Patents by Inventor Il-gu Kim

Il-gu Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240161588
    Abstract: An apparatus for providing haptic stimulation includes an ultrasonic actuator configured to provide haptic stimulation to a part of a body located at a target location by generating an ultrasonic signal, and forming sound pressure at the target location via the generated ultrasonic signal; an object sensor provided around the ultrasonic actuator and configured to detect an object within a region between the ultrasonic actuator and the target location; and a control module configured to stop operation of the ultrasonic actuator based on detecting the object within the region is sensed.
    Type: Application
    Filed: April 21, 2023
    Publication date: May 16, 2024
    Inventors: Jang Hyeon Lee, Il Seon Yoo, Dae Sung Kwon, Dong Gu Kim, Hyun Soo Kim
  • Patent number: 11981236
    Abstract: A convertible seat for a vehicle includes a base frame having a predetermined dimension of storage space, a plurality of individual blocks disposed to be ascendable and descendable in the storage space of the base frame and configured to serve as a seatback and a seat cushion, and a raising and lowering drive device installed in each of the individual blocks and configured to raise or lower a corresponding one of the individual blocks so that a seat position can be changed into various forms.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: May 14, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Jang Hyeon Lee, Dae Sung Kwon, Dong Gu Kim, Il Seon Yoo
  • Patent number: 11952652
    Abstract: Provided is a method of manufacturing a zinc-plated steel sheet. The method includes: coating a metal on the steel sheet on a steel sheet; annealing the metal coated steel sheet; and zinc plating the annealed steel sheet by dipping in a molten zinc plating bath. Further provided is a method of manufacturing a hot-press part including: coating a metal on the steel sheet on a steel sheet; annealing the metal coated steel sheet; zinc plating the annealed steel sheet by dipping in a molten zinc plating bath; heating the zinc-plated steel sheet; and press forming the heated steel sheet.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: April 9, 2024
    Assignee: POSCO CO., LTD
    Inventors: Il-Ryoung Sohn, Jong-Sang Kim, Joong-Chul Park, Yeol-Rae Cho, Jin-Keun Oh, Han-Gu Cho, Bong-Hoon Chung, Jong-Seog Lee
  • Patent number: 11956781
    Abstract: A method and apparatus of accessing a channel in a wireless local area network is provided. A destination station receives a request to send (RTS) frame to allocate a network allocation vector from a source station over a first bandwidth and transmits a clear to send (CTS) frame over a second bandwidth to the source station in response to the RTS frame. The second bandwidth is dynamically determined when a first parameter has a predetermined value.
    Type: Grant
    Filed: December 6, 2020
    Date of Patent: April 9, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Il-Gu Lee, Sok-Kyu Lee, Hyun-Kyu Chung, Dae-Sik Kim
  • Patent number: 11911749
    Abstract: Provided are a chromium catalyst precursor, an ethylene oligomerization catalyst including the same, and a method of preparing an ethylene oligomer using the same. More particularly, a chromium catalyst precursor which may oligomerize ethylene with high activity and high selectivity in spite of not using methylaluminoxane (MAO) or modified-methylaluminoxane (MMAO), an oligomerization catalyst including the same, and a method of preparing an ethylene oligomer using the same are provided.
    Type: Grant
    Filed: August 18, 2022
    Date of Patent: February 27, 2024
    Assignee: SK Innovation Co., Ltd.
    Inventors: Il Gu Jung, Hyo Seung Park, Jun Soo Son, Myung Jin Kim, Jong Chan Kim
  • Patent number: 6372616
    Abstract: A method of manufacturing an electrical interconnection of a semiconductor device produces an erosion protecting plug in a contact hole to protect a selected portion of an interlayer dielectric layer when the interlayer dielectric layer is being etched to form a recess for a conductive line. The contact hole is formed in the interlayer dielectric layer. The contact hole is filled with an organic material to form the erosion protecting plug. The organic material is a photoresist material or an organic polymer. A photoresist pattern is formed for exposing the erosion protecting plug and a portion of the interlayer dielectric layer adjacent to the erosion protecting plug. A recess which extends down to the contact hole is formed by etching the portion of the interlayer dielectric layer which is exposed by the photoresist pattern. The erosion protecting plug and the photoresist pattern are then removed. A conductive line filling the recess and a contact filling the contact hole are then formed.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: April 16, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bong-young Yoo, Hyeon-deok Lee, Il-gu Kim