Patents by Inventor Ikumi TOKUDA
Ikumi TOKUDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240175140Abstract: What is provided is a surface-treated steel sheet including a steel sheet, a zinc-based plated layer formed on a surface of the steel sheet, and a chemical conversion treatment layer formed on a surface of the zinc-based plated layer, in which the chemical conversion treatment layer contains Si, C, O and P, the chemical conversion treatment layer has a C concentration of 20.0 mass % or more, an O concentration of 15.0 mass % or more, a Si concentration of 10.0 mass % or more, and a P concentration of 0.Type: ApplicationFiled: March 29, 2022Publication date: May 30, 2024Applicant: NIPPON STEEL CORPORATIONInventors: Atsuo SHIMIZU, Ikumi TOKUDA, Hiromasa SHOJI
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Patent number: 11965249Abstract: A surface-treated metal material includes a metal sheet, a plating layer formed on the metal sheet and containing aluminum, magnesium, and zinc, and a composite coating formed on a surface of the plating layer, the composite coating including an organic silicon compound, one or two of a zirconium compound and a titanium compound, a phosphoric acid compound, a fluorine compound, and a vanadium compound, wherein, when a surface of the composite coating is analyzed at a spot size of ?30 ?m using micro-fluorescent X-rays, a maximum value of V/Zn, which is a mass ratio of a V content to a Zn content, is 0.010 to 0.100.Type: GrantFiled: March 19, 2020Date of Patent: April 23, 2024Assignee: NIPPON STEEL CORPORATIONInventors: Hiromasa Shoji, Kiyokazu Ishizuka, Kohei Tokuda, Mamoru Saito, Yasuto Goto, Ikumi Tokuda
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Publication number: 20240044013Abstract: This surface-treated steel sheet includes: a steel sheet; a Zn-based plating layer formed on the steel sheet; and a coating formed on the Zn-based plating layer, in which a Si concentration, a P concentration, a F concentration, a V concentration, a Zr concentration, a Zn concentration, and an Al concentration of the coating are, by mass %, Si: 10.00% to 25.00%, P: 0.01% to 5.00%, F: 0.01% to 2.00%, V: 0.01% to 4.00%, Zr: 0.01% to 3.00%, Zn: 0% to 3.00%, and Al: 0% to 3.00%, in a narrow spectrum of 5i2p obtained by performing XP S analysis on a surface of the coating, a ratio of an integrated intensity of a peak having a local, maximum value, at 103.37±0.25 eV to an integrated intensity of a peak having a local maximum value at 102.26±0.25 eV is 0.04 or more and 0.25 or less.Type: ApplicationFiled: January 6, 2022Publication date: February 8, 2024Applicant: NIPPON STEEL CORPORATIONInventors: Atsuo SHIMIZU, Ikumi TOKUDA, Hiromasa SHOJI, Koji AKIOKA
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Publication number: 20220145473Abstract: A surface-treated metal material includes a metal sheet, a plating layer formed on the metal sheet and containing aluminum, magnesium, and zinc, and a composite coating formed on a surface of the plating layer, the composite coating including an organic silicon compound, one or two of a zirconium compound and a titanium compound, a phosphoric acid compound, a fluorine compound, and a vanadium compound, wherein, when a surface of the composite coating is analyzed at a spot size of ?30 ?m using micro-fluorescent X-rays, a maximum value of V/Zn, which is a mass ratio of a V content to a Zn content, is 0.010 to 0.100.Type: ApplicationFiled: March 19, 2020Publication date: May 12, 2022Applicant: NIPPON STEEL CORPORATIONInventors: Hiromasa SHOJI, Kiyokazu ISHIZUKA, Kohei TOKUDA, Mamoru SAITO, Yasuto GOTO, Ikumi TOKUDA
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Publication number: 20210344307Abstract: A load detection circuit includes a first detection part and a second detection part. The first detection part includes a first capacitor and a second capacitor, forms capacitive coupling with a signal transmission line connecting an output port of an RF amplifier and a load, and outputs a first signal. The second detection part includes a first inductor and a second inductor, forms inductive coupling with the signal transmission line, and outputs a second signal.Type: ApplicationFiled: April 28, 2021Publication date: November 4, 2021Inventor: Ikumi TOKUDA
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Patent number: 10439562Abstract: Temperature compensation circuits and methods for adjusting one or more circuit parameters of a power amplifier (PA) to maintain approximately constant Gain versus time during pulsed operation sufficient to substantially offset self-heating of the PA. Some embodiments compensate for PA Gain “droop” due to self-heating using a Sample and Hold (S&H) circuit. Other embodiments include bias compensation circuits that directly regulate a bias signal to an amplifier stage as a function of localized heating of one or more of amplifier stages. Such bias compensation circuits include physical placement of at least one bias compensation circuit element in closer proximity to at least one amplifier stage than other bias compensation circuit elements. One bias compensation circuit embodiment includes a temperature-sensitive current mirror circuit for regulating the bias signal.Type: GrantFiled: February 28, 2018Date of Patent: October 8, 2019Assignee: pSemi CorporationInventors: Ikumi Tokuda, Tero Tapio Ranta, Keith Bargroff, Christopher C. Murphy, Robert Mark Englekirk
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Publication number: 20180262163Abstract: Temperature compensation circuits and methods for adjusting one or more circuit parameters of a power amplifier (PA) to maintain approximately constant Gain versus time during pulsed operation sufficient to substantially offset self-heating of the PA. Some embodiments compensate for PA Gain “droop” due to self-heating using a Sample and Hold (S&H) circuit. Other embodiments include bias compensation circuits that directly regulate a bias signal to an amplifier stage as a function of localized heating of one or more of amplifier stages. Such bias compensation circuits include physical placement of at least one bias compensation circuit element in closer proximity to at least one amplifier stage than other bias compensation circuit elements. One bias compensation circuit embodiment includes a temperature-sensitive current mirror circuit for regulating the bias signal.Type: ApplicationFiled: February 28, 2018Publication date: September 13, 2018Inventors: Ikumi Tokuda, Tero Tapio Ranta, Keith Bargroff, Christopher C. Murphy, Robert Mark Englekirk
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Patent number: 10033006Abstract: A transparent electrode includes a conductive polymer layer, and plural carbon fibers having a diameter larger than the thickness of the conductive polymer layer, in which the carbon fibers are partially embedded in the conductive polymer layer. An organic electronic device includes the transparent electrode.Type: GrantFiled: April 6, 2015Date of Patent: July 24, 2018Assignee: Nippon Steel & Sumitomo Metal CorporationInventors: Ikumi Tokuda, Taihei Kaneto
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Publication number: 20170125713Abstract: A transparent electrode includes a conductive polymer layer, and plural carbon fibers having a diameter larger than the thickness of the conductive polymer layer, in which the carbon fibers are partially embedded in the conductive polymer layer. An organic electronic device includes the transparent electrode.Type: ApplicationFiled: April 6, 2015Publication date: May 4, 2017Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATIONInventors: Ikumi TOKUDA, Taihei KANETO