Patents by Inventor Ichiharu Kondoh

Ichiharu Kondoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Physical quantity sensor, method for manufacturing the same, and resin film for bonding semiconductor chip and circuit chip
    Patent number: 7615832
    Abstract: A sensor includes: a semiconductor chip having a sensing portion and a first bump; a circuit chip having a second bump; and a resin film having a groove. The semiconductor chip and the circuit chip are integrated with sandwiching the resin film therebetween. The resin film includes a first space and a second space before the first bump is bonded to the second bump. The first space faces the sensing portion. The second space is disposed on a periphery of the first space. The resin film expands when the first bump is bonded to the second bump. The second space accommodates an expanded portion of the resin film. The first space provides the groove after the first bump is bonded to the second bump.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: November 10, 2009
    Assignee: DENSO CORPORATION
    Inventors: Ichiharu Kondoh, Ryuichiro Abe, Akitoshi Yamanaka, Yoshio Nakajima
  • Physical quantity sensor, method for manufacturing the same, and resin film for bonding semiconductor chip and circuit chip
    Publication number: 20070235825
    Abstract: A sensor includes: a semiconductor chip having a sensing portion and a first bump; a circuit chip having a second bump; and a resin film having a groove. The semiconductor chip and the circuit chip are integrated with sandwiching the resin film therebetween. The resin film includes a first space and a second space before the first bump is bonded to the second bump. The first space faces the sensing portion. The second space is disposed on a periphery of the first space. The resin film expands when the first bump is bonded to the second bump. The second space accommodates an expanded portion of the resin film. The first space provides the groove after the first bump is bonded to the second bump.
    Type: Application
    Filed: February 8, 2007
    Publication date: October 11, 2007
    Applicant: DENSO CORPORATION
    Inventors: Ichiharu Kondoh, Ryuichiro Abe, Akitoshi Yamanaka, Yoshio Nakajima