Patents by Inventor Ikkou Hanaki

Ikkou Hanaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090149602
    Abstract: A release resin composition that is excellent in thermal stability, for example, during extrusion molding and does not cause problems such as smoking and foaming during preparation of a compound product or extrusion molding and further does not contaminate metal rollers. The release resin composition can be formed into a release layer that does not cause migration of impurities to an adhesive layer being in direct contact with the release layer and therefore does not decrease the adhesive properties of the adhesive layer. The release resin composition includes a release agent (A) of which main component is a polymer compound having a weight average molecular weight of 10000 to 1000000 and containing an aliphatic group having 8 to 30 carbon atoms and includes a thermoplastic polymer (B) containing an olefin monomer and/or a polar monomer as a constitutional unit, wherein the amount of the release agent (A) is 0.1 to 20 parts by weight to 100 parts by weight of the thermoplastic polymer (B).
    Type: Application
    Filed: January 30, 2007
    Publication date: June 11, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Maki Saitou, Shinichirou Kanai, Motohiro Seki, Satoru Yamamoto, Ikkou Hanaki, Keiji Hayashi, Kazuhito Okumura
  • Publication number: 20090123740
    Abstract: The object of the present invention is provision of a surface protection sheet for laser processing to be applied to the surface on the opposite side of the laser beam irradiation face, which can protect the surface of an application object, and does not allow easy development of a dross during laser cutting processing. According to the present invention, a surface protection sheet 1 for laser processing to be applied to the surface on the opposite side of the laser beam irradiation face 2a of a workpiece 2 during a cutting process by irradiation of a laser beam 6 on the workpiece 2 is provided, which contains a substrate layer and an adhesive layer formed on one surface of the substrate layer, wherein the substrate layer is made of a resin material having a melt viscosity measured based on JIS K7199 (1999) at 290° C. of not more than 200 Pa·s, and has a thickness of 0.01-0.12 mm.
    Type: Application
    Filed: June 27, 2006
    Publication date: May 14, 2009
    Inventors: Ikkou Hanaki, Keiji Hayashi, Kazuhito Okumura