projections that separately penetrate the fabric substrate, for example. If the pin thermode includes a heating element, a body of the pin thermode may be formed of a low thermal conductivity material to allow the temperature of the tip to increase without increasing the temperature of the body to the same degree. The body may define a lumen, with the tip and/or body defining an aperture for flowing a liquid out of the pin thermode and into the region surrounding the pin thermode.

Abstract: RFID tags are provided for incorporation into the packaging of a microwavable food item, with the RFID tag being configured to be safely microwaved. The RFID tag includes a substrate having opposing first and second surfaces. An antenna is secured to the first surface, with the antenna defining a gap and being configured to operate at a first frequency. An RFID chip is electrically coupled to the antenna across the gap. A shielding structure is secured to the second surface of the substrate, with at least a portion of the shielding structure being in substantial alignment with the gap. The shielding structure is configured to limit the voltage across the gap when the antenna is exposed to a second frequency that is greater than first frequency. Also provided are methods for manufacturing RFID tags from a web in which conductive layers are secured to opposing surfaces of a substrate.

Abstract: The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.

Abstract: A combined EAS and RFID circuit includes an HF coil antenna, a UHF tuning loop, and an RFID chip coupled to a strap that includes a first coupling area and a second coupling area. The coil ends of the HF coil antenna are configured to capacitively and/or conductively couple to one or both of the first coupling area or second coupling area of the strap. The HF coil antenna can include a gap between turns for non-interfering placement of the UHF tuning loop. The EAS circuit can be deactivating upon application of a field at the resonant frequency of sufficient intensity to cause the breakdown voltage to be exceeded between a coil end and coupling area. The threshold breakdown voltage between a coil end and a coupling area can be reduced by laser ablation treatment of a conductive surface of one or both of the coil end or coupling area.

Abstract: In some embodiments, a radio frequency identification (RFID) tag system includes a first strap mounting pad of an RFID antenna component, and a second strap mounting pad of the RFID antenna component, the second strap mounting pad being electrically coupled to the first RFID strap mounting pad. At least one of the first strap mounting pad and the second strap mounting pad may extend diagonally with respect to a wide edge direction of the antenna component, thus making the RFID antenna component configured to receive both a strap that is parallel to a wide edge direction of the antenna component and a strap that is perpendicular to a wide edge direction of the antenna component.

Abstract: RFID-integrated packages are disclosed combining a container, an article positioned within the container, and a packing material positioned within the container between at least a portion of the article and an inner surface of the container. The packing material is manufactured by at least partially associating it with an RFID device. The packing material may be formed of a recyclable material, such as paper. The packing material together with the RFID device is processed to provide it with an impact-absorbing configuration. Processing methods may include folding, crushing, and cutting or slitting, with the RFID device continuing to perform well after it and the packing material have been processed into the impact-absorbing configuration for use within the container. The entire RFID device may be associated to the packing material or only a portion or component of RFID device may be associated to the packing material, with another portion or component associated to the container or article.

Abstract: An RFID tag is provided with an RFID chip and an antenna and interactive switch electrically coupled to the RFID chip. When a user physically interacts with the switch (such as by pressing the switch with a finger), the antenna transmits an input signal to an RFID reader of an RFID-based control system. The RFID reader, in turn, transmits a control signal to an electronic device for controlling the device. The RFID tag may be incorporated into any of a number of devices, such as a keyboard or article of clothing, and can function to operate a variety of electronic devices, including audio-visual devices and gaming systems.

Abstract: A multi-layer conductor device is disclosed comprising two or more conductors used in an antenna for a more durable radio-frequency identification (RFID) tag. The conductors interconnect electrically, but are separated mechanically, so a failure in one conductor will not necessarily cause a failure in the other conductor. And, if the failure occurs at different locations on the antenna, the current path through the antenna will bridge the break.