Patents by Inventor Ida Fischbach

Ida Fischbach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device using diffusion soldering
    Patent number: 8975117
    Abstract: A method includes providing a semiconductor chip having a first main surface and a second main surface. A semiconductor chip is placed on a carrier with the first main surface of the semiconductor chip facing the carrier. A first layer of solder material is provided between the first main surface and the carrier. A contact clip including a first contact area is placed on the semiconductor chip with the first contact area facing the second main surface of the semiconductor chip. A second layer of solder material is provided between the first contact area and the second main surface. Thereafter, heat is applied to the first and second layers of solder material to form diffusion solder bonds between the carrier, the semiconductor chip and the contact clip.
    Type: Grant
    Filed: February 8, 2012
    Date of Patent: March 10, 2015
    Assignee: Infineon Technologies AG
    Inventors: Ralf Otremba, Fong Lim, Abdul Rahman Mohamed, Chooi Mei Chong, Ida Fischbach, Xaver Schloegel, Juergen Schredl, Josef Hoeglauer
  • Semiconductor Device Using Diffusion Soldering
    Publication number: 20130200532
    Abstract: A method includes providing a semiconductor chip having a first main surface and a second main surface. A semiconductor chip is placed on a carrier with the first main surface of the semiconductor chip facing the carrier. A first layer of solder material is provided between the first main surface and the carrier. A contact clip including a first contact area is placed on the semiconductor chip with the first contact area facing the second main surface of the semiconductor chip. A second layer of solder material is provided between the first contact area and the second main surface. Thereafter, heat is applied to the first and second layers of solder material to form diffusion solder bonds between the carrier, the semiconductor chip and the contact clip.
    Type: Application
    Filed: February 8, 2012
    Publication date: August 8, 2013
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Ralf Otremba, Fong Lim, Abdul Rahman Mohamed, Chooi Mei Chong, Ida Fischbach, Xaver Schloegel, Juergen Schredl, Josef Hoeglauer