Abstract: A thick-film printed circuit board and a method for producing the same are disclosed, in which wiring conductors having connecting sections for connection with solder electrodes of an electronic element such as a semiconductor chip are provided on an insulating substrate. A layer of insulating material having through holes at positions corresponding to the connecting terminals of the electronic element is covered on the wiring conductors. Conductor pedestals for connection with the electronic element are filled in the through holes and formed on the insulating layer. Each of the pedestals has an area for contact with the connecting terminals of the electronic element.

Abstract: A plurality of drive leads are taken out of the opposite outer ends of a thermal resistor assembly including a plurality of series-connected thermal resistor elements and junction points between adjacent ones of the thermal resistor elements, thereby dividing the drive leads to alternately belong to a first and a second set of drive leads. The drive leads of the second set of drive leads are further divided to alternately belong to a first and a second group. At least one of the drive leads of the first set of drive leads is selected in accordance with a given pattern and connected to recording signal input means. At the same time, one of the first and second group is selected in accordance with the given pattern, and a common power supply line associated with the selected group is connected to first potential means, a common power supply line associated with the group being connected to second potential means.