Patents by Inventor Ikusi Morizaki

Ikusi Morizaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked carrier three-dimensional memory module and semiconductor device using the same
    Patent number: 5973392
    Abstract: A three-dimensional memory module includes a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by a bump connecting method. Each of the plurality of semiconductor device units includes a carrier having a circuit pattern and the through-holes connected to the circuit pattern. The semiconductor device unit also includes at least one semiconductor memory chip mounted on the carrier such that the semiconductor memory chip is connected to the circuit pattern, and at least one chip select semiconductor chip mounted on the carrier to be connected to the circuit pattern such that the chip select semiconductor chip can select the semiconductor memory chip.
    Type: Grant
    Filed: March 3, 1998
    Date of Patent: October 26, 1999
    Assignee: NEC Corporation
    Inventors: Naoji Senba, Yuzo Shimada, Ikusi Morizaki, Hideki Kusamitu, Makoto Ohtsuka, Katsumasa Hashimoto