Abstract: In a method for forming a micromechanical device, a force associated with operation of the device is varied between locations spaced across a conductive element of the device. The method may be used to form a switch adapted such that a force associated with actuation of the switch varies between locations spaced across a contact element of the switch. The varied force may include a required closing force for the switch, an applied force during actuation of the switch, a restoring force tending to open the switch, and/or a sticking force tending to keep the switch closed. A variable-valued circuit element having a conductive element and conductive pad may also be formed, adapted such that a fraction of the conductive element which is moved to the proximity of the conductive pad is variable depending on a total magnitude of a force applied.

Abstract: Etchant solutions for titanium-tungsten, which include at least one oxidizing agent and at least one fluoride salt. Also disclosed is a method for etching TiW utilizing these etchants.

Abstract: A method for electrolessly plating an overcoat metal on a metal conductor disposed on a dielectric surface of a substrate. The method includes removing carbonized film from the dielectric surface by applying a plasma discharge, acid treating the metal conductor by dipping the substrate in a first acid solution in order to clean the surface of the metal conductor, activating the metal conductor to allow electroless plating thereon by dipping the substrate in a metal activator solution, deactivating the dielectric surface to prevent electroless plating thereon without deactivating the metal conductor by dipping the substrate in a second acid solution, and plating an overcoat metal on the metal conductor by dipping the substrate in an electroless plating solution so that the overcoat metal plates on and coats the metal conductor without plating on the dielectric surface.

Abstract: A method for fabricating metal pillars in an electronic component. The method includes providing a base with spaced vias in a top surface, depositing an electrically conductive metal into the vias and over the top surface of the base so that a metal layer with an uneven top surface forms over the base, and planarizing the metal by polishing. The polishing can remove the entire metal layer leaving metal pillars in and aligned with the base. Or the polishing can be completed before removing the metal layer and metal above the base between the vias can be etched to form metal pillars with uniform heights which extend above the base. The invention is well suited for fabricating high-density multilayer copper/polyimide electrical interconnects.

Abstract: A plating rack for use in electroplating at least one substrate includes a rack body onto which the substrate may be placed; a metal ring connected to the rack body so as to surround a substrate placed on the rack body; and bistable, single-tipped cam assemblies for holding a placed substrate in place and for making electrical contact between the metal ring and the substrate.

Abstract: A method for detecting the completion of electrolessly depositing metal into a via. The method includes providing a non-autocatalytic detection mask with an opening over a via containing an autocatalytic material, electrolessly depositing a conductive metal into the via which fails to plate to the mask, and continuing the deposition until metal in the via contacts the mask, at which time the electrochemical potential of the mask changes and the metal plates to and covers the entire mask. The completion of the electroless via fill can be detected by changes in both the appearance and electrochemical potential of the mask.

Abstract: A method for patterning electroless plated metal on a polymer substrate. In a first embodiment a substrate is first coated with a polymer suitable for complexing a seed metal which can initiate electroless plating. The polymer is then mixed with a seed metal such as palladium, selectively irradiated to form the desired conductor pattern, and then etched so that the desired pattern remains. The substrate is subsequently placed in an electroless plating bath to form a metal pattern. In a second embodiment, before applying the seed metal a substrate immersed in a polymer solution suitable for complexing a seed metal can be selectively irradiated to selectively deposit polymer on the substrate, followed by applying a seed metal to form a polymer-seed metal mixture and an electroless plating bath. In addition, an alkaline chemical may be added to an acidic polymer to prevent the polymer from etching metal on the substrate.

Abstract: A plating rack for use in electroplating at least one substrate includes a rack body onto which the subtrate may be placed; a metal ring connected to the rack body so as to surround a substrate placed on the rack body; and bistable, single-tipped cam assemblies for holding a placed substrate in place and for making electrical contact between the metal ring and the substrate.

Abstract: An improved method for preparing high temperature Bi-Sr-Ca-Cu-O superconductive films utilizing spray pyrolysis. The method can further include an additional annealing step to improve the electrical transport properties.

Abstract: A process and solution for selectively etching copper. The etching is effected by a nonaqueous solution of dimethyl sulfoxide and a halocarbon compound.

Abstract: A method of building a multilevel electrical interconnect supported by metal pillars with air as a dielectric. The metal conductors and metal support pillars are formed using a photo-imagible polymer which serves the function of patterning and also provides a temporary support during construction.