Patents by Inventor Ian Winfield

Ian Winfield has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for electrochemical additive manufacturing of parts using multi-purpose build plate
    Patent number: 11920251
    Abstract: An electrochemical additive manufacturing method includes positioning a build plate into an electrolyte solution. The conductive layer comprises at least one conductive-layer segment forming a pattern corresponding with a component. The method further comprises connecting the at least one conductive-layer segment and one or more deposition anodes to a power source. The one or more deposition anodes correspond with at least a portion of the pattern formed by the at least one conductive-layer segment. The method additionally comprises transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes corresponding with the at least the portion of the pattern formed by the at least one conductive-layer segment, through the electrolyte solution, and to the at least one conductive-layer segment, such that material is deposited onto the at least one conductive-layer segment and forms at least a portion of the component.
    Type: Grant
    Filed: September 6, 2022
    Date of Patent: March 5, 2024
    Assignee: FABRIC8LABS, INC.
    Inventors: David Pain, Ian Winfield, Andrew Edmonds, Kareem Shaik, Jeffrey Herman, Michael Matthews, Charles Pateros
  • SYSTEMS AND METHODS FOR ELECTROCHEMICAL ADDITIVE MANUFACTURING OF PARTS USING MULTI-PURPOSE BUILD PLATE
    Publication number: 20230070048
    Abstract: An electrochemical additive manufacturing method includes positioning a build plate into an electrolyte solution. The conductive layer comprises at least one conductive-layer segment forming a pattern corresponding with a component. The method further comprises connecting the at least one conductive-layer segment and one or more deposition anodes to a power source. The one or more deposition anodes correspond with at least a portion of the pattern formed by the at least one conductive-layer segment. The method additionally comprises transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes corresponding with the at least the portion of the pattern formed by the at least one conductive-layer segment, through the electrolyte solution, and to the at least one conductive-layer segment, such that material is deposited onto the at least one conductive-layer segment and forms at least a portion of the component.
    Type: Application
    Filed: September 6, 2022
    Publication date: March 9, 2023
    Inventors: David Pain, Ian Winfield, Andrew Edmonds, Kareem Shaik, Jeffrey Herman, Michael Matthews, Charles Pateros