Patents by Inventor Ichiro Gyobu

Ichiro Gyobu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5062771
    Abstract: This invention concerns a production method and a processing apparatus for semiconductor devices, as well as an evacuating apparatus used for the processing apparatus. According to this invention, since the evacuation system of pressure-reduction processing apparatus for conducting various wafer processings during production steps of semiconductor devices is constituted only with oil-free vacuum pump, deleterious oil contaminations or carbonation products of oils produced from oils upon heating are not present in the pressure-reducing processing chamber as compared with conventional pressure-reducing processing apparatus using a vacuum oil pump as an evacuation pump and the production method of semiconductor devices using such apparatus.
    Type: Grant
    Filed: March 20, 1989
    Date of Patent: November 5, 1991
    Assignees: Hitachi, Ltd., Hitachi Tokyo Electronics Co. Ltd.
    Inventors: Akihiko Satou, Tadao Kusaka, Shigeo Tomiyama, Kouzi Aoki, Ichiro Gyobu, Kimio Muramatsu, Hiroaki Sakamoto, Shinjiroo Ueda, Masahiro Mase, Takashi Nagaoka
  • Patent number: 4904155
    Abstract: A vacuum pump with a heating portion for preventing adhesion of reaction products on a discharge side thereof.
    Type: Grant
    Filed: July 12, 1988
    Date of Patent: February 27, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Nagaoka, Ichiro Gyobu, Kimio Muramatsu, Keiji Ueyama, Masahiro Mase, Yoshihisa Awada, Akira Nishiuchi
  • Patent number: 4835114
    Abstract: This invention concerns a production method and a processing apparatus for semiconductor devices, as well as an evacuating apparatus used for the processing apparatus. According to this invention, since the evacuation system of pressure-reduction processing apparatus for conducting various wafer processings during production steps of semi-conductor devices is constituted only with oil-free vacuum pump, deleterious oil contaminations or carbonation products of oils produced from oils upon heating are not present in the pressure-reducing processing chamber as compared with conventional pressure-reducing processing apparatus using a vacuum oil pump as an evacuation pump and the production method of semiconductor devices using such apparatus.
    Type: Grant
    Filed: February 19, 1987
    Date of Patent: May 30, 1989
    Assignees: Hitachi, Ltd., Hitachi Tokyo Electronics Co., Ltd.
    Inventors: Akihiko Satou, Tadao Kusaka, Shigeo Tomiyama, Kouzi Aoki, Ichiro Gyobu, Kimio Muramatsu, Hiroaki Sakamoto, Shinjiroo Ueda, Masahiro Mase, Takashi Nagaoka
  • Patent number: 4354802
    Abstract: A vaned diffuser disposed around an outer periphery of an impeller of a centrifugal compressor comprises a pair of diffuser plates which constitute side walls of the vaned diffuser and define therebetween a fluid channel, and a plurality of vanes arranged in the fluid channel defined between the diffuser plates. At least one rib is arranged on that surface area of at least one of the diffuser plates which is defined between the adjacent vanes, so as to improve condition of a fluid flowing through the vaned diffuser to thereby improve efficiency of the latter. The rib is of a height not larger than one-half the height of the vanes and has a leading edge located upstream of the leading edges of the vanes as viewed in a fluid flow direction.
    Type: Grant
    Filed: April 3, 1980
    Date of Patent: October 19, 1982
    Assignee: Hitachi, Ltd.
    Inventors: Hideo Nishida, Fumio Koseki, Ichiro Gyobu