Patents by Inventor Ik Beom Kim

Ik Beom Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing porous copper foil and porous copper foil produced by the same
    Patent number: 11028495
    Abstract: Provided is a method for producing a porous copper foil. The method includes forming a release layer on a metal carrier, growing copper islands on the metal carrier formed with the release layer by electroless copper plating, forming a porous copper thin layer by copper electroplating, and peeling off the porous copper thin layer from the release layer.
    Type: Grant
    Filed: March 18, 2018
    Date of Patent: June 8, 2021
    Assignee: YMT CO., LTD.
    Inventors: Sung Wook Chun, Ik Beom Kim, Seon Gi Jeon, Dae Hoon Lee, Youn Bong Kang, Jun Mo Hong, Hyeong Gyu Park
  • METHOD FOR PRODUCING POROUS COPPER FOIL AND POROUS COPPER FOIL PRODUCED BY THE SAME
    Publication number: 20180282890
    Abstract: Provided is a method for producing a porous copper foil. The method includes forming a release layer on a metal carrier, growing copper islands on the metal carrier formed with the release layer by electroless copper plating, forming a porous copper thin layer by copper electroplating, and peeling off the porous copper thin layer from the release layer.
    Type: Application
    Filed: March 18, 2018
    Publication date: October 4, 2018
    Inventors: Sung Wook Chun, Ik Beom Kim, Seon Gi Jeon, Dae Hoon Lee, Youn Bong Kang, Jun Mo Hong, Hyeong Gyu Park