Abstract: An air mask is applied for a user to wear and includes a wearable main body, an airflow generator and a face shield. The wearable main body has a front part and a rear part and includes an airflow channel, an air inputting port disposed on the rear part, and an air outputting port disposed on the front part. The airflow generator is coupled to the air inputting port and configured for generating and guiding airflow to the airflow channel. The face shield is coupled to the front part of the wearable main body and has an air chamber communicated with the air outputting port. When the user wears the air mask, the air inputting port is located on rear head of the user, the air outputting port is located on forehead of the user, and the airflow flows downward from the forehead of the user to the air chamber.

Abstract: The present invention discloses a social distancing device system including a first social distancing device and a computing device. The first social distancing device includes a distance detecting module configured to detect a distance between the first social distancing device and a second social distancing device, a process configured to record a time information and a duration of contacting when the distance detected by the distance detecting module is less than a predetermined distance, and a transmission module configured to transmit a signal including the time information and the duration of contacting. The computing device includes a database configured to store the time information and the duration of contacting and a computing module configured to calculate an exposure risk of the first social distancing device according to the time information and the duration of contacting.

Abstract: A release mechanism for releasing a transceiver module from a cage includes a fixed component, a locking component, and a pull component, where the locking component is used for locking the transceiver module in the cage and pivotally connected to the transceiver module. The user pulls the pull component to make the locking component to rotate to unlock and then draw out the transceiver module. The locking component further includes a spring part against the fixed component to resist the rotation and assist the locking component back to the original position. According to the fewer components and the easy assembly of the release mechanism, the total assembly cost of the transceiver module can be reduced significantly.

Abstract: A multiple safety belt fastening and quick release device includes a housing that may be configured to receive one or more safety belt buckles. Tongues of the safety belts may be secured in the housing by a locking mechanism of the device. Each secured safety belt tongue may be associated with a locking mechanism that operates independently of other present locking mechanisms. A release mechanism may simultaneously release all secured safety belts.

Abstract: A package for a fiber optic transceiver that integrates the intermediate rear gasket into the lower body of the transceiver package. As such, the EMI fingers are much thicker than current art EMI fingers, 0.010? thick as compared to current art 0.002? thick. In current art devices, providing such robust EMI fingers is not possible. The connecting pins that secure the transceiver cage to the PCB are self-centering press-fit pins formed from a plurality of legs. At least one of the legs provides an electrical connection point for the transceiver on which the pins are used. The connecting pin is formed so that the legs act as leaf springs to securely hold the connector in place in the proper installation hole in the board on which the transceiver is installed. The pins are stamped from sheet metal with a progressive die process. By changing the amount of flexion in the legs of the pin, the pressure required to insert the pin into a connection hole, and hence the retaining pressure, can be varied.

Abstract: A self-centering press-fit pin that is typically used to secure components to a printed circuit board (PCB). The device includes more than one leg, the legs providing connection points for the component on which the pins are installed. The pin is formed so that the legs act as leaf springs to securely hold the connector in place in the proper installation hole in the board on which the component is installed. The pins are stamped from sheet metal with a progressive die process. By changing the amount of flexion in the legs of the pin, the pressure required to insert the pin into, and remove the pin from, a connection hole can be varied.

Abstract: A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.

Abstract: A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.

Abstract: A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.

Abstract: A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.

Abstract: A shield for a PCB package for shielding electromagnetic radiation from exiting or entering the package. Typically, the package includes first and second electrically conductive covers and first and second frames. A printed circuit board fits within the shield, and the shield fits within the first and second covers and frames. The shield has side walls which surround a perimeter of the printed circuit board so as to prevent electromagnetic radiation from entering and exiting through the first and second frames of the package. The shield also has ground springs which electrically connect the shield with the first and second covers so as to insulate the printed circuit board from electromagnetic radiation radiating to and from directions perpendicular to planes of the first and second covers. The shield also includes side springs which attached to the side walls and press against a side edge of one of the first and second frames so as to secure the shield within the package.

Abstract: A process by which a package for a memory card is manufactured. The package comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended fingers which wrap around the plastic frame. This provides a double layer of metal at the perimeter of the frame. The two cover halves are situated so as to encapsulate the subject PCB and to affix it in its proper position. The two cover halves are then welded together using sonic welding on the plastic frame. The package has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.

Abstract: A container for a memory card and the process by which the container is manufactured. The container comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended fingers which wrap around the plastic frame. This provides a double layer of metal at the perimeter of the frame. The two cover halves are situated so as to encapsulate the subject PCB and to affix it in its proper position. The two cover halves are then welded together using sonic welding on the plastic frame. The frame has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.

Abstract: A process by which a package for a memory card is manufactured. The package comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended fingers which wrap around the plastic frame. This provides a double layer of metal at the perimeter of the frame. The two cover halves are situated so as to encapsulate the subject PCB and to affix it in its proper position. The two cover halves are then welded together using sonic welding on the plastic frame. The package has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.