Abstract: A connector for attachment to glass for connecting an electrically conductive substrate to an electric conduit is disclosed. The connector includes an electrically non-conductive housing having an interior region and an underside with a slot formed therein. The connector further includes an electrically conductive insert. The conductive insert has a contact portion that extends at least partially through the slot defined in the housing. A pre-applied, heat-activatable adhesive is provided on the underside of the housing for attaching the housing to the glass. The disclosed invention is provided in two embodiments, one that maintains conductivity between the substrate and the contact portion by a compressive force and one that maintains conductivity by lead-free solder. In the first embodiment, the contact portion includes a conductive skid extending therefrom. In the second embodiment, at least the contact portion of the conductive insert is coated with lead-free solder.

Abstract: A connector for attachment to glass for connecting an electrically conductive substrate to an electric conduit is disclosed. The connector includes an electrically non-conductive housing having an interior region and an underside with a slot formed therein. The connector further includes an electrically conductive insert. The conductive insert has a contact portion that extends at least partially through the slot defined in the housing. A pre-applied, heat-activatable adhesive is provided on the underside of the housing for attaching the housing to the glass. The disclosed invention is provided in two embodiments, one that maintains conductivity between the substrate and the contact portion by a compressive force and one that maintains conductivity by lead-free solder. In the first embodiment, the contact portion includes a conductive skid extending therefrom. In the second embodiment, at least said contact portion of the conductive insert is coated with lead-free solder.