Patents by Inventor Ikuo Itakura
Ikuo Itakura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11410868Abstract: An electrostatic chuck includes: an electrically-conductive base plate including a first part, a second part at an outer circumference of the first part, and a gas inlet path for introducing a cooling gas; a first electrostatic chuck part configured to clamp a wafer on the first part, including a ceramic dielectric substrate that includes an embedded first clamping electrode and at least one through-hole communicating with the gas inlet path; and a second electrostatic chuck part configured to clamp a focus ring on the second part, including a ceramic layer that includes at least one through-hole for introducing a cooling gas and that includes at least a first layer contacting the focus ring when the second electrostatic chuck part clamps the focus ring, in which the first layer is less dense than the ceramic dielectric substrate. Thereby, the electrostatic chuck can increase the device yield.Type: GrantFiled: February 19, 2021Date of Patent: August 9, 2022Assignee: Toto Ltd.Inventors: Masaki Sato, Ikuo Itakura, Shuichiro Saigan, Jun Shiraishi, Yutaka Momiyama, Kouta Kobayashi
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Patent number: 11380574Abstract: An electrostatic chuck includes: an electrically-conductive base plate including a first part, a second part at an outer circumference of the first part, and a gas inlet path for introducing a cooling gas; a first electrostatic chuck part configured to clamp a wafer on the first part, including a ceramic dielectric substrate that includes an embedded first clamping electrode and at least one through-hole communicating with the gas inlet path; and a second electrostatic chuck part configured to clamp a focus ring on the second part, including a ceramic layer that includes at least one through-hole for introducing a cooling gas and that includes at least a first layer contacting the focus ring when the second electrostatic chuck part clamps the focus ring, in which the first layer is less dense than the ceramic dielectric substrate. Thereby, the electrostatic chuck can increase the device yield.Type: GrantFiled: February 19, 2021Date of Patent: July 5, 2022Assignee: Toto Ltd.Inventors: Masaki Sato, Ikuo Itakura, Shuichiro Saigan, Jun Shiraishi, Yutaka Momiyama, Kouta Kobayashi
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Publication number: 20210175109Abstract: An electrostatic chuck includes: an electrically-conductive base plate including a first part, a second part at an outer circumference of the first part, and a gas inlet path for introducing a cooling gas; a first electrostatic chuck part configured to clamp a wafer on the first part, including a ceramic dielectric substrate that includes an embedded first clamping electrode and at least one through-hole communicating with the gas inlet path; and a second electrostatic chuck part configured to clamp a focus ring on the second part, including a ceramic layer that includes at least one through-hole for introducing a cooling gas and that includes at least a first layer contacting the focus ring when the second electrostatic chuck part clamps the focus ring, in which the first layer is less dense than the ceramic dielectric substrate. Thereby, the electrostatic chuck can increase the device yield.Type: ApplicationFiled: February 19, 2021Publication date: June 10, 2021Inventors: Masaki SATO, Ikuo ITAKURA, Shuichiro SAIGAN, Jun SHIRAISHI, Yutaka MOMIYAMA, Kouta KOBAYASHI
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Patent number: 11018039Abstract: According to the embodiment, the electrostatic chuck includes a ceramic dielectric substrate having a first major surface and a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface and being opposite to the gas introduction path. The ceramic dielectric substrate includes a first hole part positioned between the first major surface and the first porous part. At least one of the ceramic dielectric substrate or the first porous part includes a second hole part positioned between the first hole part and the first porous part, and a dimension of the second hole part is smaller than a dimension of the first porous part and larger than a dimension of the first hole part.Type: GrantFiled: March 14, 2019Date of Patent: May 25, 2021Assignee: Toto Ltd.Inventors: Kosuke Yamaguchi, Jun Shiraishi, Ikuo Itakura, Yutaka Momiyama, Shuichiro Saigan
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Patent number: 10923383Abstract: According to the embodiment, an electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing a suction object, a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface of the ceramic dielectric substrate and being opposite to the gas introduction path. The first porous part includes a first region positioned on the ceramic dielectric substrate side. The ceramic dielectric substrate includes a first substrate region positioned on the first region side. The first region and the first substrate region are provided in contact with each other, and an average particle diameter in the first region is different from an average particle diameter in the first substrate region.Type: GrantFiled: March 14, 2019Date of Patent: February 16, 2021Assignee: Toto Ltd.Inventors: Takara Katayama, Kosuke Yamaguchi, Ikuo Itakura, Yutaka Momiyama, Jun Shiraishi, Shuichiro Saigan
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Patent number: 10497600Abstract: According to the embodiment, the first invention relates to an electrostatic chuck. The electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing a suction object and a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface and being opposite to the gas introduction path. The first porous part includes sparse portions including pores and a dense portion having a density higher than a density of the sparse portions. Each of the sparse portions extends from the base plate toward the ceramic dielectric substrate. The dense portion is positioned between the sparse portions. The sparse portions include a wall portion provided between the pores and the pores.Type: GrantFiled: March 13, 2019Date of Patent: December 3, 2019Assignee: Toto Ltd.Inventors: Kosuke Yamaguchi, Jun Shiraishi, Ikuo Itakura, Yutaka Momiyama, Shuichiro Saigan
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Publication number: 20190287840Abstract: According to the embodiment, an electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing a suction object, a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface of the ceramic dielectric substrate and being opposite to the gas introduction path. The first porous part includes a first region positioned on the ceramic dielectric substrate side. The ceramic dielectric substrate includes a first substrate region positioned on the first region side. The first region and the first substrate region are provided in contact with each other, and an average particle diameter in the first region is different from an average particle diameter in the first substrate region.Type: ApplicationFiled: March 14, 2019Publication date: September 19, 2019Inventors: Takara KATAYAMA, Kosuke YAMAGUCHI, Ikuo ITAKURA, Yutaka MOMIYAMA, Jun SHIRAISHI, Shuichiro SAIGAN
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Publication number: 20190287838Abstract: According to the embodiment, the first invention relates to an electrostatic chuck. The electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing a suction object and a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface and being opposite to the gas introduction path. The first porous part includes sparse portions including pores and a dense portion having a density higher than a density of the sparse portions. Each of the sparse portions extends from the base plate toward the ceramic dielectric substrate. The dense portion is positioned between the sparse portions. The sparse portions include a wall portion provided between the pores and the pores.Type: ApplicationFiled: March 13, 2019Publication date: September 19, 2019Inventors: Kosuke YAMAGUCHI, Jun SHIRAISHI, Ikuo ITAKURA, Yutaka MOMIYAMA, Shuichiro SAIGAN
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Publication number: 20190287839Abstract: According to the embodiment, the electrostatic chuck includes a ceramic dielectric substrate having a first major surface and a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface and being opposite to the gas introduction path. The ceramic dielectric substrate includes a first hole part positioned between the first major surface and the first porous part. At least one of the ceramic dielectric substrate or the first porous part includes a second hole part positioned between the first hole part and the first porous part, and a dimension of the second hole part is smaller than a dimension of the first porous part and larger than a dimension of the first hole part.Type: ApplicationFiled: March 14, 2019Publication date: September 19, 2019Inventors: Kosuke YAMAGUCHI, Jun SHIRAISHI, Ikuo ITAKURA, Yutaka MOMIYAMA, Shuichiro SAIGAN
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Patent number: 8848335Abstract: An electrostatic chuck includes: a ceramic substrate; a ceramic dielectric body provided on a top side of the ceramic substrate and having a first major surface where a processing target substrate is to be mounted; and an electrode provided between the ceramic substrate and the ceramic dielectric body. A material of the ceramic dielectric body is a ceramic sintered body. A plurality of protrusions and a groove for supplying a gas are provided on the first major surface of the ceramic dielectric body. A through hole is provided in a bottom face of the groove, the through hole penetrating to a second major surface of the ceramic substrate on a side opposite to the first major surface. A distance between the electrode and the groove is greater than or equal to a distance between the electrode and the first major surface.Type: GrantFiled: March 23, 2011Date of Patent: September 30, 2014Assignee: Toto Ltd.Inventors: Hiroaki Hori, Ikuo Itakura, Kazuki Anada
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Publication number: 20130093145Abstract: An electrostatic chuck comprises a ceramic dielectric body having an electrode formed on a surface of the ceramic dielectric body; a ceramic substrate supporting the ceramic dielectric body; and a first bonding agent bonding the ceramic dielectric body to the ceramic substrate. The first bonding agent has a first major agent including an organic material, a first amorphous filler including an inorganic material, and a first spherical filler including an inorganic material. The first amorphous filler and the first spherical filler are dispersion-compounded in the first major agent. The first major agent, the first amorphous filler, and the first spherical filler are made of an electrically insulating material. An average diameter of the first spherical filler is greater than a maximum value of a minor axis of all of the first amorphous filler. A thickness of the first bonding agent is equal to or greater than the average diameter of the first spherical filler.Type: ApplicationFiled: March 23, 2011Publication date: April 18, 2013Applicant: TOTO LTD.Inventors: Hiroaki Hori, Hiroki Matsui, Ikuo Itakura
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Publication number: 20130026720Abstract: An electrostatic chuck comprises: a ceramic plate provided with recesses on a major surface and provided with an electrode in an inner part of the ceramic plate; a temperature regulating plate bonded to the major surface of the ceramic plate; a first bonding agent provided between the ceramic plate and the temperature regulating plate; and a heater provided in the each of the recesses of the ceramic plate. The first bonding agent has a first major agent including an organic material, a first amorphous filler including an inorganic material, and a first spherical filler including an inorganic material. The first amorphous filler and the first spherical filler are dispersion-compounded into the first major agent. The first major agent, the first amorphous filler, and the first spherical filler are made of an electrically insulating material. An average diameter of the first spherical filler is greater than a maximum value of a minor axis of the first amorphous filler.Type: ApplicationFiled: March 23, 2011Publication date: January 31, 2013Applicant: TOTO LTD.Inventors: Hiroaki Hori, Shunpei Kondo, Yuki Anai, Ikuo Itakura, Takeshi Uchimura, Kazuki Anada
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Publication number: 20130027838Abstract: An electrostatic chuck includes: a ceramic substrate; a ceramic dielectric body provided on a top side of the ceramic substrate and having a first major surface where a processing target substrate is to be mounted; and an electrode provided between the ceramic substrate and the ceramic dielectric body. A material of the ceramic dielectric body is a ceramic sintered body. A plurality of protrusions and a groove for supplying a gas are provided on the first major surface of the ceramic dielectric body. A through hole is provided in a bottom face of the groove, the through hole penetrating to a second major surface of the ceramic substrate on a side opposite to the first major surface. A distance between the electrode and the groove is greater than or equal to a distance between the electrode and the first major surface.Type: ApplicationFiled: March 23, 2011Publication date: January 31, 2013Applicant: TOTO LTD.Inventors: Hiroaki Hori, Ikuo Itakura, Kazuki Anada
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Patent number: 7760484Abstract: The present invention provides an electrostatic chuck, which has high plasma resistance and high capability of cooling a material to be clamped. As for the basic structure of the electrostatic chuck, an insulating film is formed on a surface of a metal plate by flame spraying, and a dielectric substrate is bonded onto the insulating film by an insulating adhesive layer. The top surface of the dielectric substrate is a surface for mounting a material to be clamped W such as a semiconductor wafer. Electrodes are formed on the lower surface of the dielectric substrate.Type: GrantFiled: July 7, 2008Date of Patent: July 20, 2010Assignee: Toto Ltd.Inventors: Ikuo Itakura, Syouichiro Himuro
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Patent number: 7672111Abstract: An electrostatic chuck includes: a metal plate with an insulator film formed on a surface thereof by thermal spraying; and a dielectric substrate with an electrode formed on a surface thereof. The metal plate and the dielectric substrate are bonded together via an insulative adhesive interposed therebetween so that the insulator film is opposed to the electrode, and the insulator film has a thickness of 0.6 mm or less. Alternatively, An electrostatic chuck includes: a metal plate with an insulator film formed on a surface thereof by thermal spraying; and a dielectric substrate with an electrode selectively formed on a surface thereof. The metal plate and the dielectric substrate are bonded together via an insulative adhesive interposed therebetween so that the insulator film is opposed to the electrode.Type: GrantFiled: November 29, 2007Date of Patent: March 2, 2010Assignee: Toto Ltd.Inventors: Jun Miyaji, Ikuo Itakura, Shoichiro Himuro
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Patent number: 7468880Abstract: The object of the present invention is to provide an electrostatic chuck which has high plasma resistance and high capability of cooling a material to be clamped. As for the basic structure of the electrostatic chuck, an insulating film is formed on a surface of a metal plate by flame spraying, and a dielectric substrate is bonded onto the insulating film by an insulating adhesive layer. The top surface of the dielectric substrate is a surface for mounting a material to be clamped W such as a semiconductor wafer. Electrodes are formed on the lower surface of the dielectric substrate.Type: GrantFiled: December 13, 2005Date of Patent: December 23, 2008Assignee: Toto Ltd.Inventors: Ikuo Itakura, Syouichiro Himuro
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Publication number: 20080273284Abstract: The present invention provides an electrostatic chuck, which has high plasma resistance and high capability of cooling a material to be clamped. As for the basic structure of the electrostatic chuck, an insulating film is formed on a surface of a metal plate by flame spraying, and a dielectric substrate is bonded onto the insulating film by an insulating adhesive layer. The top surface of the dielectric substrate is a surface for mounting a material to be clamped W such as a semiconductor wafer. Electrodes are formed on the lower surface of the dielectric substrate.Type: ApplicationFiled: July 7, 2008Publication date: November 6, 2008Applicant: Toto Ltd.Inventors: Ikuo Itakura, Syouichiro Himuro
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Publication number: 20080212255Abstract: An electrostatic chuck includes: a metal plate with an insulator film formed on a surface thereof by thermal spraying; and a dielectric substrate with an electrode formed on a surface thereof. The metal plate and the dielectric substrate are bonded together via an insulative adhesive interposed therebetween so that the insulator film is opposed to the electrode, and the insulator film has a thickness of 0.6 mm or less. Alternatively, An electrostatic chuck includes: a metal plate with an insulator film formed on a surface thereof by thermal spraying; and a dielectric substrate with an electrode selectively formed on a surface thereof. The metal plate and the dielectric substrate are bonded together via an insulative adhesive interposed therebetween so that the insulator film is opposed to the electrode.Type: ApplicationFiled: November 29, 2007Publication date: September 4, 2008Applicant: Toto Ltd.Inventors: Jun Miyaji, Ikuo Itakura, Shoichiro Himuro
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Publication number: 20060268491Abstract: The object of the present invention is to provide an electrostatic chuck which has high plasma resistance and high capability of cooling a material to be clamped. As for the basic structure of the electrostatic chuck, an insulating film is formed on a surface of a metal plate by flame spraying, and a dielectric substrate is bonded onto the insulating film by an insulating adhesive layer. The top surface of the dielectric substrate is a surface for mounting a material to be clamped W such as a semiconductor wafer. Electrodes are formed on the lower surface of the dielectric substrate.Type: ApplicationFiled: December 13, 2005Publication date: November 30, 2006Applicant: TOTO LTD.Inventors: Ikuo Itakura, Syouichiro Himuro