Patents by Inventor Ichiro Kawakatsu

Ichiro Kawakatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electric soldering iron
    Patent number: 6247631
    Abstract: A soldering iron device has a gas passage formed by enclosing a soldering iron tip 3 of an electric soldering iron with double pipes 6 and 7 to make a nozzle. By providing projections A, B and C in the spacing between said double pipes, the double pipes are prevented from any eccentricity and biasing, and the velocity of an inert gas G to be supplied is made slow to ensure that the gas is jet through the nozzle tip end. Further, engulfing of oxygen in the atmospheric air can be suppressed, whereby it is possible to prevent defective wetting of solder due to high temperature oxidation of the soldering iron tip and to suppress high temperature oxidation of workpieces and flux cored solder alloy and flux, and excellent solderability is obtained.
    Type: Grant
    Filed: January 10, 2000
    Date of Patent: June 19, 2001
    Assignee: Hakko Corporation
    Inventors: Ichiro Kawakatsu, Takashi Uetani
  • Method and apparatus for soldering a workpiece in a non-oxidizing gas atmosphere
    Patent number: 5388752
    Abstract: A method and apparatus for soldering a workpiece in a non-oxidizing gas are achieved by comprising conveyors running in a substantially horizontal direction, for holding and moving a workpiece in the horizontal direction, a flux supplying unit for supplying flux to the workpiece, a solder bath including solder and disposed under the conveyors such that the workpiece with a parting portion parting from the top of solder flow is dipped in the top of solder flow, and jetting unit provided at an exit side of the solder bath with respect to the conveyors and connected to a non-oxidizing gas source, for jetting non-oxidizing gas from the non-oxidizing gas source into a region defined by the parting portion of the workpiece and a vicinity thereof.
    Type: Grant
    Filed: November 18, 1993
    Date of Patent: February 14, 1995
    Inventor: Ichiro Kawakatsu
  • Process for producing a tin/lead alloy solder joint with less wetting agent residue
    Patent number: 4496098
    Abstract: Surfaces of copper or brass which are to be joined by tin/lead alloy soldering in a non-oxydizing atmosphere are first wetted by a treating liquid containing an organic solvent typified by ethyl alcohol; a polyhydric alcohol derivative typified by ethylene glycol; and an organic, halogen-containing activator typified by aniline hydrochloride. In the resulting soldered joint, the solder has spread acceptably well and little oxidation or wetting agent resident is formed.
    Type: Grant
    Filed: March 25, 1982
    Date of Patent: January 29, 1985
    Inventor: Ichiro Kawakatsu
  • Heat resisting copper base brazing filler metal
    Patent number: 4071358
    Abstract: A heat resisting copper base brazing filler metal consisting essentially of by weight percent, 10 to 20 manganese, 2 to 10 nickel, 0.5 to 4.0 tin, 0.5 to 4.0 indium and balance copper. The brazing filler metal provides sound, tight joints with excellent strength retention at elevated temperatures.
    Type: Grant
    Filed: February 16, 1977
    Date of Patent: January 31, 1978
    Assignee: Kabushiki Kaisha Komatsu Seisakusho
    Inventor: Ichiro Kawakatsu