Patents by Inventor Ichiro Kataoka

Ichiro Kataoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240126932
    Abstract: A design support device for performing a check of a defect suppresses defects such as rework in product design and manufacturing and appropriately proposing a criterion, which is an item to be checked in accordance with the actual situation. The design support device includes a memory that stores past subject information for a product designed in the past, thereby storing a correspondence table in which criteria indicating check items are associated, an input unit that receives input of new subject information of a product of a new subject to be checked, a priority calculation unit that calculates a priority of the criterion indicating the check item for the product of the new subject corresponding to the input new subject information, using the correspondence table, and an output unit that outputs the calculated criterion on the screen according to the priority.
    Type: Application
    Filed: February 2, 2022
    Publication date: April 18, 2024
    Applicant: Hitachi, Ltd.
    Inventor: Ichiro KATAOKA
  • Patent number: 11948711
    Abstract: A grain oriented electrical steel sheet includes a base steel sheet, a glass film, and a tension-insulation coating. When a glow discharge emission spectroscopy is conducted from a surface of the glass film toward a depth direction, an analysis starting time Ts, a time TAlp at which Al shows a maximum emission intensity, an Al emission intensity F(TAlp) at the TAlp, a time TSip at which Si shows a maximum emission intensity, and an Al emission intensity F(TSip) at the TSip satisfy 0.05?F(TSip)/F(TAlp)?0.50 and 2.0?(TAlp?Ts)/(TSip?Ts)?5.0.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: April 2, 2024
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Takashi Kataoka, Ichiro Tanaka, Haruhiko Atsumi, Kazutoshi Takeda, Ryutaro Yamagata, Nobusato Morishige
  • Publication number: 20240086592
    Abstract: A design assistance device (10) comprises: a determination rule definition unit (102) that defines a determination rule for determining whether a CAD model (103) violates a design guideline (101); a geometric shape recognition unit (105) that extracts, from the CAD model (103), a violation location violating the design guidelines (101), by using geometric shape recognition based on the determination rule defined by the determination rule definition unit (102); and a feature amount recognition unit (108) that identifies, from among violation locations, a violation location violating the design guidelines (101), by using feature amount recognition based on a prescribed feature amount of the violation location extracted by the geometric shape recognition unit (105).
    Type: Application
    Filed: August 31, 2020
    Publication date: March 14, 2024
    Inventors: Erika KATAYAMA, Ichiro KATAOKA, Makoto ONODERA
  • Patent number: 11238192
    Abstract: A design support apparatus that outputs a plurality of pairs of output parameters for a pair of input parameters is provided. The apparatus includes: an analysis controlling unit that generates a sampling point in design space based on an input parameter, performs calculation in accordance with the sampling point, and acquires a calculation result as an output parameter; a machine learning unit that performs machine learning on a relationship between the input and output parameters; a design plan generating unit that calculates a design plan corresponding to information learned by the machine learning unit; a visualizing unit that visualizes the design space, and displays the calculation result and the design plan in the visualized design space; a design region unit that specifies a region in a vicinity of the design plan in the visualized design space; and an output unit that outputs the calculation result contained in the region.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: February 1, 2022
    Assignee: Hitachi, Ltd.
    Inventors: Norihiko Nonaka, Ichiro Kataoka
  • Publication number: 20210232740
    Abstract: An object of the present invention is to provide a design plan generation device that is capable of obtaining information such as a configuration and performance of a mechanical structure with respect to a design specification of nonsimilar input data, and reliability of a prediction result, shortening a design period, and generating a design plan having high reliability.
    Type: Application
    Filed: March 12, 2019
    Publication date: July 29, 2021
    Inventors: Norihiko NONAKA, Ichiro KATAOKA
  • Publication number: 20190362038
    Abstract: A design support apparatus that outputs a plurality of pairs of output parameters for a pair of input parameters is provided.
    Type: Application
    Filed: January 29, 2018
    Publication date: November 28, 2019
    Inventors: Norihiko NONAKA, Ichiro KATAOKA
  • Patent number: 10115691
    Abstract: A module, comprising an electronic component having a first electrode, a mounting board having a second electrode, a solder-bump configured to connect the first electrode and the second electrode, and a thermoplastic resin member configured to contact both the first electrode and the second electrode and cover the solder-bump, so as to form a space between the electronic component and the mounting board.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: October 30, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Ichiro Kataoka, Takahiro Hachisu, Tadashi Kosaka
  • Patent number: 10032375
    Abstract: The invention is to specify a poor visibility portion by using only a sensor standardly mounted on a connected car without any special measurement device or equipment and provide information thereon to a driver or an automatic driving device.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: July 24, 2018
    Assignee: Hitachi, Ltd.
    Inventors: Kazuo Muto, Ichiro Kataoka, Takashi Okada, Toshiharu Sugawara, Atsushi Katou, Katsuhiro Samizo
  • Patent number: 9866653
    Abstract: The present invention is a data transfer system that can transfer, with respect to simulation result data, physical quantities necessary for a user, further perform area division based on characteristics of physical quantities, designate an allowable range of a compression error according to a purpose for each of divided areas, compress the data on the basis of the designated error range, transfer the data, and further display an error of each of the divided areas for each of the physical quantities on a receiver/client side.
    Type: Grant
    Filed: August 2, 2013
    Date of Patent: January 9, 2018
    Assignee: Hitachi, Ltd.
    Inventors: Yixiang Feng, Masayuki Hariya, Ichiro Kataoka, Makoto Onodera
  • Publication number: 20170330852
    Abstract: A module, comprising an electronic component having a first electrode, a mounting board having a second electrode, a solder-bump configured to connect the first electrode and the second electrode, and a thermoplastic resin member configured to contact both the first electrode and the second electrode and cover the solder-bump, so as to form a space between the electronic component and the mounting board.
    Type: Application
    Filed: April 19, 2017
    Publication date: November 16, 2017
    Inventors: Ichiro Kataoka, Takahiro Hachisu, Tadashi Kosaka
  • Patent number: 9815133
    Abstract: A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: November 14, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ichiro Kataoka, Hiroshi Kondo, Tadashi Kosaka, Koji Tsuduki, Hisatane Komori, Shin Hasegawa
  • Patent number: 9673141
    Abstract: A mounting member includes a plurality of internal connecting portions, each of which is electrically connected to an electronic device, and a plurality of external connecting portions, each of which is soldered, wherein the plurality of external connecting portions include a first connecting portion in communication with at least any of the plurality of internal connecting portions, and a second connecting portion different from the first connecting portion, and surfaces of the first connecting portion and the second connecting portion include gold layers, and a thickness of the gold layer of the second connecting portion is smaller than a thickness of the gold layer of the first connecting portion.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: June 6, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Ichiro Kataoka, Osamu Hamamoto, Kazuya Notsu, Koji Tamura, Kunihiko Minegishi
  • Publication number: 20170116856
    Abstract: The invention is to specify a poor visibility portion by using only a sensor standardly mounted on a connected car without any special measurement device or equipment and provide information thereon to a driver or an automatic driving device.
    Type: Application
    Filed: October 19, 2016
    Publication date: April 27, 2017
    Inventors: Kazuo MUTO, Ichiro KATAOKA, Takashi OKADA, Toshiharu SUGAWARA, Atsushi KATOU, Katsuhiro SAMIZO
  • Patent number: 9585287
    Abstract: An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: February 28, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yu Katase, Fujio Ito, Tadashi Kosaka, Koji Tsuduki, Ichiro Kataoka
  • Publication number: 20160182686
    Abstract: The present invention has an object of providing a data transfer system and a data transfer method that can transfer, with respect to simulation result data, only physical quantities necessary for a user, further perform area division based on characteristics of physical quantities, designate an allowable range of a compression error according to a purpose for each of divided areas, compress the data on the basis of the designated error range, transfer the data, and further display an error of each of the divided areas for each of the physical quantities on a receiver/client side.
    Type: Application
    Filed: August 2, 2013
    Publication date: June 23, 2016
    Inventors: Yixiang FENG, Masayuki HARIYA, Ichiro KATAOKA, Makoto ONODERA
  • Publication number: 20160044796
    Abstract: A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.
    Type: Application
    Filed: August 3, 2015
    Publication date: February 11, 2016
    Inventors: Ichiro Kataoka, Hiroshi Kondo, Tadashi Kosaka, Koji Tsuduki, Hisatane Komori, Shin Hasegawa
  • Patent number: 9202314
    Abstract: A hexahedral mesh generator for an analysis model generation target includes an existing analysis model database that stores shape data of existing analysis models before and after shape decomposition, a shape decomposition part extracting module that compares the shapes existing analysis models before and after the shape decomposition, a shape comparison module that compares each shape decomposition part with the analysis model generation target and checks whether the shape decomposition part coincides with at least part of the analysis model generation target, a coinciding shape decomposition part display/selection module that displays coinciding shape decomposition parts and outputs shape decomposition parts selected by the user, a shape decomposition module that decomposes the shape of the analysis model generation target in the same way as the outputted shape decomposition parts, and a hexahedral mesh generating module that generates the hexahedral mesh for the analysis model generation target after unde
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: December 1, 2015
    Assignee: Hitachi, Ltd.
    Inventors: Kazuo Muto, Ichiro Kataoka, Masayuki Hariya
  • Publication number: 20150279770
    Abstract: A package for mounting a semiconductor element includes a substrate including an upper face having a region where a semiconductor element is mounted, a lower face positioned on a side opposite to the upper face, and a side face connecting the upper face and the lower face and an electrode formed on the side face to extend in a direction from the lower face to the upper face. A width of the electrode at a first height in the direction from the lower face to the upper face is smaller than that of the electrode at a second height closer to the upper face than the first height in the direction from the lower face to the upper face.
    Type: Application
    Filed: March 16, 2015
    Publication date: October 1, 2015
    Inventors: Ichiro Kataoka, Tadashi Kosaka, Takanori Suzuki
  • Publication number: 20150255383
    Abstract: A mounting member includes a plurality of internal connecting portions, each of which is electrically connected to an electronic device, and a plurality of external connecting portions, each of which is soldered, wherein the plurality of external connecting portions include a first connecting portion in communication with at least any of the plurality of internal connecting portions, and a second connecting portion different from the first connecting portion, and surfaces of the first connecting portion and the second connecting portion include gold layers, and a thickness of the gold layer of the second connecting portion is smaller than a thickness of the gold layer of the first connecting portion.
    Type: Application
    Filed: March 3, 2015
    Publication date: September 10, 2015
    Inventors: Ichiro Kataoka, Osamu Hamamoto, Kazuya Notsu, Koji Tamura, Kunihiko Minegishi
  • Publication number: 20150193557
    Abstract: The present invention provides a design support system for easily identifying extent of impact of design change while saving the labor involved in working on the design change. The system includes: a simulation execution unit that executes a simulation by executing a program on a server using predetermined parameters regarding the design of an object; an extent-of-impact extraction unit that extracts extent of impact that parts are subject to due to design change, from an analysis result obtained through execution of the simulation by the simulation execution unit; and an output unit that outputs the extent of impact extracted by the extent-of-impact extraction unit.
    Type: Application
    Filed: September 24, 2012
    Publication date: July 9, 2015
    Inventors: Azuma Okuno, Masayuki Hariya, Ichiro Nishigaki, Ichiro Kataoka