Abstract: The method of the present disclosure includes: (I) irradiating a polymer film (1) with an ion beam composed of ions (2) accelerated in a cyclotron so as to form a polymer film that has collided with the ions in the beam; and (II) chemically etching the polymer film formed in the irradiation (I) so as to form openings (4b) and/or through holes (4a) corresponding to tracks (3) left by the colliding ions in the polymer film. In the irradiation (I), a beam current value of the ion beam is detected upstream and/or downstream of the polymer film in a path of the ion beam, and an irradiation conditioning factor in the irradiation of the polymer film with the ion beam is controlled based on the detected beam current value so that the polymer film can be irradiated with the ions at a predetermined irradiation density. The method of the present disclosure is suitable for industrial production of porous polymer films.

Abstract: The present invention provides a method for producing an optical member including the steps of subjecting a surface of a resin film to laser beam irradiation via a projection mask,.while sequentially moving either the resin film or the projection mask, or the both, and etching the resin film plural times to work into the shape of a lens, wherein the projection mask comprises plural light-transmitting parts or light-shielding parts having gradually different sizes; and a method for producing a molding die for the optical member. The method for producing an optical member and the method for producing a molding die for an optical member can be suitably used in, for example, a microlens sheet, a light-condensing sheet, a light-diffusing sheet, or the like.

Abstract: The present invention provides a process for producing a filmy optical waveguide from a filmy structure having one or more optical-waveguide parts formed therein, which process comprises: cutting each optical-waveguide part out of the filmy structure to thereby form an optical waveguide having a light entrance end face and a light emission end face, wherein the cutting for making the light entrance end face and the light emission end face is conducted with a laser light and the cutting for making cut surfaces other than said end faces is conducted by punching with a die.

Abstract: In a liquid-crystal display device, an optical path control layer is provided at least on an outer side of the back side substrate, and has a plurality of optical path changing slopes inclined at an inclination angle of from 35 to 48 degrees with respect to a reference plane of the back side substrate. The optical path control layer has a refractive index higher than that of a low-refractive-index transparent layer provided in the back side substrate. Another low-refractive-index transparent layer lower in refractive index than the transparent substrate may be provided in a visual side substrate. Light sources may be disposed on at least two side surfaces of the liquid-crystal display panel. Light sources may be disposed on side surfaces of the back side substrate and the visual side substrate and at least on side surfaces of the liquid-crystal display panel which are different from each other. Another optical path control layer may be provided also on an outer side of the visual side substrate.

Abstract: In a liquid-crystal display device, an optical path control layer is provided at least on an outer side of the back side substrate, and has a plurality of optical path changing slopes inclined at an inclination angle of from 35 to 48 degrees with respect to a reference plane of the back side substrate. The optical path control layer has a refractive index higher than that of a low-refractive-index transparent layer provided in the back side substrate. Another low-refractive-index transparent layer lower in refractive index than the transparent substrate may be provided in a visual side substrate. Light sources may be disposed on at least two side surfaces of the liquid-crystal display panel. Light sources may be disposed on side surfaces of the back side substrate and the visual side substrate and at least on side surfaces of the liquid-crystal display panel which are different from each other. Another optical path control layer may be provided also on an outer side of the visual side substrate.

Abstract: A probe structure containing a contact part (2) formed on one side (1a) of an insulating substrate (1), a conductive circuit (3) formed on the other side (1b) of the insulating substrate (1), wherein the contact part (2) and the conductive circuit (3) are connected via a conductive path (5) formed in a through-hole (4) in the thickness direction of the insulating substrate (1). The contact part (2) has a structure containing a deep layer (1c) having a hardness of 100-700 Hk, an intermediate layer (1b) having a hardness of 10-300 Hk, and a surface layer (1a) having a hardness of 700-1200 Hk successively laminated. The surface layer (1a) preferably has a tensile stress of not more than 50 kg/mm.sup.2. The probe structure maintains low and stable contact resistance in an electric test, in particular a burn-in test, of small test objects such as IC.