Patents by Inventor Ik Su Jun

Ik Su Jun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Concentrated photovoltaic receiver module with improved optical light guide assembly
    Patent number: 9362437
    Abstract: In accordance with the present invention, there is provided multiple embodiments of a concentrated photovoltaic (CPV) module or package. In each embodiment of the present invention, the CPV module includes a mounting device or holder for use in maintaining an optical member or optical light guide of the module in a prescribed position relative to the solar cell or receiver die thereof.
    Type: Grant
    Filed: June 14, 2010
    Date of Patent: June 7, 2016
    Assignee: Amkor Technology, Inc.
    Inventors: Sung Sun Park, Ik Su Jun, Do Won Lee
  • Semiconductor device with electromagnetic interference shielding
    Patent number: 8362598
    Abstract: In accordance with the present invention, there is provided a quad flat no leads (QFN) semiconductor device or package including a leadframe wherein the leads of the leadframe are selectively formed so that portions one or more prescribed leads are exposed in a package body of the semiconductor package and electrically connected to an electromagnetic interference (EMI) shielding layer applied to the package body. In certain embodiments of the present invention, one or more tie bars of the leadframe may also be formed so as to be exposed in the package body of the semiconductor package and electrically connected to the shielding layer applied to the package body. Thus, in the present invention, the shielding layer may be electrically connected to one or more leads alone or in combination with one or more tie bars of the leadframe.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: January 29, 2013
    Inventors: Sung Sun Park, Ik Su Jun, Ye Sul Ahn
  • SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
    Publication number: 20110049685
    Abstract: In accordance with the present invention, there is provided a quad flat no leads (QFN) semiconductor device or package including a leadframe wherein the leads of the leadframe are selectively formed so that portions one or more prescribed leads are exposed in a package body of the semiconductor package and electrically connected to an electromagnetic interference (EMI) shielding layer applied to the package body. In certain embodiments of the present invention, one or more tie bars of the leadframe may also be formed so as to be exposed in the package body of the semiconductor package and electrically connected to the shielding layer applied to the package body. Thus, in the present invention, the shielding layer may be electrically connected to one or more leads alone or in combination with one or more tie bars of the leadframe.
    Type: Application
    Filed: August 26, 2009
    Publication date: March 3, 2011
    Inventors: Sung Sun Park, Ik Su Jun, Ye Sul Ahn